With the industry striving for smaller devices, new technologies are developed to further miniaturize electronics devices. To this end, realization of 3D/non-planar interconnects, which aim at miniaturizing the interconnects formed between components on the same device, has attracted many researchers. This thesis focuses on a feasibility analysis for developing non-planar interconnects on various flexible substrates using laser assisted maskless microdeposition (LAMM), which is a pressure-less process. There are two types of flexible substrates that are used: double-sided copper substrates separated by a layer of polyethylene terephthalate (PET) as well as a polyethylene terephthalate flexible substrate with surface-mounted resistors. For both substrates, multiple types of experiments were conducted to discover procedures which result in the highest rate of success for forming conductive interconnects. Optimal process parameters and deposition techniques were determined after multiple experiments. After experiments were completed, the resultant substrates were subject to various characterization methodologies including optical and scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction and profilometery. The results of these methodologies are documented in this thesis. After many types of experiments involving substrate manipulation of the double-sided copper substrates, it was shown that the silver nano-particles were more likely to form a conductive interconnect when a polished slant was fabricated on the substrate. Many deposition patterns were used for the flexible substrates with surface-mounted resistors. Of these patterns, the two patterns, the ‘zigzag’ and ‘dot solder’ patterns, proved to have a much higher success rate for creating conductive interconnects compared to the other patterns. During this study, the results of the experiments using the LAMM process show that this technology has great potential for creating non-planar interconnects on flexible substrates. The experiments however suggest that the process is very sensitive to the material composition and process parameters. As such, with a small change in parameters, the 3D interconnects can fail to be produced. It was also observed that the possibility of silver interconnect fractures is higher where dissimilar materials with different thermal expansion rates are used for the underlying substrates.

With the industry striving for smaller devices, new technologies are developed to further miniaturize electronics devices. To this end, realization of 3D/non-planar interconnects, which aim at miniaturizing the interconnects formed between components on the same device, has attracted many researchers. This thesis focuses on a feasibility analysis for developing non-planar interconnects on various flexible substrates using laser assisted maskless microdeposition (LAMM), which is a pressure-less process. There are two types of flexible substrates that are used: double-sided copper substrates separated by a layer of polyethylene terephthalate (PET) as well as a polyethylene terephthalate flexible substrate with surface-mounted resistors. For both substrates, multiple types of experiments were conducted to discover procedures which result in the highest rate of success for forming conductive interconnects. Optimal process parameters and deposition techniques were determined after multiple experiments. After experiments were completed, the resultant substrates were subject to various characterization methodologies including optical and scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction and profilometery. The results of these methodologies are documented in this thesis. After many types of experiments involving substrate manipulation of the double-sided copper substrates, it was shown that the silver nano-particles were more likely to form a conductive interconnect when a polished slant was fabricated on the substrate. Many deposition patterns were used for the flexible substrates with surface-mounted resistors. Of these patterns, the two patterns, the ‘zigzag’ and ‘dot solder’ patterns, proved to have a much higher success rate for creating conductive interconnects compared to the other patterns. During this study, the results of the experiments using the LAMM process show that this technology has great potential for creating non-planar interconnects on flexible substrates. The experiments however suggest that the process is very sensitive to the material composition and process parameters. As such, with a small change in parameters, the 3D interconnects can fail to be produced. It was also observed that the possibility of silver interconnect fractures is higher where dissimilar materials with different thermal expansion rates are used for the underlying substrates.

A demanda por sistemas com elevado desempenho tem trazido a necessidade de aumentar o número de elementos de processamento, surgindo os chamados Sistemas em Chip Multiprocessados (MPSoCs). Além disso, com a possibilidade de redução da escala tecnológica na era submicrônica, permitindo a integração de vários dispositivos, os chips têm se tornado ainda mais complexos. No entanto, com o aumento no número de elementos de processamento, as interconexões são vistas com o principal gargalo dos sistemas-em-chip. Com isso, uma preocupação na forma como tais elementos se comunicam e estão interconectados tem sido levantada, uma vez que tais características são cruciais nos aspectos de desempenho, energia e potência, principalmente em sistemas embarcados. Essa necessidade permitiu o advento das redes-em-chip (Networks-on-Chip – NoCs) e inúmeros estudos já foram realizados para tais dispositivos. No entanto, devido ao aceleramento tecnológico atual, que traz a necessidade por sistemas ainda mais complexos, que consumam baixa energia e que permitam que as aplicações sejam constantemente atualizadas sem perder as características de desempenho, as arquiteturas de interconexão tradicionais não serão suficientes para satisfazer tais desafios. Outras alternativas de interconexão para MPSoCs precisam ser investigadas e nesse trabalho novas arquiteturas para NoCs com tais requisitos são apresentadas. As soluções propostas exploram hierarquia, adaptabilidade e interconexões em três dimensões. Esse trabalho aborda a necessidade do uso de diferentes estratégias em NoCs a fim de atingir os requisitos de desempenho e baixo consumo de potência dos atuais e futuros MPSoCs. Dessa forma, serão verificadas as diversas arquiteturas de interconexões para sistemas heterogêneos, sua escalabilidade, suas principais características e as vantagens das propostas apresentadas sobre as demais soluções. / The demand for systems with high performance has brought the need to increase the number of cores, emerging the called Multi-Processors System-on-Chip (MPSoCs). Also, with the shrinking feature size in deep-submicron era, allowing the integration of several devices, chips have become even more complex. However, with the increase in these elements, interconnections are seen as the main bottleneck in many core systemson- chip. With this, a concern about how these devices communicate and are interconnected has been raised, since these features are crucial for the performance, energy and power consumption aspects, mainly in embedded systems. This need allows the advent of the Networks-on-Chip (NoCs) and countless studies had already been done to analyze such interconnection devices. However, due to the current technological accelerating that brings the need for even more complex systems, consuming lower energy and providing constant application updates without losing performance features, traditional interconnect architectures will not be sufficient to satisfy such challenges. Other interconnecting alternatives for MPSoCs need to be investigated and in this work, novel architectures for NoCs meeting such requirements are presented. The proposed solutions explore hierarchy, adaptability and three dimensional interconnections. This work approaches the requirements in the use of different strategies for NoCs in order to reach the performance requisites and low power consumption of the current and future MPSoCs. Hence, in this approach, several interconnection architectures for heterogeneous systems, their scalability and the main features and advantages of the proposed strategies in comparison with others will be verified.

A demanda por sistemas com elevado desempenho tem trazido a necessidade de aumentar o número de elementos de processamento, surgindo os chamados Sistemas em Chip Multiprocessados (MPSoCs). Além disso, com a possibilidade de redução da escala tecnológica na era submicrônica, permitindo a integração de vários dispositivos, os chips têm se tornado ainda mais complexos. No entanto, com o aumento no número de elementos de processamento, as interconexões são vistas com o principal gargalo dos sistemas-em-chip. Com isso, uma preocupação na forma como tais elementos se comunicam e estão interconectados tem sido levantada, uma vez que tais características são cruciais nos aspectos de desempenho, energia e potência, principalmente em sistemas embarcados. Essa necessidade permitiu o advento das redes-em-chip (Networks-on-Chip – NoCs) e inúmeros estudos já foram realizados para tais dispositivos. No entanto, devido ao aceleramento tecnológico atual, que traz a necessidade por sistemas ainda mais complexos, que consumam baixa energia e que permitam que as aplicações sejam constantemente atualizadas sem perder as características de desempenho, as arquiteturas de interconexão tradicionais não serão suficientes para satisfazer tais desafios. Outras alternativas de interconexão para MPSoCs precisam ser investigadas e nesse trabalho novas arquiteturas para NoCs com tais requisitos são apresentadas. As soluções propostas exploram hierarquia, adaptabilidade e interconexões em três dimensões. Esse trabalho aborda a necessidade do uso de diferentes estratégias em NoCs a fim de atingir os requisitos de desempenho e baixo consumo de potência dos atuais e futuros MPSoCs. Dessa forma, serão verificadas as diversas arquiteturas de interconexões para sistemas heterogêneos, sua escalabilidade, suas principais características e as vantagens das propostas apresentadas sobre as demais soluções. / The demand for systems with high performance has brought the need to increase the number of cores, emerging the called Multi-Processors System-on-Chip (MPSoCs). Also, with the shrinking feature size in deep-submicron era, allowing the integration of several devices, chips have become even more complex. However, with the increase in these elements, interconnections are seen as the main bottleneck in many core systemson- chip. With this, a concern about how these devices communicate and are interconnected has been raised, since these features are crucial for the performance, energy and power consumption aspects, mainly in embedded systems. This need allows the advent of the Networks-on-Chip (NoCs) and countless studies had already been done to analyze such interconnection devices. However, due to the current technological accelerating that brings the need for even more complex systems, consuming lower energy and providing constant application updates without losing performance features, traditional interconnect architectures will not be sufficient to satisfy such challenges. Other interconnecting alternatives for MPSoCs need to be investigated and in this work, novel architectures for NoCs meeting such requirements are presented. The proposed solutions explore hierarchy, adaptability and three dimensional interconnections. This work approaches the requirements in the use of different strategies for NoCs in order to reach the performance requisites and low power consumption of the current and future MPSoCs. Hence, in this approach, several interconnection architectures for heterogeneous systems, their scalability and the main features and advantages of the proposed strategies in comparison with others will be verified.

A demanda por sistemas com elevado desempenho tem trazido a necessidade de aumentar o número de elementos de processamento, surgindo os chamados Sistemas em Chip Multiprocessados (MPSoCs). Além disso, com a possibilidade de redução da escala tecnológica na era submicrônica, permitindo a integração de vários dispositivos, os chips têm se tornado ainda mais complexos. No entanto, com o aumento no número de elementos de processamento, as interconexões são vistas com o principal gargalo dos sistemas-em-chip. Com isso, uma preocupação na forma como tais elementos se comunicam e estão interconectados tem sido levantada, uma vez que tais características são cruciais nos aspectos de desempenho, energia e potência, principalmente em sistemas embarcados. Essa necessidade permitiu o advento das redes-em-chip (Networks-on-Chip – NoCs) e inúmeros estudos já foram realizados para tais dispositivos. No entanto, devido ao aceleramento tecnológico atual, que traz a necessidade por sistemas ainda mais complexos, que consumam baixa energia e que permitam que as aplicações sejam constantemente atualizadas sem perder as características de desempenho, as arquiteturas de interconexão tradicionais não serão suficientes para satisfazer tais desafios. Outras alternativas de interconexão para MPSoCs precisam ser investigadas e nesse trabalho novas arquiteturas para NoCs com tais requisitos são apresentadas. As soluções propostas exploram hierarquia, adaptabilidade e interconexões em três dimensões. Esse trabalho aborda a necessidade do uso de diferentes estratégias em NoCs a fim de atingir os requisitos de desempenho e baixo consumo de potência dos atuais e futuros MPSoCs. Dessa forma, serão verificadas as diversas arquiteturas de interconexões para sistemas heterogêneos, sua escalabilidade, suas principais características e as vantagens das propostas apresentadas sobre as demais soluções. / The demand for systems with high performance has brought the need to increase the number of cores, emerging the called Multi-Processors System-on-Chip (MPSoCs). Also, with the shrinking feature size in deep-submicron era, allowing the integration of several devices, chips have become even more complex. However, with the increase in these elements, interconnections are seen as the main bottleneck in many core systemson- chip. With this, a concern about how these devices communicate and are interconnected has been raised, since these features are crucial for the performance, energy and power consumption aspects, mainly in embedded systems. This need allows the advent of the Networks-on-Chip (NoCs) and countless studies had already been done to analyze such interconnection devices. However, due to the current technological accelerating that brings the need for even more complex systems, consuming lower energy and providing constant application updates without losing performance features, traditional interconnect architectures will not be sufficient to satisfy such challenges. Other interconnecting alternatives for MPSoCs need to be investigated and in this work, novel architectures for NoCs meeting such requirements are presented. The proposed solutions explore hierarchy, adaptability and three dimensional interconnections. This work approaches the requirements in the use of different strategies for NoCs in order to reach the performance requisites and low power consumption of the current and future MPSoCs. Hence, in this approach, several interconnection architectures for heterogeneous systems, their scalability and the main features and advantages of the proposed strategies in comparison with others will be verified.