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A Multiscale Finite Element Modeling Approach for Thermal Management in Heterogeneous Integrated Circuits

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1. http://rave.ohiolink.edu/etdc/view?acc_num=osu155507820020889

Identifer	oai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:osu155507820020889
Date	03 July 2019
Creators	Bonavita, Peter J.
Publisher	The Ohio State University / OhioLINK
Source Sets	Ohiolink ETDs
Language	English
Detected Language	English
Type	text
Source	http://rave.ohiolink.edu/etdc/view?acc_num=osu155507820020889
Rights	unrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.