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The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow ProcessChang, Chih-Fang 06 September 2000 (has links)
The main aim of this study is to extending the holographic interferometry technique to measure the effect of the temperature ramp-up rate on the warpage of IC packages in the IR-reflow process . It is noted that both the warpage and the ambient temperature change can cause image fringes. Therefore, an auxiliary sphere is used to identify the fringe numbers caused by the ambient temperature change during the experiment. Then, the Taguchi method will be deduced to study the effect of the temperature ramp-up rate and peak waiting temperature on the warpage of PBGA package in the IR-reflow process.
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The experimental investigation of structure on interfacial-adhesive effectivenessLin, Wen-Yu 12 July 2002 (has links)
The main aim of this paper is using the moiré interferometry to measure interface of the IC package structure materials. The moiré interferometry with high sensitivity can use the fringes to measure displacement field in small structure materials.
The objective of this study is to obtain displacement fields the interfacial adhesion of the substrate and epoxy by using the moiré interferometry. The peeling strain, shearing strain and tensile strain at the interface adhesion are distinguished by utilizing the experiment of data of u-displacement fields and v-displacement field. Finally, a turning point of failure, in found.
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Board Level Reliability of IC Package Under Cyclic Thermomechanical LoadingChen, Sheng-Wei 16 August 2002 (has links)
Abstract
The study on SOC of article is one of package way for CSP. The SOC transmits messages by Solder Ball joining the board.
It can make the volume of product decrease, but the reliability reduces on using. So the reliability of Solder Ball is a very important topic for study.
The article for Solder Ball uses the Mixed-Viscoplastic way to simulate the warpage state of SOC when the temperature of Solder Ball rises by ANSYS. Then using the Viscoplastic material parameter simulates the acts by TCT experiment and checks the suitable Fatigue Model to get the analysis results turn into the reliability data. The reliability data puts to the proof with the experimental reliability data and compares differences to other documents.
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A Study on The Effect of The Warpage And Stress of PBGA Caused by The Variations of Mechanical Properties of Materials in IR-reflow ProcessWANG, CHING-CHUN 20 July 2003 (has links)
The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
At first, taking advantage of the package symmetry only one quarter of the package was modeled by MSC. Marc. The influence of heat transfer was considered by comparing the results of Coupled mechanical-heat transfer analysis and Mechanical analysis. In the second part, the coefficient of thermal expansions and elastic modulus of molding compound and substrate are selected as the four control factors, and the influence of the four control factors to the warpage and von Mises stress were observed. At last, emperical formulas to predicted warpage and von Mises stress values were obtained.
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Challenges of implementing RSS barcodes on hospital unit dose blisters /Quiles, Rolando. January 2007 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 2007. / Typescript. Includes bibliographical references.
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A case study to determine the feasibility of on-line ink jet printing of bar codes onto corrugated shipping containers /Lapinski, Richard Allen. January 1995 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1995. / Typescript. Bibliography:
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Návrh dvougeneračního rodinného domuŠtěpán, Jan January 2016 (has links)
This diploma thesis deals with design of house for living of two generations. The house is designed with the form of wooden frame structure with the extensive green roof system. In the first part, the thesis is focused to issues of energy efficiency and passive house standard of living. In the next part is described topic of the green roof. In the practical part is described selection of structural system, design of composition structures including requirement for implementation of construction works. Furthermore is performed thermal technical assessment of composition structures and calculation of energy balance according to PHPP. In the end is a brief description of static design of ceiling structure. The drawing part includes project and manufacturing documentation including solutions of important construction details.
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Using email reminders to increase virtual attendance for middle school studentsCline, Lauren 01 May 2022 (has links)
As the COVID-19 pandemic progressed, professionals in the field of behavior analysis and education have continually asked how to help students access quality education while still keeping them safe and healthy. There have been multiple options presented that allow students to access their education, such as being fully in-person, fully virtual, and a hybrid option that includes both in-person and virtual learning. Due to different factors, families may choose a full virtual option for their children. But then the question becomes, “how do we make sure they log into their classes on time?” School attendance continues to be an issue across the country and adding in a virtual element to education is something that hasn’t been dealt with in a large-scale effort before. The current study attempted to increase attendance for middle school students that were learning in a full virtual format by means of sending email reminders to the student and their parents, setting daily goals with the student, and providing positive reinforcement by delivering items to the student’s home. Results indicated that this specific intervention package, as outlined, was not an effective method to help middle school students increase their virtual class attendance. Future studies should focus on other intervention packages that can help students learning in a full virtual format to attend their Zoom sessions and access the quality education they deserve.
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Two kriging models, and the expanded readsold packageWang, Xiang January 1986 (has links)
No description available.
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The GAMESS-UK electronic structure package: algorithms, developments and applications.Guest, M.F., Bush, I.J., Van Dam, H.J.J., Sherwood, P., Thomas, J.M.H., Van Lenthe, J.H., Havenith, R.W.A., Kendrick, John January 2005 (has links)
No / A description of the ab initio quantum chemistry package GAMESS-UK is presented. The package offers a wide range of quantum mechanical wavefunctions, capable of treating systems ranging from closed-shell molecules through to the species involved in complex reaction mechanisms. The availability of a wide variety of correlation methods provides the necessary functionality to tackle a number of chemically important tasks, ranging from geometry optimization and transition-state location to the treatment of solvation effects and the prediction of excited state spectra. With the availability of relativistic ECPs and the development of ZORA, such calculations may be performed on the entire Periodic Table, including the lanthanides. Emphasis is given to the DFT module, which has been extensively developed in recent years, and a number of other, novel features of the program. The parallelization strategy used in the program is outlined, and detailed speedup results are given. Applications of the code in the areas of enzyme and zeolite catalysis and in spectroscopy are described.
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