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Eutectic Fe-C, Ni-C and Fe-C-Si alloys have been solidified directionally in an electron-beam floating zone apparatus under carefully controlled conditions and the resulting morphologies in these alloy systems have been studied as a function of rate. In addition, the transition from the stable iron-graphite (grey iron) to the metastable iron-iron carbide (white iron) mode has been observed and has been related to the iron-carbon/iron-iron carbide double phase diagram by means of undercooling measurements. Interlamellar spacing measurements carried out on both the graphitic and carbidic modes using material of the same composition and purity under identical experimental conditions showed a λaR-1/2 and a λaR-1/3 relationship in the iron-graphite and iron-iron carbide eutectic systems, respectively. / Thesis / Doctor of Philosophy (PhD)

Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

Thesis (Ph. D.)--Oregon Graduate Center, 1989.

Thesis (Ph.D.) -- McMaster University, 2001. / Includes bibliographical references (leaves 229-236). Also available via World Wide Web.

Thesis (Ph. D.)--University of Canterbury, 2006. / Typescript (photocopy). Includes bibliographical references (p. [161]-166). Also available via the World Wide Web.

Thèse (M.Eng.) -- Université du Québec à Chicoutimi, 2004. / Bibliogr.: f. 234-242. Document électronique également accessible en format PDF. CaQCU

Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was to investigate the diffusion kinetics and microstructures of six types of composite solder/copper joints.

The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions.