Les ondes acoustiques, démontrées théoriquement en 1885 par le scientifique anglais Lord Rayleigh, constituent de nos jours un sujet de recherches très intéressant. Elles sont devenues indispensables à la fabrication des systèmes de télécommunication miniatures et performants, tels que par exemple les filtres, les oscillateurs ou encore les capteurs. Les dispositifs fonctionnant grâce aux ondes acoustiques sont connus sous le nom de « dispositifs piézoélectriques » puisqu’ils transforment les signaux RF en ondes acoustiques, et vice versa, grâce au phénomène piézoélectrique direct. Le développement de ces dispositifs piézoélectriques a été indispensable pour répondre aux exigences particulières et extrêmes des systèmes de télécommunication actuels (sélectivité, miniaturisation, faible coût, facilité de fabrication et d’intégration). Cette thèse s’inscrit dans une démarche générale de développement des dispositifs piézoélectriques, notamment des micro-résonateurs piézoélectriques qui en constituent la dernière génération. Deux axes principaux ont été développés au cours de ces travaux de recherches : l’étude théorique des micro-résonateurs piézoélectriques à travers une modélisation électrique d’une part, et, d’autre part, la description des procédés de fabrication réalisés en salle blanche du laboratoire d’XLIM. / The acoustic waves, theoretically demonstrated in 1885 by the English scientist Lord Rayleigh, are nowadays an interesting research subject. It became essential to the fabrication of miniature and efficient systems of telecommunication, such as filters, oscillators or sensors. Devices using the acoustic waves are known as piezoelectric devices, because they transform RF signal into acoustic waves, and vice versa, thanks to the direct piezoelectric phenomenon. The development of these piezoelectric devices was essential to meet the particular and extreme requirements of the current systems of telecommunication (selectivity, miniaturization, low cost, ease of manufacturing and integration). This thesis is part of a global approach to develop the piezoelectric devices, notably the piezoelectric micro-resonators which constitute the latest generation. Two main axes have been developed during the research work: the theoretical study of piezoelectric micro-resonators through an electric modelling, on one hand, and, on the other hand, the description of the manufacturing processes accomplished in clean room of XLIM’s laboratory.

Group III-A nitrides (GaN, AlN, InN and alloys) are materials of considerable contemporary interest and currently enable a wide variety of optoelectronic and high-power, high-frequency electronic applications. All of these applications utilize device structures that employ a single or multiple hetero-junctions, with material compositions varying across the interface. For example, the workhorse of GaN based electronic devices is the high electron mobility transistor (HEMT) which is usually composed of an AlGaN/GaN hetero-junction, where a two-dimensional electron gas (2DEG) is formed due to differences in polarization between the two layers. In addition to such hetero-junctions in the same material family, formation of hetero-interfaces in nitrides begins right from the epitaxy of the very first layer due to the lack of native substrates for their growth. The consequences of such "dissimilar" hetero-junctions typically manifest as large defect densities at this interface which in turn gives rise to defective films. Additionally, if the substrate is also a semiconductor, the electrical properties at such dissimilar semiconductor-nitride hetero-junctions are particularly important in terms of their influence on the performance of nitride devices. Nevertheless, the large defect densities at such dissimilar 3D-3D semiconductor interfaces, which translate into more trap states, also prevents them from being used as active device layers to say nothing of reliability considerations arising because of these defects. Recently, the advent of 2D materials such as graphene and MoS2 has opened up avenues for Van der Waal’s epitaxy of these layered films with practically any other material. Such defect-free integration enables dissimilar semiconductor hetero-junctions to be used as active device layers with carrier transport across the 2D-3D hetero-interface. This thesis deals with hetero-epitaxial growth platforms for reducing defect densities, and the material and electrical properties of dissimilar hetero-junctions with the group III-A nitride material system.