The purpose of this research is to develop an understanding of Multichip Modules, (MCMs), more specific those fabricated with a Low Temperature Co-fireable Ceramic (L TCC) tape systems. The study will consist of designing, processing, and testing two generic MCM test patterns. The effects on signal propagation caused by vias and wire bonds, crosstalk for surface and embedded transmission lines, crosstalk between vias, effects of bends in transmission lines are studied and discussed in this work. Time Domain and Frequency Domain measurements are performed and presented in this thesis work for electrical characterization of MCM structures using L TCC systems / Master of Science