This study presents thin film transistor (TFT) electrode structures in flat panel displays by imprint and electroless silver plating techniques. Imprint technique
is not limited to the physical properties of optical lithography. In the imprinting process, the glass mold designed for imprinting process is fabricated by semiconductor manufacturing technology to imprint photoresist (AZ-650). The material is evaluated for imprint process. In addition, at present, electrode
materials used in TFT process are aluminum (Al), chromium (Cr) and so on. In other research, the thin film plating technique adopts sputtering process to manufacture TFT electrode structures. This study uses electroless silver plating process to fabricate TFT electrode structures. The experimental result shows that the silver film can be deposited on the glass wafer by electroless plating,
The mechanical properties of the silver films such as hardness, coefficient of elasticity and Young¡¦s module are measured by nanoindentation system,compared with the bulk materials.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0726105-170717 |
| Date | 26 July 2005 |
| Creators | Sher, Kun-Lin |
| Contributors | Cheng-Tang Pan, Yu-Rung Hsu, Chien-Hsiang Chao, Chi-Hui Chien |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726105-170717 |
| Rights | campus_withheld, Copyright information available at source archive |
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