by Yeung, Lap Kun. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2002. / Includes bibliographical references (leaves 96-98). / Abstracts in English and Chinese. / Abstract --- p.ii / Acknowledgements --- p.iv / Table of Contents --- p.v / Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- Emergence of LTCC Technology --- p.1 / Chapter 1.2 --- Overview of the Work --- p.2 / Chapter 1.3 --- Original Contributions --- p.3 / Chapter 1.4 --- Thesis Organization --- p.4 / Chapter 2 --- Fundamentals of Partial Element Equivalent Circuit Modeling --- p.5 / Chapter 2.1 --- Introduction --- p.5 / Chapter 2.2 --- PEEC Formulation --- p.6 / Chapter 2.2.1 --- Mixed potential integral equation --- p.6 / Chapter 2.2.2 --- Current discretization --- p.7 / Chapter 2.2.3 --- Charge discretization --- p.8 / Chapter 2.2.4 --- Galerkin matching --- p.9 / Chapter 2.3 --- Partial Inductance --- p.11 / Chapter 2.4 --- Partial Capacitance --- p.12 / Chapter 2.5 --- Meshing Scheme and Circuit Interpretation --- p.13 / Chapter 2.6 --- Summary --- p.15 / Chapter 3 --- PEEC Modeling of LTCC RF Circuits using Thin-film Approximation --- p.16 / Chapter 3.1 --- Introduction --- p.16 / Chapter 3.2 --- A Simple LTCC Band-pass Filter --- p.17 / Chapter 3.3 --- Discretization Scheme --- p.18 / Chapter 3.4 --- Quasi-static Green's Functions --- p.21 / Chapter 3.4.1 --- Free-space Green's function --- p.21 / Chapter 3.4.2 --- System with a single ground plane --- p.22 / Chapter 3.4.3 --- System with two ground planes --- p.25 / Chapter 3.5 --- Complex-Image Analysis --- p.25 / Chapter 3.6 --- Partial Inductance --- p.31 / Chapter 3.6.1 --- Strip-to-strip inductance --- p.31 / Chapter 3.6.2 --- System with one or more ground planes --- p.33 / Chapter 3.7 --- Partial Capacitance --- p.34 / Chapter 3.8 --- Numerical and Experimental Results --- p.37 / Chapter 3.9 --- Summary --- p.40 / Chapter 4 --- PEEC Modeling of LTCC RF Circuits using Thin-film Approximation (Via-hole Modeling) --- p.41 / Chapter 4.1 --- Introduction --- p.41 / Chapter 4.2 --- Via-hole Modeling --- p.42 / Chapter 4.2.1 --- Discretization scheme --- p.42 / Chapter 4.2.2 --- Inductance formulae --- p.43 / Chapter 4.2.3 --- Empirical formula --- p.46 / Chapter 4.2.4 --- Edge-effect compensation --- p.48 / Chapter 4.3 --- Numerical and Experimental Results --- p.49 / Chapter 4.4 --- Summary --- p.51 / Chapter 5 --- An Efficient PEEC Algorithm for Modeling of LTCC RF Circuits with Finite Metal Strip Thickness --- p.53 / Chapter 5.1 --- Introduction --- p.53 / Chapter 5.2 --- PEEC Modeling using Thin-film Approximation --- p.54 / Chapter 5.3 --- PEEC Modeling with Finite Metal Thickness --- p.55 / Chapter 5.4 --- Edge-effect Compensation in Inductance Calculation --- p.57 / Chapter 5.5 --- Numerical and Experimental Results --- p.61 / Chapter 5.6 --- Summary --- p.65 / Chapter 6 --- A Compact Second-order LTCC Band-pass Filter with Two Finite Transmission Zeros --- p.66 / Chapter 6.1 --- Introduction --- p.66 / Chapter 6.2 --- Features of the Filter --- p.67 / Chapter 6.3 --- Design Theory --- p.68 / Chapter 6.4 --- LTCC Filter Implementation --- p.70 / Chapter 6.4.1 --- Circuit model --- p.70 / Chapter 6.4.2 --- Physical layout --- p.73 / Chapter 6.5 --- Experimental Results --- p.75 / Chapter 6.6 --- Summary --- p.77 / Chapter 7 --- Concluding Remarks --- p.79 / Chapter 7.1 --- PEEC Modeling --- p.79 / Chapter 7.2 --- Limitations of the Algorithm --- p.80 / Chapter 7.3 --- Further Improvements --- p.81 / Appendix --- p.82 / References --- p.96 / Author's Publications --- p.98
| Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_323839 |
| Date | January 2002 |
| Contributors | Yeung, Lap Kun., Chinese University of Hong Kong Graduate School. Division of Electronic Engineering. |
| Source Sets | The Chinese University of Hong Kong |
| Language | English, Chinese |
| Detected Language | English |
| Type | Text, bibliography |
| Format | print, vii, 98 leaves : ill. ; 30 cm. |
| Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
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