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SoC Integration and Verification of a 3D Graphics SoCHuang, Tzu-Ming 26 July 2011 (has links)
While consumer demand for electronic equipment and more mature systems integration capabilities, it makes the system complexity of chip design increasing significantly. Also accompany an issue is how to efficiently and accurately verify that such a large-scale chip. In this thesis, we make 3D graphics SoC as a case study, investigate the various aspect, i.e. architecture design, system integration, verification methods and verification platform. This thesis proposes a verification methodology with unified test pattern from system modeling level to test chip level, and via increase of the abstraction level of test patterns, that avoided the way through the manual to generate the test patterns. Not only eliminate manual editing effort and reduce the possibility of error, but also allows developers to more focus on algorithm design and functional verification. In addition, through the pre-described of test scenario (Test-bench) which automated verification and comparison methodology. The efficiency of regression test will be increased. And it's much easier to meet the constraint of time to market. However, In order to demonstrate our chip on new prototyping based board. We not only modified the channel of 3DG chip, but also develop a high-performance bus bridge to keep the efficient of exchange data between two system buses which in platform board and our SoC. And shorten the longest path of the overall system so that system clock rate could be enhanced from 82.6MHz to 120.4 MHz system clock rate.
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