Bayreuth, Univ., Diss., 2009.

An increased need for collaborative research among different organizations, together with continuing advances in communication technology and computer hardware, has facilitated the development of distributed systems that can provide users non-trivial access to geographically dispersed computing resources (processors, storage, applications, data, instruments, etc.) that are administered in multiple computer domains. The term grid computing or grids is popularly used to refer to such distributed systems. A broader definition of grid computing includes the use of computing resources within an organization for running organization-specific applications. This research is in the context of using grid computing within an enterprise to maximize the use of available hardware and software resources for processing enterprise applications. Large scale scientific simulations have traditionally been the primary benefactor of grid computing. The application of this technology to simulation in industry has, however, been negligible. This research investigates how grid technology can be effectively exploited by simulation practitioners using Windows-based commercially available simulation packages to model simulations in industry. These packages are commonly referred to as Commercial Off-The-Shelf (COTS) Simulation Packages (CSPs). The study identifies several higher level grid services that could be potentially used to support the practise of simulation in industry. It proposes a grid computing framework to investigate these services in the context of CSP-based simulations. This framework is called the CSP-Grid Computing (CSP-GC) Framework. Each identified higher level grid service in this framework is referred to as a CSP-specific service. A total of six case studies are presented to experimentally evaluate how grid computing technologies can be used together with unmodified simulation packages to support some of the CSP-specific services. The contribution of this thesis is the CSP-GC framework that identifies how simulation practise in industry may benefit from the use of grid technology. A further contribution is the recognition of specific grid computing software (grid middleware) that can possibly be used together with existing CSPs to provide grid support. With its focus on end-users and end-user tools, it is intended that this research will encourage wider adoption of grid computing in the workplace and that simulation users will derive benefit from using this technology.

<p>Qudit, a multi-level computational unit for quantum computing, provides a larger state space for information processing, and thus can reduce the circuit complexity, simplify the experimental setup. We promote the qudit-based quantum computing by providing an overview that covers a variety of qudit topics ranging from gate universality, circuit building, algorithm design, to physical realization methods. Among all the important qudit algorithms, we perform the first experimental realization of a qudit-based phase estimation algorithm(PEA) on a photonic platform, utilizing the high dimensionality in time and frequency degrees of freedom (DoFs) in a single photon. In our scheme the controlled-unitary gates can be realized in a deterministic fashion, as the control and target registers are now represented by two DoFs in a single photon. Next we improve the PEA by introducing a new statistical and variational approach to the PEA that we called SPEA. The SPEA can determine any unknown eigenstate-eigenphase pair from a given unitary matrix  by treating the probabilistic output of an Iterative PEA (IPEA)-like circuit as an eigenstate-eigenphase proximity metric, using this metric to estimate the proximity of the input state and input phase to the nearest eigenstate-eigenphase pair and approaching this pair via a variational process on the input state and phase. The SPEA can search over the entire computational space as well as some specified given range efficiently and thus outperforms the original PEA.</p> <p> </p> <p><br></p> <p>The simulation of open quantum dynamics has attracted wide interests recently with a variety of quantum algorithms developed and demonstrated. The second half of the thesis focus on the simulation of the open quantum dynamics which is a useful application for quantum computer based on qudit as well as qubit. We perform the first quantum simulations of the  radical pair mechanism(RPM) in the avian compass with a Sz.-Nagy dilation theorem-based quantum algorithm to demonstrate the generality of the quantum algorithm and to open new opportunities for studying the avian compass with quantum computing devices. Next we apply the same quantum algorithm to simulate open quantum dynamics based on the Generalized Quantum Master Equation (GQME). This approach overcomes the limitations of the Lindblad equation by providing a rigorous derivation of the equations of motion for any subset of elements of the reduced density matrix. We validate our quantum algorithm as applied to the spin-boson benchmark model by analyzing the impact of the quantum circuit depth on the accuracy of the results when the subset is limited to the diagonal elements of the reduced density matrix.  Our findings demonstrate that our approach yields reliable results on  noisy intermediate-scale quantum (NISQ) computers.</p>

Submitted by Maicon Juliano Schmidt (maicons) on 2015-05-21T17:31:45Z No. of bitstreams: 1 Fabiano Alex Colling.pdf: 5692188 bytes, checksum: 8354ca65e4e9e9a92a55f10b5e92b187 (MD5) / Made available in DSpace on 2015-05-21T17:31:45Z (GMT). No. of bitstreams: 1 Fabiano Alex Colling.pdf: 5692188 bytes, checksum: 8354ca65e4e9e9a92a55f10b5e92b187 (MD5) Previous issue date: 2014-11-27 / CAPES - Coordenação de Aperfeiçoamento de Pessoal de Nível Superior / CNPQ – Conselho Nacional de Desenvolvimento Científico e Tecnológico / FAPERGS - Fundação de Amparo à Pesquisa do Estado do Rio Grande do Sul / FINEP - Financiadora de Estudos e Projetos / NUCMAT - Núcleo de Caracterização de Materiais / Programa de Bolsas de Estudo Talentos Tecnosinos / itt Chip - Instituto Tecnológico de Semicondutores da Unisinos / Hongik University da Coreia do Sul / Modelab - Laboratório de Modelagem Elétrica Térmica e Mecânica de Módulos e Encapsulamentos e Eletrônicos / O desenvolvimento de novas tecnologias de encapsulamento de semicondutores tem diminuído o tamanho das trilhas das placas de circuito impresso em busca da miniaturização. Esta diminuição está chegando ao limite possível de ser construído pelo fato de apresentar problemas, como aumento da resistência, ou por ruptura por eletromigração, além do aumento do custo para o controle de partículas nas salas limpas de fabricação. O Encapsulamento sobre Encapsulamento (Package on Package - PoP) surge como uma proposta de encapsulamento com empilhamento de chips finos para reduzir a ocupação do chip na placa. A diferença de propriedades térmicas e mecânicas dos diferentes materiais que compõem o chip encapsulado pode resultar no empenamento do componente. Neste trabalho, foi simulado o comportamento termomecânico de um dispositivo eletrônico encapsulado pela tecnologia Package on Package. Foi avaliado, do ponto de vista térmico e mecânico, quais são os fatores geradores do empenamento de semicondutores encapsulados com a tecnologia PoP recorrente no processo de moldagem. As condições e parâmetros de processo de fabricação foram estudados durante a fabricação de um protótipo de chip de 40 µm de espessura e moldado com um composto de epóxi do tipo 2 (Epoxy Molding Compound - EMC) realizado no Laboratório de Materiais do Departamento de Ciências dos Materiais e Engenharia da universidade Hongik da Coreia do Sul, parceira no projeto de pesquisa. Através das medições do empenamento, por interferometria de Moiré, realizadas no laboratório de testes da empresa Sul Coreana Hana Micron, foi possível construir correlações com a simulação computacional deste componente. Os resultados desta comparação foram utilizados como base para a validação da simulação e ajustes de dados de entrada utilizados em outras três espessuras diferentes de chip de silício (70, 100 e 200 µm) e dois tipos diferentes de EMC (EMC1 e EMC2). As condições e parâmetros de processo de fabricação, a influência no empenamento das diferentes espessuras e tipos de EMC dos componentes simulados foram avaliados. As simulações realizadas com variação no EMC em componentes com chip de 40 µm mostraram que o EMC do tipo 1 apresenta uma redução de 42,39% no empenamento na parte superior do componente (Top) maior em relação ao EMC do tipo 2. No Top, o substrato com chip de 100 µm, o empenamento foi reduzido em 36,62% e no de 200 µm a redução foi de 3,29%. Os resultados mostram a importância da simulação para prever a tendência do empenamento, quando existe a necessidade de muitas variações de parâmetros de processo de fabricação. / The development of new technologies of semiconductors packaging has reduced the size of the tracks of printed circuit boards in search of miniaturization. This reduction has been reaching its own possible limits (of construction) because it has several problems, such as increase of resistance, rupture by electromigration, in addition to the increase of costs of particles control in manufacturing cleanrooms. Package on Package (PoP) comes as a proposition for encapsulation with thin chips piling in order to reduce chip occupation on the board. The difference in thermal and mechanical properties of the different materials that make up the encapsulated chip may result in the warpage of the component. In this study, the thermomechanical behavior of an electronic device encapsulated by the Package on Package technology was simulated. From the thermal and mechanical point of view, it was evaluated what factors cause the warpage of the semiconductors encapsulated with the PoP technology, warpage which is recurrent in the molding process. The manufacturing process conditions and parameters were assessed/evaluated during the making of a 40μm-thick chip prototype which was molded with a type 2 Epoxi Molding Compound - EMC - in the Materials Laboratory of Hongik University Department of Materials Science and Engineering in South Korea, our partner in this research project. Through the warpage measurements, by Moiré interferometry carried out in South Korean Hana Micron's test laboratory, we managed to build correlations with the computing simulation of this component. The results of this comparison were used as base for validation of the simulation and for adjustment of input data used in three different thickness of silicon chips (70, 100 and 200 μm) and two different EMC (EMC1 and EMC2). The manufacturing process conditions and parameters, the influence in warpage of different thicknesses and simulated components EMC types were evaluated. The simulations carried out with EMC variation in components with 40μm chip demonstrated that type 1 EMC has a decrease in warpage of the upper part of the component (Top) 42.39 percent larger than type 2 EMC. On the Top, the substract plus chip with 100 μm thickness, the warpage was reduced in 36.62 percent, and in the 200 μm chip, the reduction was by 3.29 percent. The results show the importance of simulation to predict warpage tendency, when there is the need for many variations of manufacturing production parameters.

The thesis deals with the use of cloud computing to solve computationally intensive task. Simulation methods are employed to analyze the operation of the proposed system before putting it into operation. Cloud computing makes the functionality of modern data centers accessible to small businesses, cloud allows scaling up and scaling down of resource usage on an as-needed basis; moreover, without high initial investments and long-term commitments. The paper examines in detail the ways to adapt the currently most popular cloud environment of Amazon's Elastic Compute Cloud to the specific requirements of custom applications and suggests ways to automate the process of creation and customization of instance images. The automation and management of running applications in cloud environment is demonstrated on the example of geographic data processing and map generation application. The simulation model for running applications in the cloud is built and exploited to verify the ability of the proposed solutions to succeed in a production deployment.