With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologies, the global buses are fast becoming the "weakest-links" in VLSI design. They have large delays and are error-prone. Especially, in system-onchip (SoC) designs, where parallel interconnects run over large distances, they pose difficult research and design problems. This work presents an approach for evaluating the data carrying capacity of such wires. The method treats the delay and reliability in interconnects from an information theoretic perspective. The results point to an optimal frequency of operation for a given bus dimension for maximum data transfer rate. Moreover, this optimal frequency is higher than that achieved by present day designs which accommodate the worst case delays. This work also proposes several novel ways to approach this optimal data transfer rate in practical designs.From the analysis of signal propagation delay in long wires, it is seen that the signal delay distribution has a long tail, meaning that most signals arrive at the output much faster than the worst case delay. Using communication theory, these "good" signals arriving early can be used to predict/correct the "few" signals that arrive late. In addition to this correction based on prediction, the approaches use coding techniques to eliminate high delay cases to generate a higher transmission rate. The work also extends communication theoretic approaches to other areas of VLSI design. Parity groups are generated based on low output delay correlation to add redundancy in combinatorial circuits. This redundancy is used to increase the frequency of operation and/or reduce the energy consumption while improving the overall reliability of the circuit.

Technology scaling trends lead to shrinking of the individual elements like transistors and wires in digital systems. The main driving force behind this is cutting the cost of the systems while the systems are filled with extra functionalities. This is the reason why a 3 GHz Intel processor now is priced less than what a 50MHz processor was priced 10 years ago. As in most cases, this comes with a price. This price is the complex design process and problems that stem from the reduction in physical dimensions. As the transistors became smaller in size and the systems became faster, issues like power consumption, signal integrity, soft error tolerance, and testing became serious challenges. There is an increasing demand to put CAD tools in the design flow to address these issues at every step of the design process. First part of this research investigates circuit level techniques to reduce power consumption in digital systems. In second part, improving soft error tolerance of digital systems is considered as a trade off problem between power and reliability and a power aware dynamic soft error tolerance control strategy is developed. The objective of this research is to provide CAD tools and circuit design techniques to optimize power consumption and to increase soft error tolerance of digital circuits. Multiple supply and threshold voltages are used to reduce power consumption. Variable supply and threshold voltages are used together with variable capacitances to develop a dynamic soft error tolerance control scheme.