abstract: As the microelectronics industry continues to decrease the size of solder joints, each joint will have to carry a greater current density, making atom diffusion due to current flow, electromigration (EM), a problem of ever-increasing severity. The rate of EM damage depends on current density, operating temperature, and the original microstructure of the solder joint, including void volume, grain orientation, and grain size. While numerous studies have investigated the post-mortem effects of EM and have tested a range of current densities and temperatures, none have been able to analyze how the same joint evolves from its initial to final microstructure. This thesis focuses on the study of EM, thermal aging, and thermal cycling in Sn-rich solder joints. Solder joints were either of controlled microstructure and orientation or had trace alloying element additions. Sn grain orientation has been linked to a solder joints’ susceptibility to EM damage, but the precise relationship between orientation and intermetallic (IMC) and void growth has not been deduced. In this research x-ray microtomography was used to nondestructively scan samples and generate 3D reconstructions of both surface and internal features such as interfaces, IMC particles, and voids within a solder joint. Combined with controlled fabrication techniques to create comparable samples and electron backscatter diffraction (EBSD) and energy-dispersive spectroscopy (EDS) analysis for grain orientation and composition analysis, this work shows how grain structure plays a critical role in EM damage and how it differs from damage accrued from thermal effects that occur simultaneously. Unique IMC growth and voiding behaviors are characterized and explained in relation to the solder microstructures that cause their formation and the possible IMC-suppression effects of trace alloying element addition are discussed. / Dissertation/Thesis / Doctoral Dissertation Materials Science and Engineering 2019

Saab Microwave Systems, SMW is a supplier of radar systems. The circuit boards that are operating in their radars have components which solder joints contains lead. However, the EU directive RoHs and WEEE are causing SMW to prepare for a transition to lead free solder joints. The objective of this thesis is to gain deeper knowledge of lead free solder joints. Brittle fractures in solder joints is a type of failure that might increase in a transition to lead free solder joints. The brittle fractures are induced by the creation of the intermetallic phases which are formed during soldering. The amount and composition of the intermetallics affects the mechanical strength of the joint. An intermetallic layer is thickened during heat exposure as during soldering, thermal aging and rework. The focus of this thesis was to investigate how rework affect the brittleness of the lead free solder joint and thereby how the intermetallic layers change depending on chemical composition, design and reflow cycles. Two types of components and two types of solder materials (SnPb and SAC305) were studied. To study the mechanical properties of the joint a shear testing device was used. This is a way of measuring the reliability of the joint when subjected to mechanical shock. The intermetallic layers were examined in a Scanning Electron Microscope and the fracture surfaces were studied in a optical microscope, a scanning electron microscope and a stereomicroscope. The heat spread over the board where examined by soldering thermocouples to the board and plotting the values of time and temperature. The results showed that the rework process did not have any significant impact of the intermetallic growth. The adjecent and distant components were not damaged during rework. A lead free rework process can therefor be preformed successfully at SMW. The intermetallic layers formed at the interface between the a lead free solder and a nickel finish grew faster than an intermetallic layer formed between a leaded solder and a nickel finish. The presence of nickel could therefore have a more negative effect on the intermetallic growth rate for the lead free material compared to the leaded.

<p>Saab Microwave Systems, SMW is a supplier of radar systems. The circuit boards that are operating in their radars have components which solder joints contains lead. However, the EU directive RoHs and WEEE are causing SMW to prepare for a transition to lead free solder joints. The objective of this thesis is to gain deeper knowledge of lead free solder joints.</p><p>Brittle fractures in solder joints is a type of failure that might increase in a transition to lead free solder joints. The brittle fractures are induced by the creation of the intermetallic phases which are formed during soldering. The amount and composition of the intermetallics affects the mechanical strength of the joint. An intermetallic layer is thickened during heat exposure as during soldering, thermal aging and rework.</p><p>The focus of this thesis was to investigate how rework affect the brittleness of the lead free solder joint and thereby how the intermetallic layers change depending on chemical composition, design and reflow cycles. Two types of components and two types of solder materials (SnPb and SAC305) were studied.</p><p>To study the mechanical properties of the joint a shear testing device was used. This is a way of measuring the reliability of the joint when subjected to mechanical shock. The intermetallic layers were examined in a Scanning Electron Microscope and the fracture surfaces were studied in a optical microscope, a scanning electron microscope and a stereomicroscope. The heat spread over the board where examined by soldering thermocouples to the board and plotting the values of time and temperature.</p><p>The results showed that the rework process did not have any significant impact of the intermetallic growth. The adjecent and distant components were not damaged during rework. A lead free rework process can therefor be preformed successfully at SMW. The intermetallic layers formed at the interface between the a lead free solder and a nickel finish grew faster than an intermetallic layer formed between a leaded solder and a nickel finish. The presence of nickel could therefore have a more negative effect on the intermetallic growth rate for the lead free material compared to the leaded.</p>

Les nouvelles technologies mécatroniques permettent de réduire fortement la consommation d'énergie et les émissions des véhicules individuels, en introduisant des ruptures indispensables pour une chaîne de traction électrifiée complémentaire ou alternative aux moteurs thermiques. Les assemblages en électronique de puissance utilisés dans les systèmes alterno-démarreurs emploient des alliages de brasure dont il s'agit de trouver des substituants, sans plomb, en accord avec les normes internationales. Cette thèse contribue à la caractérisation métallurgique et mécanique de deux joints brasés sans plomb innovants riches en étain. Ces joints sont produits industriellement par un procédé de brasage laser qui leur confère une microstructure de solidification très hétérogène, peu reproductible, multiphasée et qui présente un grand nombre de défauts. L'objectif de cette thèse est d'apporter une meilleure compréhension à la tenue mécanique de ces joints brasés au cours du vieillissement thermomécanique des assemblages. Les sollicitations thermiques engendrent des contraintes et des déformations plastiques à cause de la dilatation différentielle qui existe entre les différentes couches des matériaux brasés. Des lois de comportement isotropes ont été identifiées à partir d'une base expérimentale d'essais de traction sur des matériaux massifs. Ces lois, utilisées dans des simulations aux éléments finis, ont permis d'évaluer l'effet négatif du défaut de porosité inhérent au procédé de brasage. Des essais de vieillissement couplés à des observations de l'évolution de la microstructure ont permis de montrer l'influence de l'orientation des grains d'étain sur l'amorçage de fissure. Nous n'avons pas pu proposer de volume élémentaire représentatif du fait de la complexité de la structure. Une méthode inverse a été mise en oeuvre en parallèle de la conception d'un banc d'essai de flexion in-situ sous profilomètre afin de placer les premières briques permettant la caractérisation mécanique de joints brasés industriels. / The new mechatronic technologies can significantly reduce the energy consumption and gas emissions of personal cars, by introducing rupture innovations in electrified powertrains complementarily or alternatively to combustion engines. The power electronics assemblies used in starter-alternator systems use solder joints which need to be substituted with lead-free solder in agreements with international standards. This thesis contributes to the metallurgical and mechanical characterization of two tin-based lead-free solder joints. These joints are produced industrially with a Die Laser Soldering process which leads to heterogeneous solidification microstructures, poorly reproducible, multiphased, and with defects. The objective of this thesis is to provide a better understanding of the solder joints lifetime during thermomechanical aging. Thermal aging generates stresses and plastic deformation due to the mismatch in the coefficients of thermal expansion between the different layers of the assemblies. Isotropic constitutive laws were identified from an experimental database of tensile tests on bulk specimens. Those constitutive laws were used in finite element simulations in order to assess the negative effect of the solder joint porosity, inherent flaw traced back to the soldering process. Aging tests coupled with observations of the microstructure evolution have shown the influence of tin grains orientation on crack initiation. The heterogeneity of the microstructure prevents us from proposing a representative volume element of the materials. An inverse method has been implemented in parallel with the development of an in situ bending test bench under a profilometer in order to build the first steps for the mechanical characterization of industrial solder joints.

<p>A wide variety of phase evolution phenomena observed in solids such as intermetallic growth at the junction between two metals subjected to high temperature, growth of oxide on metal surfaces due to atmospheric exposure and void evolution induced by electromigration in microelectronic devices for example, can be classified as being driven by reaction-diffusion processes. These phase evolution phenomena have a significant impact on material reliability for critical applications, and therefore, there is a requirement for modeling such reaction-diffusion driven phase evolution phenomena. It is difficult to analyze these due to the complexity of modeling the evolving interface between solid phases. Additional complexity is  due to the multi-physics nature of the diffusive and reactive processes. Diffusion in solids is driven by a variety of stimuli such as current, temperature and stress, in addition to the chemical potential. Therefore, there is a need for a model that accounts for the influence of such factors on phase evolution. In this thesis,  a generalized continuum based reaction-diffusion theory for phase and void evolution in solid state is developed. The derivation starts off with generalized interface balance laws for mass, momentum and energy. The thermodynamic entropy inequality for irreversible phase growth is derived for arbitrary anisotropic and inhomogeneous surface stress. These interface relations are combined with governing relations in the material bulk for the temperature, stress, electrical and concentration fields, to develop a general model capable of analyzing and describing phase evolution in solids. This theory is then applied to a variety of intermetallic phase and void evolution phenomena observed in microelectronics.</p> <p><br></p> <p>Electromigration induced voiding in thin metal films is an example of phase evolution that is an important reliability concern in microelectronics. Studies have reported that the electromigration induced void growth rate is inversely related to the adhesion of metal thin films with the base and capping layers. Electromigration experiments are performed on fabricated test devices with Cu thin films with SiNx and TiN capping layers. The observations from electromigration experiments on thin Cu metal films at a range of temperatures indicate that the contribution of interface adhesion strength to electromigration resistance decreases with an increase in temperature. The generalized reaction-diffusion theory developed here is modified to develop an expression to account for the effect of base and passivation layer adhesion and temperature on electromigration resistance of metal thin films. The void growth rates measured in the experiments are analyzed with the expression for void growth rate to estimate the interface adhesion strength for the Cu-TiN and Cu-SiNx interfaces. </p> <p><br></p> <p>Demand for increased bandwidth, power efficiency and performance requirements have resulted in a trend of reduction in size and pitch of Cu pillar-Solder micro-bump interconnects used in heterogeneously integrated packages. As the size of micro-bumps reduce, reliability challenges due to voiding in the solder joint and the growth of Cu-Sn intermetallics are observed. The underlying reaction-diffusion mechanisms responsible for Cu-Sn intermetallic growth and voiding in solder joints are unclear at this stage and require further investigation. The current practice of material characterization in micro-bumps involve destructive cross-sectioning and polishing of the micro-bumps after testing. These processes result in loss of continuity in the samples used for the experiments, and material removal due to abrasive polishing might result in a loss of critical information. Therefore, a novel test device capable of non-destructive characterization of Cu-Sn intermetallic growth and voiding in sub-30 micron size micro-bumps is designed and fabricated in this work. The fabricated test devices are subjected to thermal aging for over 1000 h and the underlying reaction-diffusion mechanisms behind the intermetallic phase and void evolution are investigated. </p> <p><br></p> <p>A reaction-diffusion mechanism is proposed explaining the evolution of  various Cu-Sn intermetallic phases and solder joint void observed from experiments. Using the reaction-diffusion mechanism inferred from the thermal aging experiments and the generalized reaction-diffusion theory for phase evolution developed in this thesis, a sharp interface model is developed for the evolution of Cu-Sn intermetallic phases and solder joint void. The diffuse interface phase field equivalent equations for the sharp interface model governing equations are developed using matched formal asymptotic analysis. The evolution of Cu-Sn intermetallic phase and voids in the solder joint are simulated for different temperatures and current density to demonstrate the validity of the phase field and sharp interface models.  </p> <p><br></p>