Current requirement of nonvolatile memory (NVM) are high density cell, low-power wastage, high speed operation, and good reliability for the scaling down device. In a conventional nonvolatile memory, once the tunnel oxide develops a leaky path under repeated write/erase operation, all the stored charge will be lost. Therefore, the tunnel oxide thickness is incapable to scale down in terms of charge retention and endurance characteristics. Therefore conventional floating gate (FG) nonvolatile memories (NVMs) present critical issues on device scalability beyond the sub-50nm node. The nonvolatile nanocrystal memories are one of promising candidates to substitute for the conventional floating gate (FG) memories, because the nanocrystal memories storage charge by separated node. So it is not major influence of charge lost from partial oxide layer. The thickness of tunnel oxide can be reduce also can maintain good retention, therefore it is key to lowering operating voltages and increasing operating speeds. Also reduce device to increasing the density of device.
The advantages of metal nano-dot compared with other material counterparts include stronger coupling with the conduction channel, a wide range of available work functions, and higher density of states around the Fermi level. Because these advantages. It is possibility of metal nanocrystals nonvolatile memory fabricated in industry in practice.
In this thesis, an ease and low temperature fabrication technique of Co-Si-N nanocrystals was demonstrated for the application of nonvolatile memory. The nonvolatile memory structure of Co-Si-N nanocrystals embedded in the SiOx layer was fabricated by sputtering a co-mix target (CoSi2) in an Ar/N2 environment at room temperature. It can be considered that the nitrogen plays a critical role during sputter process for the formation of nanocrystal. In addition, the high density (~1012 cm-2) nanocrystal can be simple and uniform to be fabricated in our study. We also proposed a formation of Co-Si-N nanocrystals by sputtering a co-mix target (CoSi2) in the Ar/NH3 environment at room temperature. It was also found that high density Ni-Si-N nanocrystals embedded in the silicon nitride (SiNx) and larger memory effect.
A rapid thermal annealing (RTA) with process temperature at 700¢XC¡B800¢XC and short duration (60sec) was used to form nanocrystals. The charge storage layer of nanorystals embedded in SiNx shows larger memory window and better reliability over nanocrystals embedded in SiOx, due to different distributions of electronic field .
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0625109-164230 |
| Date | 25 June 2009 |
| Creators | Liu, Tzu-Chia |
| Contributors | Ting-Chang Chang, Tzu-Ming Cheng, Cheng-Tung Huang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0625109-164230 |
| Rights | campus_withheld, Copyright information available at source archive |
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