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Automotive industry in China is probably one of the most potential emerging markets all over the world along with the trend of the ¡§China Flu¡¨. More than that, the well-know market demand over the 2002 is prosperously exceeded over the average estimation. The total vehicle production quantity is 3.25 million pieces versus almost the equivalent sold out quantity, the attractive numbers pushing China Auto market upward the rank of the 4th largest regional market, and become the only market cranking upward with the growth rate at 30%, while most of the other markets are suffering severely worldwide recession. China automakers and automotive electronic components makers become world-class auto manufacturers' strategic partners. Therefore, the research deals with the extent to which multinational tier 1 and tier 2 enterprises and China local makers clustering segment as the new China auto industrial landscape rely on Taiwanese automotive components suppliers with the most suitable entry mode as well as the competing advantage throughout the newly emerging supply chain in China OE segments, how Taiwanese suppliers find a way to be upgraded as a global player via the collaboration synergy of China market. The methodology for the research is utilized the case study approach and the interview with the leading edge industrial players for both China auto makers and multinational Tier 1 giants. After literature review and case study analysis, we highlight the most suitable entry strategy as ¡§niche strategy¡¨ and ¡§collaboration alliance¡¨ with the deliberation in terms of the Taiwanese makers SWOT analysis. For Taiwanese makers, they have some advantages, such as 1). leverage of resources; 2).integrator role played between Western and China connection; 3).booster of Taiwan¡¦s globalization; 4).enlarging the market place from regional to international level; 5).smooth over the political conflict for enhanced collaboration to reach the win-win synergic solution. Tenth Five-Year Plan published in June 2001 as the highest regulatory that is the major forces driving China automotive industry forward, in which the motor vehicle production was expected to reach some 3.2 million in 2005, including 1.1 million cars. Automotive industrial added value will reach RMB 130 billion, accounting for 1% of GDP. By 2005, the 2-3 large automotive enterprise groups ( First Auto Works, Shanghai Auto Industry Corp.,and Dongfeng Motor Corp.) with certain international competitiveness will be formed and fully supported by the state, making use of all kinds of preferential policies, whose products share over 70% of domestic market with some exports. The 5-10 large enterprise groups for automotive parts and components with initial international competitiveness will be built up. The top three enterprise groups for key automotive parts and components will have market share 70% of domestic market. Technical renovation projects in line with the Tenth Five-Year Plan of automotive industry and beneficial to the restructuring of automotive industry will be given priority to indirect financing and a modern development, production and marketing system will be encouraged to establish. Consequently, the State encourages the autonomous development of leading parts and components enterprises to enhance their competitiveness. Different ownerships are encouraged to participate in the development of auto part and component industry with the policy of the strategic alliance in order to innovate a newly modern value chain with the world wide expertise ¡¨clustering effects¡¨. Leading enterprises emerging as ¡§super suppliers¡¨ as innovation term of ¡§tier 0.5¡¨ for Automotive parts and components supported by 3 OE Giants FAW, SAIC and DMC. The tier 0.5 super suppliers such as Fawer under FAW, STEC under SAIC and DFT under DMC will be guided to develop the specialization of the system provider and module integrator for effectiveness of economies of scale. The research has two implications ---the interface strategy of Taiwan automakers is the ¡§niche strategy¡¨ and ¡§collaboration alliance¡¨. As far as the penetration and competing strategy development of Chinese market is concerned, the ¡§niche strategy strategic role played by Taiwanese have an absolute effect on the second level OE car makers to avoid competing with larger firms by targeting small markets of little or no interesting to the larger firms. Collaboration alliance connecting both of Mainland China domestic makers to the western countries facilitated by horizontal collaboration for market development and technology enhancement, because Taiwan belongs to the same cultural region as Mainland China. Besides. The research also suggests the competing strategies; such as reinforce the self-technology capability incubator, leverage of Taiwan IT and IC industry competing advantage to back up the automotive electronic upgrade, emphasize the role played as an multinational enterprise, strengthen the global wise alliance as well as the worldwide marketing channel connection. The active participation of Taiwanese suppliers is also an essential factor that raises the status as interface strategy. Taiwan makes use of core competences to play the role of ¡§critical unique link¡¨ without being left out from the emerging value chain of the highly potential China market.

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To inquire into entrepreneurship, a newly-emerging and interesting subject, our research has selected Taiwan¡¦s information technology electronics components industry as research target. By gathering vast- and primary- data, and using several representative Taiwanese component manufacturers as case studies, we found the ¡¥technical-amateur¡¦ phenomenon. This paper will clearly explain the contents, contextual factors, and advantages of technical-amateur entrepreneurship. These type of entrepreneurs are so-called ¡¥technical-amateurs¡¦ because they lacked previous work experiences in the information technology industry, i.e. outsiders; they also lacked technical ability of the typical blue-collared workers and the engineers, they were previously high-level managers in the manufacturing industry. Thus technical-amateurs tend to have vast- and extended- relationship networks that can quickly transfer capitals, to form capital team and gain the assistance of venture capital to attract the technical team; they also have sharp intuition that can strategize to move toward the mainstream to maximize market benefits; they also have managerial ability that can successfully assimilate the technology team and improve production efficiency while reducing production cost. These concepts are similar to the arguments of ¡¥fitness landscape¡¦, ¡¥co-evolution¡¦, and ¡¥the establishment of shared schema¡¨. There are several important contextual factors that led to the emergence of technical-amateurs. 1) Product technology already exists, but the process technology remains to be explored; 2) Clustering of the local information technology industry, especially the existence of world-class EMS manufacturers; 3) Rapid growths of venture-capitals; 4) Mobility of technology and talents; and 5) Profitability minimization of information products. Comparing to technical entrepreneurs, technical-amateur entrepreneurs have the following advantages: 1.By occupying the advanced-guard position in the information industry, can quickly discover entrepreneurial opportunities. Outsourcing under changes in the global commodity chain and the trend toward lighter- and smaller- information products, give rise to more entrepreneurial opportunities in the component industry. Since technical-amateurs maintain close relationships with venture-capital thus can organize capital team, therefore occupying the advanced-guard position where they can quickly discover emerging opportunities. 2.Powerful Capital Reinforcements. To achieve economies of scale, newly-founded components businesses must quickly improve its productivity. But before this could happen, manufacturer must experience a learning period where budgetary deficits are unavoidable. However due to the reinforcements of the capital team, technical-amateur entrepreneurs can lead through this difficult period and into a most profitable period of significant growths.

<p>Explore factors that influence investors interested in investing in the electronic components sector in Thailand, with a focus on the consequences of Thailand‟s membership in the ASEAN-China Free Trade Agreement.</p>

L'intérêt et le développement des microsystèmes aujourd'hui sont basés sur les mêmes principes qui ont fait le succès des circuits intégrés. Comme dans la microéléctronique, le silicium est le matériau le plus utilisé parmi les microsystèmes. Malgré cette hégémonie, il existe d'autres alternatives pour les applications où le silicium n'est pas très performant. L'arséniure de gallium (AsGa) se montre prometteur car des effets comme la piézo­électricité, la piézo­resistivité et l'émission de rayonnement lumineux peuvent efficacement être exploités. <br />La fabrication des microstructures suspendues (mécaniques) compatibles avec des <br />technologies standards des circuits intégrés en AsGa est présentée dans cette thèse. Ces <br />microstructures sont obtenues à travers le micro­usinage en volume par la face avant et ne demandent <br />aucune modification du procédé si ce n'est une étape post­process de gravure destinée à libérer les <br />structures devant être suspendues. Ce principe permet la fabrication collective en grandes quantités et <br />à bas coût puisque s'insérant dans une filière industrielle stabilisée. <br />Dans ce travail, plusieurs solutions de gravure ont été étudiées et caractérisées. Les vitesses de <br />gravure et les éventuels dégâts dans les couches diélectriques et de métallisation des plots ont été <br />vérifiés. A partir de ces résultats, deux applications potentielles pour les microsystèmes en AsGa ont <br />été considérées : les composants thermiques qui tirent parti du coefficient Seebeck de l'AsGa et de <br />l'isolation thermique des structures suspendues, et les composants électroniques passifs micro­usinés <br />pour les circuits micro­ondes, comme les lignes micro­rubans et les inductances planaires. <br />Finalement, un ensemble d'outils de CAO pour les microsystèmes a été développé. Des modules <br />spécifiques ont été assemblés à l'environnement Mentor Graphics, comme par exemple la vérification <br />des règles de dessins pour les microsystèmes, des outils pour la visualisation du layout en coupe et en <br />trois dimensions, et des simulateurs de gravure. <br />Mots clés microsystèmes, arséniure de gallium, micro­usinage, thermocouple, inductance <br />planaire, outils de CAO.

Explore factors that influence investors interested in investing in the electronic components sector in Thailand, with a focus on the consequences of Thailand‟s membership in the ASEAN-China Free Trade Agreement.

Purpose: This thesis aims to contribute to the literature on how the value chain for electronic components can be leveraged to obtain circular business models (CBM). By implementing activities in the value chain, circular economy (CE) can be enhanced and a circular value chain obtained. The purpose lies in mapping out activities in the value chain of electronic components and existing barriers to acknowledge where circularity can be increased by CE strategies. Based on this observation, the future path towards CBM will be facilitated. This thesis aims to answer the following research questions: What are the main barriers for a circular value chain in electronic components? and How can the transformation towards a CBM for electronic components be facilitated by a circular value chain?  Method: A qualitative case study has been carried out at Volvo CE. The study is of an abductive approach, where previous theories on CE strategies and value chains were utilised to understand how the transformation towards a CBM can be applied for electronic components. A literature review of the key concepts was conducted and primary data was collected through interviews and one focus group for validation. The data has been analysed through the use of a thematic analysis. Findings: Findings suggest that four areas are of high importance in a circular value chain for electronic components: management, technology department, suppliers relations and aftermarket. The main barriers hindering CE are insufficient objectives, inadequate external value chain integration, limited education, and inertia in technological development. Findings show that the barriers can be mitigated through enhancing CE in the following activities: strategy and organisational vision; cooperation and partners; education and qualifications; innovation and technical development. The result presents how the circular value chain is interconnected with a CBM, visualising how the key activities will facilitate the transformation towards a CBM.  Theoretical contributions &amp; managerial implications: This thesis contributes to the scarcity of literature on value chains in electronic components and adds to research on the connection between value chains and circular business models. The thesis can act as guidance for managers when making the transformation towards a CBM, by highlighting how CE activities can be applied for a more circular value chain.  Limitations and future research: This is a single case study, making the study limited in how applicable the findings are to other industries and countries. Future studies can validate the result by examining value chains in similar companies, to improve the generalisability of our result. This thesis is limited to investigating the value chain from a strategic perspective and we acknowledge that a mapping of the operational value chain can be a matter for future research. We focus on collaboration, but operations that enhance CE in daily activities in production of electronic components are yet to be investigated.

Dans cette thèse, nous abordons la conception des composants d'électronique de puissance, intégrés sur semi-conducteur. Dans cette large problématique, nous nous intéressons plus particulièrement aux méthodes et outils logiciels et numériques pour le dimensionnement technologique et géométrique. Ainsi, nous abordons le dimensionnement en faisant des compromis d'intégration entre la technologie du composant de puissance et les fonctions électriques de ses composants annexes, en prenant en compte la fiabilité de la réalisation technologique en salle blanche et les impacts de l'environnement électronique. Pour cela, nous avons proposé des démarches, méthodes et outils pour repousser les limites existantes de la conception, visant à offrir le support correspondant en terme de « design kit ». Finalement, nous appliquons les méthodes et les démarches choisies et développées, au dimensionnement d'un MOSFET de puissance (VDMOS), pour différents cahiers des charges. / The thesis deals with the design of integrated power electronics components. In this large problematic, the thesis focuses on the methods and numerical and software tools for the geometrical and technological sizing. So, the thesis deals with the sizing carrying out compromises between the technology of a power component and the electrical characteristics of its auxiliary components, taking into account the reliability of the technological making and the impacts of the electronic environment. In this way, approaches, methods and tools are proposed to push away the existing design limits, to offer the corresponding elements for the design kit. Finally, the developed and chosen methods and approaches are applied to the sizing of a power MOSFET (VDMOS) according to several cases of specifications

Le Génie Electrique, en général, et l'électronique de puissance, en particulier, prend une part de plus en plus importante dans les systèmes embarqués. La fiabilité des systèmes électroniques dépend fortement de la gestion de leur température. Les systèmes de refroidissement actuels sont lourds, volumineux, et consommateurs d'énergie, ce qui est en désaccord avec les systèmes embarqués. Il est donc nécessaire de chercher de nouveaux systèmes, plus fiables, plus légers, et moins énergivores. Le sujet de cette thèse porte sur l'utilisation des ferrofluides, suspensions colloïdales magnétiques, à basse température de Curie, dont les propriétés magnétiques varient fortement avec la température entre l'ambiante et une centaine de degrés Celsius afin de les utiliser comme liquide caloporteur dans les systèmes de refroidissement. Les propriétés magnétiques fortement dépendantes de la température d'un tel fluide permettent la mise en mouvement de ce dernier par l'action couplée d'un champ magnétique et d'un gradient de température alors que toutes les pièces solides restent fixes. Le système de refroidissement n'est alors plus assujetti à l'usure de la pompe permettant la circulation du fluide caloporteur. Le système est ainsi globalement plus fiable et moins consommateur d'énergie. L'énergie de mise en mouvement du ferrofluide étant extraite directement des pertes des composants. Le comportement des ferrofluides est trop méconnu à l'heure actuelle pour concevoir et optimiser une pompe statique magnétothermique. Un effort important de modélisation et de caractérisation doit être mené. Ce manuscrit présente une étude pratique vérifiant le principe de création de pression hydrostatique par couplage magnétothermique. Une modélisation de la distribution des forces locales mettant en mouvement le ferrofluide ainsi que la mise en place d'outil permettant la caractérisation des ferrofluides sont également présentées. Les efforts de caractérisation se sont concentrés sur la rhéologie, au regard du champ magnétique, du cisaillement et de la température, ainsi que sur le comportement magnétique du ferrofluide à différentes températures. / The Electrical Engineering in general and power electronics, in particular, plays an increasingly important role in embedded systems. The reliability of electronic systems strongly depends on the management of their temperature. Cooling systems today are heavy, bulky, and consumers of energy, which is in disagreement with embedded systems. It is therefore necessary to look for new systems, more reliable, lighter and use less energy. The subject of this thesis focuses on the use of ferrofluids, magnetic colloidal suspensions at low Curie temperature, the magnetic properties vary strongly with temperature between ambient and one hundred degrees Celsius, for use as coolant in cooling systems. The magnetic properties strongly dependent on the temperature of such fluid allow the actuation of the latter by the action of a magnetic field coupled at a temperature gradient so that all solid parts are stationary. The cooling system is no longer subject to the wear of the pump for the circulation of the coolant. The system is thus globaly more reliable and less energy consuming. The energy for moving the ferrofluid being extracted directly losses components. The behavior of ferrofluids is too little known today to design and optimize a pump magneto static. A major effort of modeling and characterization should be conducted. This manuscript presents a practical study verifying the principle of hydrostatic pressure created by magnetothermal coupling. A modeling of the distribution of local forces by moving the ferrofluid and the development tool for the characterization of the ferrofluids are also presented. Characterization efforts focused on rheology, under the magnetic field, shear and temperature, as well as on the magnetic behavior of the ferrofluid at different temperatures.