The joint strength and microsturcture for fluxless AuSn solders in packaging of InP substrate onto Si submount after thermal-aging testing were studied experimentally. Specimens were aged at 150¢XC for up to 64days. The joint strength decreased as aging time increased. Under the 64days aging,the bonding strength of AuSn solders decreased from 195g to 125g. This matches to the ¡§MIL-STD-METHOD 2019.7¡¨ which is the minimum bonding strength of 93g.
The microstructure of the AuSn solders joint showed the joint strength decrease was caused by the enlargement of the initial voids and an increase in the thickness of intermetallic compound(IMC). The effect of temperature cycle testing on the power variation of 1550nm laser chips using fluxless AuSn solders in laser diode packages was also studied. The temperature cycle testing was from -20¢XC to +100¢XC within a cycle of 110 minutes. It was shown that the 1550nm laser diodes operated in the stable condition up to 300 cylces.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0712104-174412 |
| Date | 12 July 2004 |
| Creators | Ho, Yi-hsing |
| Contributors | Wen-Jeng Ho, Ker-Chang Hsieh, Sheng-Lung Huang, Wood-Hi Cheng, Maw-Tyan Sheen |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0712104-174412 |
| Rights | campus_withheld, Copyright information available at source archive |
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