Taiwan IC assembly industry has became mature. from survey of World Journal about the top 100 entrepreneurs,average profit is around 1.3%, that reached the bottom of valley within these 17 years and it drive the industry into low cost competitive environment with fast cost erosion, it announces ¡§the low profit times is coming¡¨. IC assembly house entry barrier is low. normally 50 sets wire bond are treated as a start point with 10 millions NTD investment and products covered dual in line,small outline,quad flat package,tape carrier package,ball grid array,image sensor,chip on film,ball bumping.While similar products is produced within competitors, the low cost strategy is selected.it caused Amkor / ASE / SPIL trying to merge some small companies in these years, aim to reach economical scale and cost benefits .in the same time,Main China ic-assembly capability is built and the impact will be appeared gradually . by means of suitable competition theory,we select 8 major issues as study topics and through interview with several ic assembly president /vice-presidents, this study aim to find out the competitive advantage and workable managerial strategy tool in this low profit times,and hope to contribute to Taiwan IC assembly house.

As the IC assembly technology fast developing in the modern electrical industries. Demand of high performance electric product is glowing up day by day. New generation of the hybrid IC assembly package has become the major role recently. In order to prevent the package defects occurring in end customer sites, in this paper we try to improve the IC assembly method by using a totally different process to fix the passive component on a BGA substrate. We found that the passive component can be proceeded the current gold wire bonding process. In case of the Hybrid BGA with the current passive component attaching process, we can find the thermal effect during the surface mount process. Since the solder can be melt every time during each heating process. Therefore, we plan to improve it without solder attachment. The new improvement is to fix the passive component by a non-conductive thermal cure glue. The glue can be done in one time cure, thus the further process would not influence the quality of passive component. However in the evaluation experiment, the component coated by Gold is the best choice, but we intend to just put it in a comparison model because of the cost consideration. Both works on passive component coated by Gold and Solder were proved. The customer support for the further study on the real products is suggested.