• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 2
  • Tagged with
  • 2
  • 2
  • 2
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

A study of moisture diffusion at the epoxy/copper interface for plastic IC packages /

Chan, Edward King-Long. January 2006 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2006. / Includes bibliographical references (leaves 119-124). Also available in electronic version.
2

Interfacial adhesion between epoxy molding compound and copper leadframe under different thermal conditions /

Chung, Paular Wai Kwan. January 2002 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references (leaves 111-114). Also available in electronic version. Access restricted to campus users.

Page generated in 0.4007 seconds