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Selective chemical etching of unidirectional zirconia-tungsten eutectic compositesMoh, Kyung Hwa 08 1900 (has links)
No description available.
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Some aspects of the nature of eutecticsHogan, Leonard McNamara. Unknown Date (has links)
No description available.
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Controlled Solidification of Eutectic Cast IronBrigham, Robert John 05 1900 (has links)
Eutectic Fe-C, Ni-C and Fe-C-Si alloys have been solidified
directionally in an electron-beam floating zone apparatus under carefully
controlled conditions and the resulting morphologies in these alloy
systems have been studied as a function of rate. In addition, the
transition from the stable iron-graphite (grey iron) to the metastable
iron-iron carbide (white iron) mode has been observed and has been
related to the iron-carbon/iron-iron carbide double phase diagram by
means of undercooling measurements. Interlamellar spacing measurements
carried out on both the graphitic and carbidic modes using material of
the same composition and purity under identical experimental conditions
showed a λaR-1/2 and a λaR-1/3 relationship in the iron-graphite and
iron-iron carbide eutectic systems, respectively. / Thesis / Doctor of Philosophy (PhD)
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Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic Pb-Sn and Pb-free solders /Huang, Xingjia. January 2003 (has links)
Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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Wear and microstructure of eutectoid steels /Danks, Daniel, January 1989 (has links)
Thesis (Ph. D.)--Oregon Graduate Center, 1989.
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Co-deformation of a two-phase FCC/BCC material /Sinclair, Chad. January 2001 (has links)
Thesis (Ph.D.) -- McMaster University, 2001. / Includes bibliographical references (leaves 229-236). Also available via World Wide Web.
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Casting and analysis of squeeze cast aluminium silicon eutectic alloy : a thesis presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy in Mechanical Engineering at the University of Canterbury, Christchurch, New Zealand /Smillie, Matthew. January 2006 (has links)
Thesis (Ph. D.)--University of Canterbury, 2006. / Typescript (photocopy). Includes bibliographical references (p. [161]-166). Also available via the World Wide Web.
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Effets des éléments alliés et de la trempe, lors des traitements thermiques T4 et des vieillissements artificiels, sur la microstructure et les propriétés mécaniques des alliages aluminium-silicium de type 413 /Moreau, Charles, January 2004 (has links)
Thèse (M.Eng.) -- Université du Québec à Chicoutimi, 2004. / Bibliogr.: f. 234-242. Document électronique également accessible en format PDF. CaQCU
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Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper JointsWu, Yujing 05 1900 (has links)
Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was to investigate the diffusion kinetics and microstructures of six types of composite solder/copper joints.
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Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite SolderSees, Jennifer A. (Jennifer Anne) 05 1900 (has links)
The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions.
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