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Optimizing Test Pattern Generation Using Top-Off ATPG Methodology for Stuck–AT, Transition and Small Delay Defect Faults

The ever increasing complexity and size of digital circuits complemented by Deep Sub Micron (DSM) technology trends today pose challenges to the efficient Design For Test (DFT) methodologies. Innovation is required not only in designing the digital circuits, but also in automatic test pattern generation (ATPG) to ensure that the pattern set screens all the targeted faults while still complying with the Automatic Test Equipment (ATE) memory constraints.

DSM technology trends push the requirements of ATPG to not only include the conventional static defects but also to include test patterns for dynamic defects. The current industry practices consider test pattern generation for transition faults to screen dynamic defects. It has been observed that just screening for transition faults alone is not sufficient in light of the continuing DSM technology trends. Shrinking technology nodes have pushed DFT engineers to include Small Delay Defect (SDD) test patterns in the production flow. The current industry standard ATPG tools are evolving and SDD ATPG is not the most economical option in terms of both test generation CPU time and pattern volume. New techniques must be explored in order to ensure that a quality test pattern set can be generated which includes patterns for stuck-at, transition and SDD faults, all the while ensuring that the pattern volume remains economical.

This thesis explores the use of a “Top-Off” ATPG methodology to generate an optimal test pattern set which can effectively screen the required fault models while containing the pattern volume within a reasonable limit.

Identiferoai:union.ndltd.org:tamu.edu/oai:repository.tamu.edu:1969.1/149598
Date03 October 2013
CreatorsGill, Arjun
ContributorsWalker, Duncan M, Mahapatra, Rabi, Hu, Jiang
Source SetsTexas A and M University
LanguageEnglish
Detected LanguageEnglish
TypeThesis, text
Formatapplication/pdf

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