by Chow Wing Yin, Winnie. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2004. / Includes bibliographical references (leaves 74-78). / Abstracts in English and Chinese. / ABSTRACT --- p.i / 摘要 --- p.ii / ACKNOWLEDGEMENTS --- p.iii / TABLE OF CONTENTS --- p.iv / LIST OF FIGURES --- p.vi / LIST OF TABLES --- p.viii / Chapter 1 --- INTRODUCTION --- p.1 / Chapter 1.1 --- Digital Microfluidics --- p.1 / Chapter 1.2 --- Soft Lithography of Polymer --- p.2 / Chapter 2 --- ELECTROCAPILLARY-BASED MICROACTUATION --- p.5 / Chapter 2.1 --- Surface Tension in Microscale --- p.5 / Chapter 2.2 --- thermocapillary-based microactuation --- p.6 / Chapter 2.3 --- electrocapillary-based microactuation --- p.6 / Chapter 2.3.1 --- Continuous Electrowetting (CEW) --- p.7 / Chapter 2.3.2 --- Electrowetting (EW) --- p.8 / Chapter 2.3.3 --- Electrowetting-On-Dielectric (EWOD) --- p.11 / Chapter 3 --- SOFT LITHOGRAPHY --- p.14 / Chapter 3.1 --- Rapid Prototyping --- p.15 / Chapter 3.2 --- Replica Molding --- p.16 / Chapter 3.2.1 --- Pouring Method --- p.17 / Chapter 3.2.2 --- Sandwich Molding Method --- p.17 / Chapter 3.2.3 --- Spin On Method --- p.18 / Chapter 3.3 --- Sealing --- p.20 / Chapter 3.3.1 --- Reversible Sealing --- p.20 / Chapter 3.3.2 --- Irreversible Sealing --- p.20 / Chapter 3.4 --- Multilayer Fabrication --- p.21 / Chapter 4 --- METAL DEPOSITION --- p.22 / Chapter 4.1 --- Gold Deposition by Sputtering Method --- p.22 / Chapter 4.1.1 --- Gold Deposition on PMMA --- p.22 / Chapter 4.1.2 --- Gold Deposition on PDMS --- p.23 / Chapter 4.2 --- ITO Deposition by Sputtering Method --- p.26 / Chapter 4.2.1 --- Image Patterning of ITO --- p.27 / Chapter 5 --- POLYMER-BASED SUBSTRATES BONDING USING PDMS --- p.29 / Chapter 5.1 --- Design of Microfluidic System --- p.29 / Chapter 5.1.1 --- PDMS --- p.29 / Chapter 5.1.2 --- Design of the Vortex Micropump --- p.30 / Chapter 5.2 --- Fabrication of Microfluidic System --- p.31 / Chapter 5.2.1 --- Micro Impeller Fabrication Process --- p.31 / Chapter 5.2.2 --- Micro Patterning of PMMA by Hot Embossing Technique --- p.32 / Chapter 5.2.3 --- Assembly of Micropump by PDMS Bonding Process --- p.34 / Chapter 5.3 --- Experimental Results --- p.36 / Chapter 5.3.1 --- Tensile Bonding Test --- p.36 / Chapter 5.3.2 --- Leakage Test --- p.38 / Chapter 6 --- DIGITAL MICROFLUIDICS IN MICROCHANNEL --- p.39 / Chapter 6.1 --- Digital Microfluidics --- p.39 / Chapter 6.2 --- Design of the MicroChannel --- p.39 / Chapter 6.3 --- Materials of the MicroChannel --- p.42 / Chapter 6.3.1 --- Substrate --- p.42 / Chapter 6.3.2 --- Adhesion Layer --- p.42 / Chapter 6.3.3 --- Electrode --- p.43 / Chapter 6.3.4 --- Dielectric Layer --- p.43 / Chapter 6.4 --- Fabrication of the MicroChannel --- p.44 / Chapter 7 --- EXPERIMENTAL RESULTS --- p.46 / Chapter 7.1 --- ewod on pdms layer --- p.46 / Chapter 7.2 --- PDMS Parallel Plate Channel --- p.48 / Chapter 7.2.1 --- Contact Angle --- p.49 / Chapter 7.3 --- Parylene C Parallel Plate Channel --- p.52 / Chapter 7.4 --- Sealed pdms MicroChannel --- p.54 / Chapter 7.5 --- Driving Pressure --- p.55 / Chapter 7.6 --- microchannel in the vertical position --- p.57 / Chapter 8 --- FUTURE WORK --- p.60 / Chapter 8.1. --- Digital Microfluidic Circuit Design --- p.60 / Chapter 8.1.1. --- Electrodes Design --- p.61 / Chapter 8.2. --- Fabrication Process --- p.63 / Chapter 9 --- SUMMARY --- p.64 / APPENDIX A --- p.67 / BIBLIOGRAPHY --- p.74
| Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_324658 |
| Date | January 2004 |
| Contributors | Chow, Wing Yin Winnie., Chinese University of Hong Kong Graduate School. Division of Automation and Computer-Aided Engineering. |
| Source Sets | The Chinese University of Hong Kong |
| Language | English, Chinese |
| Detected Language | English |
| Type | Text, bibliography |
| Format | print, xiii, 78 leaves : ill. (chiefly col.) ; 30 cm. |
| Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
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