Orientador: Eduardo Carlos Bianchi / Banca: Hamilton José de Mello / Banca: Carlos Elias da Silva Junior / Resumo: A retificação é um dos processos mais importantes quando deseja-se atribuir extrema precisão, acabamento e qualidade a superfície da peça, sendo amplamente utilizado na indústria, atribui-se suas características a um processo de usinagem que emprega um rebolo com grãos abrasivos girando em alta velocidade para remover material. Suas aplicações consistem especialmente no final da cadeia produtiva, onde a retificação normalmente representa o último processo por onde a peça irá passar. O rebolo é constituído de grãos abrasivos e poros, unidos por um material aglomerante (ligante), formando uma estrutura abrasiva. Todavia, os rebolos podem possuir diferentes propriedades, uma vez que a dureza dos grãos abrasivos, resistência à abrasão, estrutura cristalina, forma, tamanho e friabilidade podem afetar a durabilidade e o desempenho do abrasivo. Assim, se faz muito importante a escolha correta do rebolo, pois suas propriedades influenciarão diretamente na produtividade e na qualidade da peça que é possível se obter com a utilização deste, levando em consideração os parâmetros do processo e o material a ser retificado. A seleção do material do grão abrasivo mais apropriado para cada operação tem que ser embasada de acordo com o material a ser retificado, além de possuir uma relação custo-benefício aplicável industrialmente. Fluidos de corte lubrificam e refrigeram a zona de corte, porém são prejudiciais ao meio ambiente e aos seres humanos, adicionando custos à indústria. Atrelado a i... (Resumo completo, clicar acesso eletrônico abaixo) / Abstract: Grinding is one of the most important processes when it is desired to assign extreme precision, finish and quality to the workpiece surface, being widely used in industry, its characteristics are attributed to a machining process that employs an abrasive grinding wheel spinning at high speed to remove material. Its applications consist especially at the end of the production chain, where grinding usually represents the last process through which the part will pass. The grinding wheel consists of abrasive grains and pores, joined by a binder material, forming an abrasive structure. However, the grinding wheels may have different properties, since abrasive grain hardness, abrasion resistance, crystalline structure, shape, size and friability can affect the durability and performance of the abrasive. Thus, it is very important to choose the correct grinding wheel because its properties will directly influence the productivity and quality of the part that can be obtained with the use of this one, taking into account the parameters of the process and the material to be grinding. The selection of the most suitable abrasive material for each operation has to be based on the material to be rectified, besides having an industrially applicable cost-benefit ratio. Cutting fluids lubricate and cool the cutting zone, however they are harmful to the environment and humans, adding costs to the industry. Linked to this, an effective and relatively inexpensive method of controlling corrosion ... (Complete abstract click electronic access below) / Mestre

Orientador: Paulo Roberto de Aguiar / Banca: José Alfredo Covolan Ulson / Banca: Fabricio Guimarães Baptista / Banca: Arthur Alves Fiocchi / Banca: Alessandro Roger Rodrigues / Resumo: O processo de retificação é um processo amplamente utilizado para produzir formas complexas e tolerâncias precisas em peças que são necessárias especialmente para a fabricação de componentes de engenharia. A retificação é um processo de manufatura situado na parte final da cadeia de usinagem, consistindo em uma operação de remoção de material da superfície da peça usinada e utiliza como ferramenta de corte o rebolo. No decorrer do processo de retificação a ferramenta de corte sofre desgaste e com isso, torna-se necessária a realização do processo de dressagem, cuja finalidade é restaurar a eficiência de corte do rebolo. A grande dificuldade no processo de retificação consiste em identificar o momento correto para a realização da dressagem e, para isso torna-se necessária a realização do monitoramento da ferramenta de corte (rebolo). Neste contexto, no presente trabalho desenvolveu-se uma técnica inovadora de diagnóstico da integridade superficial do rebolo, durante o processo de dressagem, baseada em imagens acústicas obtidas por meio de diafragma piezelétrico. Para isso, foram realizadas marcas (falhas) em um rebolo e, posteriormente, realizados ensaios com várias profundidades de dressagem, coletando sinais por meio de um sensor de emissão acústica e de um diafragma piezelétrico. Com base nesses sinais, foram avaliadas bandas de frequência para a obtenção de imagens acústicas que representassem com maior fidelidade e nitidez as marcas impressas no rebolo. Por fim, ambos os ... (Resumo completo, clicar acesso eletrônico abaixo) / Abstract: The abrasive machining process is a widely used process for producing complex shapes in work pieces and for providing precise tolerances that are especially required for the production of engineering components. Grinding is a manufacturing process placed at the end of the machining chain, consisting of an operation to remove material from the surface of the machined part and uses grinding wheels as a cutting tool. During the grinding process the cutting tool suffers wear and tear, and thus, it is necessary to perform the dressing process, whose purpose is to restore the cutting efficiency of the grinding wheel. The great difficulty in the grinding process is to identify the correct moment to perform the dressing, and for that reason, it is necessary to perform the monitoring of the cutting tool (grinding wheel). In this context, the present work made possible the development of an innovative technique to diagnose the surface integrity of the grinding wheel, during the dressing process, based on acoustic maps obtained through the piezoelectric diaphragm. Therefore, some patterns (marks) on a grinding wheel were performed and, later, tests were carried out with several dressing depths, acquiring signals from a commercial acoustic emission sensor and a piezoelectric diaphragm. Based on these signals, frequency bands were evaluated to obtain acoustic maps that represented with more fidelity and sharpness the marks inserted in the grinding wheel. Finally, both sensors (acoustic em... (Complete abstract click electronic access below) / Doutor

Analytical force and dynamic models for material removal processes such as end and face milling do not account for material and process related uncertainties such as tool wear, tool breakage and material inhomogeneity. Optimization of material removal processes thus requires not only optimal process planning using analytical models but also on-line monitoring of the process so that adjustments, if needed, can be initiated to maximize the productivity or to avoid damaging expensive parts. In this thesis, a Polyvinylidene Fluoride (PVDF) sensor based process monitoring method that is independent of the cutting conditions and workpiece material is developed for measuring the cutting forces and/or torque in milling. The research includes the development of methods and hardware for wireless acquisition of time-varying strain signals from PVDF sensor-instrumented milling tools rotating at high speeds and transformation of the strains into the measurand of interest using quantitative physics-based models of the measurement system. Very good agreement between the measurements from the low cost PVDF sensors and the current industry standard, piezoelectric dynamometer, has been achieved. Three PVDF sensor rosettes are proposed for measuring various strain components of interest and are shown to outperform their metal foil strain gauge counterparts with significantly higher sensitivity and signal to noise ratio. In addition, a computationally efficient algorithm for milling chatter recognition that can adapt to different cutting conditions and workpiece geometry variations based on the measured cutting forces/torque signals is proposed and evaluated. A novel complex exponential model based chatter frequency estimation algorithm is also developed and validated. The chatter detection algorithm can detect chatter before chatter marks appear on the workpiece and the chatter frequency estimation algorithm is shown to capture the chatter frequency with the same accuracy as the Fast Fourier Transform (FFT). The computational cost of the chatter detection algorithm increases linearly with data size and the chatter frequency estimation algorithm, with properly chosen parameters, is shown to perform 10 times faster than the FFT. Both the cutting forces/torque measurement methodology and the chatter detection algorithm have great potential for shop floor application. The cutting forces/torque measurement system can be integrated with adaptive feedback controllers for process optimization and can also be extended to the measurement of other physical phenomena.

A theory of the sub-ambient fluid pressure phenomenon observed during the wet sliding of a disk on a polymeric pad is presented. Two-dimensional fluid pressure mapping using membrane pressure sensors reveals a large, asymmetrical sub-ambient pressure region occupying about 70 percent of the disk-pad contact area. At the same time, a small positive pressure region exists near the trailing edge of the disk. This phenomenon is believed to be present during chemical mechanical polishing (CMP) and can contribute to the contact pressure, affecting the material removal rate and removal uniformity. Depending on the load and pad speed, the real contact pressure can be more than 2 times the nominal contact pressure due to the applied load. Tilt measurements of the disk carried out by a capacitive sensing technique indicate that the disk is tilted towards the leading edge and pad center when the pad is rotating. In addition, wafer bow is found to be less than 2 m and wafer tilt with respect to the wafer carrier is 5 to 7 m in the CMP configuration. A two-dimensional mixed-lubrication model based on the Reynolds equation is developed and solved using a finite differencing scheme. The pad is modeled as two layers: a top asperity layer described by the Greenwood and Williamson equation, and the bulk pad as linearly elastic. The orientation of the disk is determined by balancing the fluid and solid forces acting on it and solving using a modified Newtons method. It is found that the tilt of the disk and the pad topography play important roles in the distribution of fluid pressure through affecting the film thickness distribution. For a pad with severe topography, minimum and maximum fluid pressures of -90 kPa and +51 kPa respectively are detected. The model is able to recreate the experimental pressure maps. A material removal rate model based on mechanical abrasion and statistics has also been developed. Comparisons of model predictions and silicon oxide polishing results show agreement.

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In this study, the new predictive model for the micro-grinding process was developed by consolidating mechanical and thermal effects within the single grit interaction model at microscale material removal. The size effect of micro-machining was also included in the proposed model. In order to assess thermal effects, the heat partition ratio was experimentally calibrated and compared with the prediction of the Hahn model. Then, on the basis of this predictive model, a comparison between experimental data and analytical predictions was conducted in view of the overall micro-grinding forces in the x and y directions. Although there are deviations in the predicted micro-grinding forces at low depths of cut, these differences are reduced as the depth of cut increases. On the other hand, the optimization of micro machine tools was performed on the basis of the proposed design strategy. Individual mathematical modeling of key parameters such as volumetric error, machine working space, and static, thermal, and dynamic stiffness were conducted and supplemented with experimental analysis using a hammer impact test. These computations yield the optimal size of miniaturized machine tools with the technical information of other parameters.

This project is a fundamental proof of concept to look at the feasibility of using field activated abrasive particles to achieve material removal on a substrate. There are a few different goals for this project. The first goal is to prove through visualization that particle movement can be influenced and controlled by changes in electric field. The second goal is to fundamentally prove that particles controlled by electric field can remove material from a substrate. Third, it should be shown that changes in electric field can control the amount of material being removed in a given amount of time. A mathematical model will be presented which predicts metallic material removal rates based on changes in electric field strength. In this project, a technique combining concepts from electrokinetics, electrochemical mechanical planarization, and contact mechanics is proposed, aiming at enhancing planarization performance. By introducing an AC electric field with a DC offset, we try to achieve not only a better control of metallic material removal but also more flexible manipulation of the dynamic behaviour of abrasive particles. The presence of electric field will lead to electrokinetic phenomena including electroosmotic flow of an electrolyte solution and electrophoretic motion of abrasive particles. As a result, we aim to improve both the mechanical performance of planarization that is largely determined by the polishing parameters (e.g. down pressure, rotation speed, pads, and types of abrasives) and the chemical performance of planarization that is governed by selective and collective reactions of different chemical ingrediants of the slurry with the sample surface. The aim is also to understand and improve the interactions of abrasive particles with the sample.

Thesis (M.Sc. (Hons)) -- University of Western Sydney, Nepean, 2000. / "Thesis submitted for the degree of Master of Engineering (Hons), School of Mechatronic, Computer & Electrical Engineering, University of Western Sydney, Nepean" Bibliography : leaves 129-141.

Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Danyluk, Steven; Committee Member: Butler, David; Committee Member: Hesketh, Peter; Committee Member: Yoda, Minami. Part of the SMARTech Electronic Thesis and Dissertation Collection.