Generally speaking , high volumetric content of particles and well-dispersed condition in the metallic matrix are the purposes in composite electrodeposition for different applications. The composite electrodeposition layer by EPD has high volumetric content of particles but low structure strength. The composite electrodeposition layer by ELD has tight structure but low volumetric content of particles . In this study combines EPD and ELD to produce the composite electrodeposition layer in ELD-EPD-ELD three steps. We hope to combine their advantages .In this study ,we first look for the best operating condition of EPD, then increase the volumetric content of particles with ELD-EPD-ELD(ELEPIS). Finally, it was examined by scratch test to prove the structure strength.
By the result of experiment, it can be known that at the voltage 10V,the concentration 100g/L,stirring speed 50rpm is the best operating condition. In the process of ELEPIS, we find that Ni ions permeate into the second layer. In this method, we can produce the electrodeposition layer which of the volumetric content of particles is 4 times the traditional electrodeposition layer. We also propose the possibility of multi-storey ELEPIS composite electrodeposition layer.
Finally, by the result of scratch test , it can be known that there are the least cracks in the scratch which of the electrodeposition layer by ELEPIS. Its depth is shallowest and its width is narrowest. It shows that the sample by ELEPIS has excellent performance in structure strength and binding with substrate.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0725105-161619 |
| Date | 25 July 2005 |
| Creators | Chen, Ming-Jen |
| Contributors | R.T.Lee, Y.R.Jeng, J.F.Lin, Y.C.Chiou |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725105-161619 |
| Rights | not_available, Copyright information available at source archive |
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