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This thesis investigates the potential for fouling in plain and augmented tubes in cooling tower applications. Three primary factors that affect fouling potential are examined: inside tube geometry, water velocity, and water quality. This paper presents a literature survey for in general precipitation fouling, particulate fouling, cooling water fouling, and fouling in enhanced tubes. This thesis also attempts to determine water qualities that are typical of those found in actual cooling towers. The water quality was determined by taking water samples from cooling towers throughout the country and chemically analyzing the samples. From this analysis, three water qualities were determined: an average fouling potential, a low fouling potential, and a severe fouling potential. These water qualities will be used in experimental determinations of fouling resistances in augmented tubes.

This thesis discusses the design, construction, and debugging of an experimental apparatus to measure fouling in smooth and/or augmented copper alloy condenser tubes. In addition, guidelines and recommendations are made for construction of similar devices. Specification sheets of the system components, detailed design calculations, and photographs of the apparatus are included in the appendices.

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This thesis is missing page i, all other copies are missing this page as well. - Digitization Centre / Emergence of efficient cooling techniques has been a crucial factor in development of faster and more powerful electronic equipment and ICs. One of the key obstacles towards further miniaturization is efficient heat removal from regions of high temperature to maintain continued operation of these devices below their maximum operating range. Recently, a significant amount of research has been directed to develop liquid based cooling techniques. For example, microchannel heatsinks have been designed to remove up to 1 kW/cm2. Developing microscale actuators that provide sufficient pressure head is essential for integrating these microscale cooling schemes with the electronic devices. Different techniques can be used to pump fluid in the microscale such as electroosmotic, magnetohydrodynamic, and electrohydrodynamic (EHD) pumping. Among these technologies, EHD pumps are particularly promising for microfluidic devices because they use no moving parts, and uses very small power and has low cost and maintenance requirements. This work presents the development and test of EHD micropumps with different electrode configurations. Four different electrode configurations: (1) planar symmetric electrodes, (2) planar asymmetric electrodes, (3) 3-D symmetric electrodes, and (4) 3-D asymmetric electrodes were investigated. In addition, the effect of different design specifications, such as the inter-electrode spacing and spanwise spacing of the micropillars were investigated. The electrodes were fabricated using a two mask process. First, a thin layer of chromium was deposited on glass as a seed layer for gold electrodes. Positive photoresist (AZ P4620) was patterned to form the mould for the micropillar electrodes. Nickel was electroplated to fill the mold. Subsequently, a Cr/Au layer was patterned to devise the electrode base connector and pads. The microfluidic channels were fabricated by casting polydimethylsiloxane (PDMS) on top of an SU-8 100 (MicroChem Corp.) mould which was patterned to delineate the microchannel structure. The PDMS microchannel was integrated on the electrode base by plasma oxidizing the PDMS and glass wafer, and sealing the connection with liquid PDMS. The pump performance was experimentally determined with Methoxynonafluorobutane (HFE-7100) as the working fluid. All of the micropumps were tested under a no net flow condition to find the maximum pressure generation. The micropumps with planar and asymmetric planar electrode configurations were also tested for maximum flow rate under no imposed back pressure. The results show that the micropumps with the 3D asymmetric electrode design generated a higher pressure head compared to the other micropumps with identical inter electrode spacing under no flow conditions. The micropumps with planar asymmetric design had a higher performance compared to the micropumps with planar asymmetric electric under both no flow condition and no back pressure condition. A maximum pressure head of 2240 Pa was generated at an applied voltage of 900 V by the micropump with 3D asymmetric electrode design. A maximum flow rate of 0.127 mL/min was achieved by the micropump with planar asymmetric electrode configurations. This is five times higher than the maximum flow rate generated by the micropump with the planar symmetric electrode design. / Thesis / Master of Science (MS)

Cooling combustor chambers for gas turbine engines is challenging because of the complex flow fields inherent to this engine component. This complexity, in part, arises from the interaction of high momentum dilution jets required to mix the fuel with effusion film cooling jets that are intended to cool the combustor walls. The dilution and film cooling flow have different performance criteria, often resulting in conflicting flow mechanisms. The purpose of this study is to evaluate the influence that the dilution jets have on the film cooling effectiveness and how the flow and thermal patterns in the cooling layer are affected by both the dilution flow and the closely spaced film cooling holes. This study also intends to characterize the development of the flow field created by effusion cooling injection without dilution injection. This work is unique because it allows insight into how the full-coverage discrete film cooling layer is interrupted by high momentum dilution jets and how the surface cooling is affected. The film cooling flow was disrupted along the combustor walls in the vicinity of the high momentum dilution jets and the surface cooling effectiveness was reduced with increased dilution jet momentum. This was due to the secondary flows that were intensified by the increased jet momentum. High turbulence levels were generated at the dilution jet shear layer resulting in efficient mixing. The film cooling flow field was affected by the freestream turbulence and complex flow fields created by the combined dilution and effusion cooling flows both in the near dilution jet region as well as downstream of the jets. Effusion cooling holes inclined at 20Ë created lower coolant layer turbulence levels and higher surface cooling effectiveness than 30Ë cooling holes. Results showed an insensitivity of the coolant penetration height to the diameter and angle of the cooling hole in the region downstream of the dilution mixing jets. When high momentum dilution jets were injected into crossflow, a localized region in the flow of high vorticity and high streamwise velocity was created. When film cooling air was injected the inlet flow field and the dilution jet wake were fundamentally changed and the vortex diminished significantly. The temperature field downstream of the dilution jet showed evidence of a hot region which was moderated appreciably by film cooling flow. Differences in the temperature fields were nominal compared to the large mass flow increase of the coolant. A study of streamwise oriented effusion film cooling flow without dilution injection revealed unique and scaleable velocity profiles created by the closely spaced effusion holes. The effusion cooling considered in these tests resulted in streamwise velocity and turbulence level profiles that scaled well with blowing ratio which is a finding that allows the profile shape and magnitude to be readily determined at these test conditions. Results from a study of compound angle effusion cooling injection showed significant differences between the flow field created with and without crossflow. It was found from the angle of the flow field velocity vectors that the cooling film layer grew nearly linearly in the streamwise direction. The absence of crossflow resulted in higher turbulence levels because there was a larger shear stress due to a larger velocity difference between the coolant and crossflow. The penetration height of the coolant was relatively independent of the film cooling momentum flux ratio for both streamwise oriented and compound angle cooling jets. / Ph. D.

A detailed analytical model was developed to include the effect of the melting process on a porous composite which retards its own heating rate by sacrificing its infiltrant. A transient one-dimensional heat-transfer analysis was conducted considering both the heats absorbed by melting and vaporization of the infiltrant from within the matrix. A finite-thickness liquid layer was seen to exist above the composite surface as a result of the flow of liquid coolant onto the surface induced by the expansion of the coolant on melting. There existed a period of time during which the melt layer was subject to both depletion due to vaporization and renewal by the flow of liquid coolant onto the surface. As the heating process continued the melt layer was depleted and the liquid coolant vaporized from within the tungsten matrix. The analysis was solved by finite-difference techniques and programmed for the IBM 7040/1401 Digital Computing System. An extensive search was conducted to determine the dependence of temperature on the thermophysical properties of seven different metallic coolants. Data were obtained for the various infiltrants up to that time at which the melt layer vaporizes completely from above the composite surface. A fundamental understanding of the effects of the melting process and of assuming variable properties on the early stages of the self-cooling process was obtained. / Master of Science

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AlGaN/GaN high electron mobility transistors (HEMTs) have been widely used for high power and high frequency RF communications due to their fast switching and large current handling capabilities. The reliability of such devices is strongly affected by the junction temperature where the highest magnitude occurs in a local region on the drain side edge of the gate called the hotspot. Thus, thermal management of these devices remains a major concern in the design and reliability of systems employing AlGaN/GaN HEMTs. Due to the large power densities induced in these devices locally near the drain side edge of the gate, it is clear that moving thermal management solutions closer to the heat generation region is critical in order to reduce the overall junction temperature of the device. In this work, we explore the use of embedded microchannel cooling in the substrate of AlGaN/GaN HEMTs made on Si and SiC substrates and compare them to passive cooling techniques using Si, SiC, and diamond substrates. In addition, the impact of cooling fluids and harsh environmental conditions were considered. The study was performed using a combination of CFD and finite volume analysis on packaged AlGaN/GaN HEMTs. Active cooling using embedded microchannels were shown to have a significant impact on the heat dissipation over the passive cooling methods, approaching or exceeding that of diamond cooled devices. For vertical power devices (IGBT), embedded microchannels in the power electronics substrates were explored. In both the power devices and lateral AlGaN/GaN HEMTs, the use of embedded microchannels with nonlinear channel geometries was shown to be the most effective in terms of reducing the device junction temperature while minimizing the pumping power required.