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A financially based automated advisor for design for test strategy generationDislis, Chryssula January 1992 (has links)
No description available.
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Design and analysis of computational models for programmable VLSI processor arraysManning, L. J. January 1988 (has links)
No description available.
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Parametrised design of regular processor arraysLuk, W. January 1988 (has links)
No description available.
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A dynamic power optimization methodology for gigabit electrical linksKramer, Joshua. January 2007 (has links)
Thesis (Ph.D.)--University of Delaware, 2007. / Principal faculty advisor: Fouad Kiamilev, Dept. of Electrical and Computer Engineering. Includes bibliographical references.
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Analysis and modeling of coplanar on-chip interconnects on silicon substratesLuoh, Yi 25 November 2003 (has links)
The electrical behavior of on-chip interconnects has become a dominant factor
in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular,
the frequency-dependent loss mechanisms in heavily-doped silicon substrates can
have a large influence on the transmission characteristics of on-chip interconnects.
To optimize the performance of the integrated circuit, efficient interconnect models
should be available in the design environment. Interconnect models in the form
of closed-form expressions or ideal element equivalent circuits are often desirable
for fast simulation and circuit optimization. This thesis work is concentrated on
the analysis and the methodology for developing closed-form expressions for the
frequency-dependent line parameters R(��), L(��), G(��), and C(��) for coplanar-type
on-chip interconnects on silicon substrates. In addition, the closed-form expressions
for the frequency-dependent series impedance parameters are extended to general
interconnect on-chip structures on multilayer substrates.
The complete solutions of the frequency-dependent line parameters are formulated
in terms of corresponding static (lossless) configurations for which closed-form
solutions are readily available. The closed-form expressions for the frequency-dependent series impedance parameters, R(��) and L(��), are obtained from a generalized complex image approach together with a surface impedance formulation including the effects of the frequency-dependent horizontal currents (eddy currents)
in the multilayer lossy silicon substrates. Results for single and coupled microstrips
on multilayer silicon substrates are shown over a broadband frequency range of 20
GHz and compared with full-wave electromagnetic solutions. For single and coupled
coplanar on-chip interconnects, the results are compared with quasi-analytical
solutions and validated with available measurement data. The frequency-dependent
shunt admittance parameters, G(��) and C(��), are derived in terms of low- and
high-frequency asymptotic solutions of the equivalent circuit model combined with
the complex image method. Comparisons and validation with measurements are
also presented. / Graduation date: 2004
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Analysis and modeling of microstrip on-chip interconnects on silicon substrateLan, Hai 14 September 2001 (has links)
The electrical performance of on-chip interconnects has become a limiting factor
to the performance of modern integrated circuits including RFICs, mixed-signal
circuits, as well as high-speed VLSI circuits due to increasing operating frequencies,
chip areas, and integration densities. It is advantageous to have fast and accurate
closed-form expressions for the characteristics of on-chip interconnects to facilitate
fast simulation and computer-aided design (CAD) of integrated circuits. This thesis
work is mainly concerned with the analysis and the methodology of developing
closed-form expressions for the frequency-dependent line parameters R(��), L(��),
G(��), and C(��) for microstrip-type on-chip interconnects on silicon substrate.
The complete solutions of the frequency-dependent line parameters are formulated
in terms of corresponding lossless/static configurations for both single and
coupled microstrip-type on-chip interconnects. The series impedance parameters
are developed using a complex image approach, which represents the complicated
loss effects in the semiconducting silicon substrate. The shunt admittance parameters
are developed using low- and high-frequency asymptotic solutions based on
the shunt equivalent circuit models. The closed-form expressions are shown to be
in good agreement with full-wave and quasi-static electromagnetic solutions. Based
on the proposed closed-form solutions, a new on-chip interconnect extractor tool,
CELERITY, is implemented. It is shown that the new tool can significantly reduce
the simulation time compared with a quasi-static EM-based tool. The proposed
extraction technique should be very useful in the design of silicon-based integrated
circuits. / Graduation date: 2002
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Analysis and optimization for global interconnects for gigascale integration (GSI)Naeemi, Azad, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2004. Directed by James D. Meindl. / Vita. Includes bibliographical references (leaves 163-169).
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Opportunities and limitations of three-dimensional integration for interconnect designJoyner, James W. 08 1900 (has links)
No description available.
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Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chipsGupta, Piyush. January 2004 (has links) (PDF)
Thesis (M.S.)--Materials Science and Engineering, Georgia Institute of Technology, 2005. / Suresh, Committee Member ; C.P. Wong, Committee Member ; Rao R. Tummala, Committee Chair. Includes bibliographical references.
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Reliability study on the via of dual damascene Cu interconnectsBaek, Won-chong, January 1900 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.
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