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Comparação de ferramentas para modelamento de indutores na tecnologia CMOS. / Comparison of tools for inductors model in the CMOS technology.Anjos, Angélica dos 18 April 2007 (has links)
Duas ferramentas para modelamento de indutores planares, retangulares e integrados e as equações analíticas implementadas em um software, foram estudadas e analisadas, para determinar qual é a mais apropriada, ou seja, aquela que fornece os resultados mais próximos de medidas experimentais, com menor custo, maior velocidade, etc. Indutores planares integrados apresentam limitações severas em seu uso. As duas principais são: o baixo valor do fator de qualidade, que limita o ganho e a banda nos amplificadores e filtros que os utilizam; e a dificuldade no seu modelamento e na determinação dos parâmetros que os caracterizam. Apesar das dificuldades no uso destes dispositivos, eles são aplicados em diversos sistemas, tais como transceptores que operam em rádio freqüências. Nestes sistemas, indutores são necessários e sua integração é essencial para se obter soluções completamente integradas. As ferramentas estudadas para o modelamento de indutores neste trabalho foram: ASITIC e SONNET. As equações analíticas foram implementadas no MATLAB. A comparação entre as ferramentas e as equações foi feita por meio de cinco indutores construídos e medidos. Os indutores foram fabricados em tecnologia CMOS de 0,35 µm com quatro camadas de metal. Para realizar a correta comparação entre os resultados simulados e as medidas elétricas, reduzindo ao máximo a interferência de elementos parasitas (inclusos pelos pads), os indutores foram inseridos em estruturas de teste. Estruturas de caracterização apropriadas foram também projetadas para permitir a eliminação do efeito das estruturas de teste sobre as medidas. / Two modeling tools for integrated planar square inductors and one software implementing analytical relations, were studied and analyzed, to determine which is the most appropriate, that is, the tools that will supply the closest results to experimental measurements with, lower costs, higher speed, etc. Integrated planar inductors present severe limitations in their use. The two main limitations are: the low value of the quality factor, that affects the gain and the band of amplifiers and filters where they are used; and the difficulty in modeling and determining of their parameters. Inspire of the difficulties in the use of these devices, they are applied in many systems, such as transceivers that operate in radio frequency. In these systems, inductors are necessary and their integration is essential to obtain completely integrated solutions. In this work the studied tools for inductor modeling were: ASITIC and SONNET. The analytical relations were implementing in MATLAB. The comparisons between the tools were made through five implemented and measured inductors. The inductors were fabricated in a CMOS 0.35 µm technology with four metal layers. In order to carry out the correct comparison between the modeled results and the electric measurements, minimizing the interference of pad parasitic elements, the inductors were inserted within appropriate test structures. Characterization structures were also implemented to allow the elimination of the test structure effects on the measurements.
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Comparação de ferramentas para modelamento de indutores na tecnologia CMOS. / Comparison of tools for inductors model in the CMOS technology.Angélica dos Anjos 18 April 2007 (has links)
Duas ferramentas para modelamento de indutores planares, retangulares e integrados e as equações analíticas implementadas em um software, foram estudadas e analisadas, para determinar qual é a mais apropriada, ou seja, aquela que fornece os resultados mais próximos de medidas experimentais, com menor custo, maior velocidade, etc. Indutores planares integrados apresentam limitações severas em seu uso. As duas principais são: o baixo valor do fator de qualidade, que limita o ganho e a banda nos amplificadores e filtros que os utilizam; e a dificuldade no seu modelamento e na determinação dos parâmetros que os caracterizam. Apesar das dificuldades no uso destes dispositivos, eles são aplicados em diversos sistemas, tais como transceptores que operam em rádio freqüências. Nestes sistemas, indutores são necessários e sua integração é essencial para se obter soluções completamente integradas. As ferramentas estudadas para o modelamento de indutores neste trabalho foram: ASITIC e SONNET. As equações analíticas foram implementadas no MATLAB. A comparação entre as ferramentas e as equações foi feita por meio de cinco indutores construídos e medidos. Os indutores foram fabricados em tecnologia CMOS de 0,35 µm com quatro camadas de metal. Para realizar a correta comparação entre os resultados simulados e as medidas elétricas, reduzindo ao máximo a interferência de elementos parasitas (inclusos pelos pads), os indutores foram inseridos em estruturas de teste. Estruturas de caracterização apropriadas foram também projetadas para permitir a eliminação do efeito das estruturas de teste sobre as medidas. / Two modeling tools for integrated planar square inductors and one software implementing analytical relations, were studied and analyzed, to determine which is the most appropriate, that is, the tools that will supply the closest results to experimental measurements with, lower costs, higher speed, etc. Integrated planar inductors present severe limitations in their use. The two main limitations are: the low value of the quality factor, that affects the gain and the band of amplifiers and filters where they are used; and the difficulty in modeling and determining of their parameters. Inspire of the difficulties in the use of these devices, they are applied in many systems, such as transceivers that operate in radio frequency. In these systems, inductors are necessary and their integration is essential to obtain completely integrated solutions. In this work the studied tools for inductor modeling were: ASITIC and SONNET. The analytical relations were implementing in MATLAB. The comparisons between the tools were made through five implemented and measured inductors. The inductors were fabricated in a CMOS 0.35 µm technology with four metal layers. In order to carry out the correct comparison between the modeled results and the electric measurements, minimizing the interference of pad parasitic elements, the inductors were inserted within appropriate test structures. Characterization structures were also implemented to allow the elimination of the test structure effects on the measurements.
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Integrated Inductors with Micro-Patterned Magnetic Thin Films for RF and Power ApplicationsJanuary 2013 (has links)
abstract: With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core material, amorphous Co-Zr-Ta-B, was incorporated into on-chip and in-package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor. With two layers of 500 nm Co-Zr-Ta-B films a 3.5X increase in inductance and a 3.9X increase in quality factor over inductors without magnetic films were measured at frequencies as high as 1 GHz. By laminating technology, up to 9.1X increase in inductance and more than 5X increase in quality factor (Q) were obtained from stripline inductors incorporated with 50 nm by 10 laminated films with a peak Q at 300 MHz. It was also demonstrated that this peak Q can be pushed towards high frequency as far as 1GHz by a combination of patterning magnetic films into fine bars and laminations. The role of magnetic vias in magnetic flux and eddy current control was investigated by both simulation and experiment using different patterning techniques and by altering the magnetic via width. Finger-shaped magnetic vias were designed and integrated into on-chip RF inductors improving the frequency of peak quality factor from 400 MHz to 800 MHz without sacrificing inductance enhancement. Eddy current and magnetic flux density in different areas of magnetic vias were analyzed by HFSS 3D EM simulation. With optimized magnetic vias, high frequency response of up to 2 GHz was achieved. Furthermore, the effect of applied magnetic field on on-chip inductors was investigated for high power applications. It was observed that as applied magnetic field along the hard axis (HA) increases, inductance maintains similar value initially at low fields, but decreases at larger fields until the magnetic films become saturated. The high frequency quality factor showed an opposite trend which is correlated to the reduction of ferromagnetic resonant absorption in the magnetic film. In addition, experiments showed that this field-dependent inductance change varied with different patterned magnetic film structures, including bars/slots and fingers structures. Magnetic properties of Co-Zr-Ta-B films on standard organic package substrates including ABF and polyimide were also characterized. Effects of substrate roughness and stress were analyzed and simulated which provide strategies for integrating Co-Zr-Ta-B into package inductors and improving inductors performance. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on both ABF and polyimide substrates. Maximum 90% inductance increase in hundreds MHz frequency range were achieved in stripline inductors which are suitable for power delivery applications. Spiral inductors with Co-Zr-Ta-B films showed 18% inductance increase with quality factor of 4 at frequency up to 3 GHz. / Dissertation/Thesis / Ph.D. Electrical Engineering 2013
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Integrated InductorsKavimandan, Mandar Dilip January 2008 (has links)
No description available.
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DESIGN, MODELING, FABRICATION AND CHARACTERIZATION OF THREE-DIMENSIONAL FERROMAGNETIC-CORE SOLENOID INDUCTORS IN SU-8 INTERPOSER LAYER FOR EMBEDDED PASSIVE COMPONENT INTEGRATION WITH ACTIVE CHIPSFitch, Robert Carl, Jr. 28 October 2010 (has links)
No description available.
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