Spelling suggestions: "subject:"epoxy compounds. adhesion."" "subject:"epoxy compounds. dhesion.""
1 |
A study of moisture diffusion at the epoxy/copper interface for plastic IC packages /Chan, Edward King-Long. January 2006 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2006. / Includes bibliographical references (leaves 119-124). Also available in electronic version.
|
2 |
Interfacial adhesion between epoxy molding compound and copper leadframe under different thermal conditions /Chung, Paular Wai Kwan. January 2002 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002. / Includes bibliographical references (leaves 111-114). Also available in electronic version. Access restricted to campus users.
|
Page generated in 0.0785 seconds