Le LHC entrera dans sa phase à haute luminosité vers 2027 et pour profiter de l’augmentation importante du taux de collisions, ATLAS, et plus particulièrement son trajectographe doivent être améliorés en terme de résistance aux radiations et traitement de données à un taux accru. Grace au nouveau design du trajectographe at à l’amélioration d’algorithmes d’étiquetage des saveurs de jets, l’identification de jets issus de la désintégration de B hadrons sera facilitée et des canaux de physique possédant des quarks b dans leurs états finaux seront plus facilement accessible, parmi lesquels le couplage trilinéaire du boson de Higgs. La résistance aux raditions des capteurs à pixels en silicium joue un rôle primordial dans leur utilisation auprès des experience LHC. La quantification de l’impact des rayonnements sur les capteurs silicium est un enjeu crucial : un outil de digitisation des dommages des rayonnements a été développé pour modéliser l’impact des radiations dans les simulations Monte Carlo d’ATLAS. Le test de capteurs à pixels planaires, développés par le LPNHE et la fonderie FBK, constitue la partie principale de cette thèse. Les trois productions de capteurs testées possèdent plusieurs designs technologiques. Pour maximiser l’acceptance géométrique du détecteur, des capteurs à bord mince ont été développés. Deux options de polarisation durant les phases de test ont ausssi été étudiée. Les capteurs ont été testés à plusieurs phases d’irradiation. L’optimisation d’algorithme de b-tagging basé sur la reconstruction de vertex secondaire sera aussi présentée, ainsi qu’une étude concernant les performances du b-tagging à haut pT . / By 2027, the LHC will enter its high luminosity regime, providing protons protons collisions at an unprecedented rate. The LHC experiments whill have to be upgraded to cope with this higher data rate. The new ATLAS Inner Tracker (ITk) will allow a better identification of b-quarks and interesting physics signature with b-quarks in the final states such as the Higgs trilinear coupling will be reachable. The work performed during this thesis consisted in testing planar pixel sensors for the ITk, as well as optimizing b-tagging algorithms. In parallel, a study on the radiation damage on silicon pixel sensors have been performed. The radiation hardness of silicon sensors plays a determinant role as it allows them to be efficient in the highly radiative environment at LHC. Understanding the impact of radiation in silicon sensors is a major challenge and a radiation damage digitizer which models radiation damage effects in ATLAS Monte Carlo simulations is currently developed by the ATLAS experiment. Three ITk silicon planar pixel sensors productions of LPNHE and FBK have been developed, produced and tested on beam. Sensors from these three productions aim to be part of the ITk and have to demonstrate good performance after being irradiated at high fluences. Several technological designs have been investigated, such as temporary metal biasing option and active edges which maximize the geometrical acceptance of the sensors. The optimization of b-tagging SV1 algorithm (a secondary-vertex based algorithm) will be pre- sented as well as a study on the extrapolation of b-tagging performances at high pT.

The High Luminosity upgrade of the Large Hadron Collider (HL-LHC), necessitates that the ATLAS experiment replace their current Inner Detector (ID) system. The new Inner Tracker (ITk) will be an all silicon detector, utilising both pixel and strip sensors, with the aim of performing as well, or better than the current system - but in a much more challenging environment. The ITk Strip detector will consist of 17888 modules, ∼ 700 of which will be produced in the Scandinavian ITk Cluster - a collaboration of Copenhagen, Lund, Oslo and Uppsala university and our industrial partner NOTE. This work encompasses the journey from individual components through industrial scale module assembly and on to performance evaluation studies at the DESY II testbeam facility. Optimisation studies were performed of the correlated multi-variable calibration necessary for a glue robot to precisely and reliably dispense the two component epoxy used in the bonding of front-end electronics to the silicon sensor. Procedures and tools were developed for integrating this process into an industrial workflow, and to account for future fundamental changes, such as a switch in the epoxy utilised. To demonstrate sufficient tracking performance of ITk strip modules, even at end-of-life, testbeam campaigns of pre-irradiated modules are conducted. These campaign serve as vi-tal feasibility studies for the ITk as a whole. Reconstruction of end-cap type modules have been historically tricky, due to their complex geometry. This work presents the full integration of semi-automated end-cap type module reconstruction in the Corryvreckan testbeam analysis framework. This represent a major improvement in turnover time from raw data to final result, making the previously impossible concept of live reconstruction during testbeam campaigns within reach.

After ten years of massive success, the Large Hadron Collider (LHC) at CERN is going for an upgrade to the next phase, The High Luminosity Large Hadron Collider (HL-LHC) which is planned to start its operation in 2029. This is expected to have a fine boost to its performance, with an instantaneous luminosity of 5.0×1034 cm-2s -1 (ultimate value 7.5×1034 cm-2s -1 ) with 200 average interactions per bunch crossing which will increase the fluences up to more than 1016 neq/ cm2 , resulting in high radiation damage in ATLAS detector. To withstand this situation, it was proposed to make the innermost layer with 3D silicon sensors, which will have radiation tolerance up to 2×1016 neq/cm2 with a Total Ionization Dose of 9.9 MGy. Two-pixel geometries have been selected for 3D sensors, 50 × 50 μm2 for Endcap (ring), which will be produced by FBK (Italy) and SINTEF (Norway), and 25 × 100 μm2 for Barrel (stave), will be produced by CNM (Spain). A discussion is made in this thesis about the production of FBK on both geometries, as they have made a breakthrough with their Stepper lithography process. The yield improved, specifically for the geometry 25 × 100 μm2 with two electrode readouts, which was problematic in the mask aligner approach. Their sensors were characterized electrically at waferlevel as well as after integration with RD53a readout chip (RoC) on single-chip cards (SCC) and were verified against Innermost Tracker criteria. The SCCs were sent for irradiation up to 1×1016 neq/cm2 and were tested under electron test beam, and a hit efficiency of 97% was presented. Some more SCCs have been sent to Los Alamos for irradiating them up to 1.5×1016 neq/cm2 fluence. As the 3D sensors will be mounted as Triplets, a discussion is also made on their assembly and QA/QC process. A reception testing and electrical testing setup both at room temperature and the cold temperature was made and discussed, with results from some early RD53a RoC-based triplets. The pre-production sensors are already evaluated, and soon they will be available bump-bonded with ITkPixV1 RoC for further testing.

The upgrade of the Large Hadron Collider into the High Luminosity Large Hadron Collider requires a complete replacement of the ATLAS Inner Detector by a new all-silicon Inner Tracker. For this reason a new micro-strip sensor type n+ -in-p was developed. These sensors are expected to have many advantages, such as higher radiation resistance, the ability to operate even if not fully de- pleted and faster response. The main purpose of this thesis is to study and evaluate the detection performance and radiation hardness of the n+ -in-p sen- sor type with the help of electrical characteristics performed on the delivered sensors. The obtained results are compared to the Market Survey Step-2 require- ments and in the case of the sensors designed for the ATLAS Inner Tracker also to the corresponding Technical Specification document. 1