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1	THERMODYNAMIC RESTRICTIONS ON SURFACE STRESS, AND ITS ESHELBIAN FORMS, FOR AN INTERFACE DRIVEN BY MECHANICAL, THERMAL AND CHEMICAL FORCES WITH APPLICATIONS TO SNBI SOLDER JOINTS Pei-En Chou (19691614) 19 September 2024 (has links) <p dir="ltr">This thesis explores the thermodynamics and mechanics of reaction-diffusion interfaces in solid materials, focusing on configurational forces for bulks and surfaces, which are essential in understanding phenomena like electromigration, phase separation, and void evolution. The work is divided into four themes: bulk and surface configurational mechanics, electromigration in solder joints, and solid mixture theory. The thesis develops theories based on continuum mechanics and configurational forces, deriving Eshelby stress tensors and balance laws for interfaces. Experimental work on electromigration in SnBi solder joints is used to validate the theory. The research contributes to advancing the understanding of solid-state diffusion and phase evolution in engineering materials.</p> Microelectronics Solid mechanics interconnect deformation interconnect test structures Solid mechanics Configurational Force Moving interfaces Eshelby Second Law of Thermodynamics fracture mechanics theory Continuum mechanics. surface stress f Interface balance laws current crowding EDX characterization sem characterizations X-ray tomographic microscopy FIB methods Reaction Diffusion Theory Solid state diffusion electromigration device cleanroom fabrication

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THERMODYNAMIC RESTRICTIONS ON SURFACE STRESS, AND ITS ESHELBIAN FORMS, FOR AN INTERFACE DRIVEN BY MECHANICAL, THERMAL AND CHEMICAL FORCES WITH APPLICATIONS TO SNBI SOLDER JOINTS