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Interfacial Reactions of Sn-Ag-Cu Solder Ballin BGA Package at 175¢J aging

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Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0714106-172404
Date14 July 2006
CreatorsWang, Hsin-I
ContributorsKer-Chang Hsieh, Po-We Kao, Der shin Gan
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0714106-172404
Rightsnot_available, Copyright information available at source archive

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