Most stars are born in multiple systems, so the presence of a stellar companion may commonly influence planet formation. Theory indicates that companions may inhibit planet formation in two ways. First, dynamical interactions can tidally truncate circumstellar disks. Truncation reduces disk lifetimes and masses, leaving less time and material for planet formation. Second, these interactions might reduce grain-coagulation efficiency, slowing planet formation in its earliest stages. / Astronomy

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Dynamic abnormal grain growth (DAGG) is a phenomenon by which single crystals up to centimeters in length are produced at elevated temperature during the application of strain. DAGG was previously demonstrated in commercial-purity molybdenum (Mo) materials. This is the first investigation to confirm DAGG in another material, tantalum (Ta). Previous experiments initiated and propagated DAGG using constant true-strain rate tensile tests, but this study demonstrates that DAGG can also occur under constant true-stress tensile conditions. A Mo material was tested under constant true stress, and two Ta materials were tested under constant true-strain rate. The effects of temperature, stress, strain rate, initial microstructure and texture on tensile test data and the resulting microstructures are examined. The microstructures of the Ta materials are analyzed using electron backscatter diffraction (EBSD) data to quantify the orientation, deformation, grain boundary character, and slip properties of the DAGG grains and unconsumed microstructure. The DAGG grains were found to be relatively undeformed compared to the unconsumed microstructure following DAGG and to not be oriented favorably, or unfavorably, for slip. The grain boundaries between DAGG grains in one Ta material were found to commonly have [sigma]3 character. This was likely due to a strong initial <111>-fiber texture. Previous investigations of DAGG in Mo indicated that DAGG grains commonly grow along the surface of the specimen, but this was not observed with significant frequency in Ta. Results suggest that the distance the DAGG grain boundary travels is proportional to the accumulated strain during DAGG, and the velocity of the DAGG grain boundary is proportional to the applied strain rate but is not related to the orientation of the DAGG grain or its slip properties. / text

Polycrystalline geological materials are not normally single phase materials and commonly contain second phases which are known to influence the grain size and mechanical properties of bulk material. Despite the well documented significance of second phases, there are relatively few detailed systematic experimental studies of the effect of second phases on isostatic high temperature grain growth in geological materials. Grain growth is a process that is fundamental to our understanding of how rocks behave in the lower crust / upper mantle where grain size is considered to play an important role in the localization of deformation in addition to determining the strength of materials at these pressure and temperature conditions. Furthermore, the effect that the spatial distribution and grain size of the second phases have on the mechanical properties of rocks is generally acknowledged, but it is not well constrained. Spatial variation is particularly significant in geological systems where a strength contrast exists between phases. With these two things in mind, a two-part study is presented in which the influence of a pore second phase on the microstructural evolution of halite during grain growth (Part I), and the influence of a calcite second phase on the mechanical behaviour of two phase calcite + halite aggregates (Part II), is investigated. In Part I, high temperature (330 °-600 °C), high confining pressure (200 MPa) isostatic grain growth experiments were carried out on 38-125 μm reagent grade halite (99.5%+ NaCl) powder over durations of 10 secs up to 108 days. After hot-pressing, the halite displays a foam texture. Some porosity remained along the grain boundaries, the size and distribution of which appears to impact significantly on the resulting grain size, growth mechanism and kinetics of halite grain growth. Halite grain growth was found to be well described by the normal grain growth equation: d^(1/n)-d0^(1/n)=k0(t-t0)exp(-H/RT) where t is the duration of the growth period, t0 is the time at which normal growth begins, d is the grain size, d0 is the grain size at t0, k0 is a constant, H is the activation enthalpy for the growth controlling process, R is the universal gas constant,T is temperature and n is a growth constant. At 330 °-511 °C, the data is best described by n = 0.25 indicating growth controlled by surface diffusion around pores that lie on the grain boundaries. An activation enthalpy of 122±34 kJ/mol was obtained using the grain size data from these data sets. At 600 °C the data is best described by n = 0.5, suggesting that a transition to interface controlled growth takes place between 511 °C and 600 °C. To investigate the impact of porosity, the Zener parameter (Z = pore size/pore volume fraction) was determined for individual grains in 10 samples. A general trend of increasing with increasing halite grain size is observed, indicating pore elimination keeps pace with pore accumulation in the growing grains. In some samples, the largest grains display a decrease in the Zener parameter corresponding with an increase in pore volume fraction. These grains are interpreted as having experienced a short-lived, abnormal growth phase shortly after t0 during which pore accumulation outpaced pore elimination. A model of pore controlled grain growth is proposed with a view to explaining these observations. In Part II, calcite + halite aggregates of constant volume fraction (0.60 calcite : 0.40 halite) and varying calcite clast size (6 μm 361 μm) were axially deformed to <1% bulk strain at room temperature in a neutron diffraction beamline. Elastic strain and stress in each phase was determined as a function of load from the neutron diffraction data. The strain (and stress) behaviour correlates well with the microstructural parameters: 1) halite mean free path and 2) calcite contiguity. Both phases behaved elastically up to aggregate axial stresses of 20-37 MPa, above these stresses the halite yielded plastically while the calcite remained elastic. Once yielding began, the rate of enhanced load transfer from halite to calcite with increasing applied load decreased with halite mean free path and increased calcite with contiguity. A Hall-Petch relationship between halite mean free path and aggregate yield stress was observed.

We report changes in the intergranular material and grain morphology of YBa2Cu3O7-x during cyclic anneals between 780 and 980 ºC in oxygen at atmospheric pressure. Two endothermic reactions were detected: (a) the eutectic reaction of YBa2Cu3O7-x with CuO and BaCuO2 at 900 ºC (enthalpy ΔHa) and (b) the peritectic reaction of YBa2Cu3O7-x with CuO at 950 ºC (ΔHb). During the first anneal, only reaction (b) is detected, and although it should only occur if there is an excess of CuO, its signature is present in all published data. Cyclic annealing causes a monotonic decrease in ΔHb and an increase in ΔHa, larger average grain sizes, and greater volume fraction of the superconducting phase. A steady state is reached after 10 cycles at which point ΔHb = 0. We propose a model that explains the origin of the intergranular CuO and the changes in the intergranular material composition with cyclic annealing.

Nanocrystalline materials are being explored as potential off-chip interconnects materials for next generation microelectronics packaging. Mechanical behavior and deformation mechanisms in nanocrystalline copper and nickel have been explored. Nanostructured copper interconnections exhibit better fatigue life as compared to microcrystalline copper interconnects at a pitch of 100 and #956;m and lower. Nanocrystalline copper is quite stable upto 100 oC whereas nickel is stable even up to 400 oC. Grain boundary (GB) diffusion along with grain rotation and coalescence has been identified as the grain growth mechanism. Ultimate tensile and yield strength of nanocrystalline (nc) Cu and Ni are atleast 5 times higher than microcrystalline counterparts. Considerable amount of plastic deformation has been observed and the fracture is ductile in nature. Fracture surfaces show dimples much larger than grain size and stretching between dimples indicates localized plastic deformation. Activation energies for creep are close to GB diffusion activation energies indicating GB diffusion creep. Creep rupture at 45o to the loading axis and fracture surface shows lot of voiding and ductile kind of fracture. Grain rotation and coalescence along direction of maximum resolved shear stress plays an important role during creep. Grain refinement enhances the endurance limit and hence high cycle fatigue life. However, a deteriorating effect of grain refinement has been observed on low cycle fatigue life. This is because of the ease of crack initiation in nanomaterials. Persistent slip bands (PSBs) at an angle of 45o to loading axis are observed at higher strain ranges (> 1% for nc- Cu) with a width of about 50 nm. No relationship has been observed between PSBs and crack initiation. A non-recrystallization annealing treatment, 100 oC/ 2 hrs for nc- Cu and 250 oC/ 2 hrs for nc- Ni has been shown to improve the LCF life without lowering the strength much. Fatigue crack growth resistance is higher in nc- Cu and Ni compared to their microcrystalline counterparts. This is due to crack deflection at GBs leading to a tortuous crack path. Nanomaterials exhibit higher threshold stress intensity factors and effective threshold stress intensity is proportional to the elastic modulus of the material.

abstract: Thin films of ever reducing thickness are used in a plethora of applications and their performance is highly dependent on their microstructure. Computer simulations could then play a vital role in predicting the microstructure of thin films as a function of processing conditions. FACET is one such software tool designed by our research group to model polycrystalline thin film growth, including texture evolution and grain growth of polycrystalline films in 2D. Several modifications to the original FACET code were done to enhance its usability and accuracy. Simulations of sputtered silver thin films are presented here with FACET 2.0 with qualitative and semi-quantitative comparisons with previously published experimental results. Comparisons of grain size, texture and film thickness between simulations and experiments are presented which describe growth modes due to various deposition factors like flux angle and substrate temperature. These simulations provide reasonable agreement with the experimental data over a diverse range of process parameters. Preliminary experiments in depositions of Silver films are also attempted with varying substrates and thickness in order to generate complementary experimental and simulation studies of microstructure evolution. Overall, based on the comparisons, FACET provides interesting insights into thin film growth processes, and the effects of various deposition conditions on thin film structure and microstructure. Lastly, simple molecular dynamics simulations of deposition on bi-crystals are attempted for gaining insight into texture based grain competition during film growth. These simulations predict texture based grain coarsening mechanisms like twinning and grain boundary migration that have been commonly reported in FCC films. / Dissertation/Thesis / Ph.D. Materials Science and Engineering 2011

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An investigation of austenite grain growth of two bearing steel grades; 100Cr6 and100CrMnMoSi8-4-6 is performed. Austenitization treatments were performed between 860°C and 1200 °C for 5 minutes to 5 hours and the grain size was determined for each sample.Grain boundary etching was carried out using a water based, picric-acid etchant. Generally,100CrMnMoSi8-4-6 was harder to etch than 100Cr6. Therefore, a precipitation heattreatment was performed in order to facilitate etching of prior austenite grain boundaries in100CrMnMoSi8-4-6. The precipitation treatment was found to be effective. However, theprecipitation heat treatment was not suitable for 100Cr6 as the grain size increased duringthe precipitation heat treatment.Light optical microscope equipped with a camera was utilized to take micrographs for grainsize evaluation. Jeffries' standard procedure according to ASTM E112-96 was used tomeasure the grain size. The results shows that the austenite grain size increases withtemperature and time as expected. The experimental data was fitted to a well-known graingrowth model. The model only worked for the temperatures investigated and could not bemade to fit different temperatures.Local grain size variation was studied and its influence on fatigue properties was evaluated.The result showed that variation in local grain size can significantly alter the fatigueproperties. The findings are only theoretical and have not been tested practically.Two different spheroidization heat treatments and one homogenization heat treatmentwere performed. Both spheroidization heat treatments investigated exhibited similar grainsize. The homogenization heat treatment reduced the local grain size variation.Homogenization treatment prior to the spheroidization treatments did not increase ordecrease the grain size. The long heating, holding and cooling times in the secondspheroidization heat treatment is probably the reason for the lack of grain refinementcompared to the first spheroidization heat treatment. The grains had time to grow to theinitial austenite grain size during each cycle.