Inertial sensing technologies, including accelerometers and gyroscopes, have been invaluable in numerous fields ranging from consumer electronics to healthcare and clinical practices. Inertial measurement units, specifically accelerometers, represent the most widely used microelectromechanical systems (MEMS) devices with excellent and reliable performance. Although MEMS-based accelerometers have many attractive attributes, such as their tiny footprint, high sensitivity, high reliability, and multiple functionalities, they are limited by their complex and expensive microfabrication processes and cumbersome, fragile structures that suffer from mechanical fatigue over time. Moreover, the rigid nature of beams and spring-like structures of conventional accelerometers limit their applications for wearable devices and soft-human machine interfaces where physical compliance that is compatible with human skin is a priority. In this dissertation, the development of novel practical resistive and capacitive-type inertial sensors using liquid metal as a functional proof mass material is presented. Utilizing the unique electromechanical properties of liquid metal, the novel inertial sensor design confines a graphene-coated liquid metal droplet inside tubular and 3D architectures, enabling motion sensing in single and multiple directions. Combining the graphene-coated liquid metal droplet with printed sensing elements offers a robust fatigue-free alternative material for rigid, proof mass-based accelerometers. Resistive and capacitive sensing mechanisms were both developed, characterized, and evaluated. Emerging rapid fabrication technologies such as direct laser writing and 3D printing were mainly adopted, offering a scalable fabrication strategy independent of advanced microfabrication facilities. The developed inertial sensor was integrated with a programmable system on a chip (PSoC) to function as a stand-alone system and demonstrate its application for real-time- monitoring of human health/ physical activity and for soft human-machine interfaces. The developed inertial sensor architecture and materials in this work offer a new paradigm for manufacturing these widely used sensors that have the potential to complement the performance of their silicon-based counterparts and extend their applications.

The hybridization of direct write (DW) and additive manufacturing (AM) technologies to create additively manufactured electronics (AME) has enabled the integration of electrical functionality to form multifunctional AM components. Current work in AME has demonstrated the integration of conductive traces into and onto geometries and form factors that are not possible through traditional electronics packaging processes. This has largely been accomplished by using AM and DW technology to deposit conductive inks to form interconnects on the surface of AM substrates or within multimaterial AM geometries. However, the requisite thermal post-processing and high resistivity of the conductive inks and the limitations in thermal and dielectric performance of printable substrates commonly used in AME restrict the capabilities of these parts. This thesis proposes an alternative process for the conformal deposition of low resistivity traces on additively manufactured all-aromatic polyimides (AM-PI) without the use of conductive inks. This is accomplished through the selective patterning of laser induced graphene (LIG), a porous 3D graphene fabricated via laser irradiation, onto the AM-PI. While the resultant LIG is conductive, its resistivity is further reduced by the electrodeposition of copper (Cu-LIG). In this thesis, the synthesis of LIG on AM-PI, thermally post processed to 240℃, 300℃, and 450℃, is demonstrated and characterized through sheet resistance measurements and Raman spectroscopy. AM-PI post-processed to 300℃ demonstrated the lowest resistivity LIG formation (13.8 Ω/square). The resistivity of Cu-LIG is compared to an industry standard silver ink (Micromax CB028) used in direct write hybrid manufacturing applications. Cu-LIG was found to have a measured resistivity (1.39e-7 Ω·m), two orders of magnitude lower than the measured resistivity of the CB028 silver ink (1.62e-5 Ω·m). Additionally, the current capacity of the Cu-LIG was demonstrated and Joule heating of the material was observed via IR thermography. Cu-LIG demonstrated no failure of conductive trace or substrate under 5A of current for 2 minutes, heating to a maximum recorded temperature of 76.3℃. Several multifunctional components were fabricated as case studies to further validate the process. Several small passive electronic devices (e.g., a heater and an interdigitated capacitor) are fabricated to demonstrate selective deposition of complex copper traces. The fabrication of an Archimedes spiral on a hemispherical substrate via Cu-LIG is completed to demonstrate the ability to use the process to fabricate conformal conductive traces. An LED circuit is fabricated on a face-center cubic AM-PI lattice which demonstrates multi-planar fabrication on geometrically complex 3D printed substrates. / Master of Science / The hybridization of direct write (DW) and additive manufacturing (AM) technologies to create additively manufactured electronics (AME) has enabled the fabrication of AM components which have electronic functionality. Current work in AME has demonstrated the integration of conductive traces into and onto geometries and form factors that are not possible through traditional electronics packaging processes. This has largely been accomplished through the deposition of conductive inks to form interconnects on the surface of AM substrates or within multimaterial AM geometries. However, these conductive inks require thermal post-processing temperatures which exceed the thermal performance of common AM substrates. The dielectric performance of AM substrates is also restrictive to the capabilities of these parts. This thesis proposes an alternative process for the conformal deposition of low resistivity traces on high performance additively manufactured all-aromatic polyimides (AM-PI) without the use of conductive inks. This is accomplished through the selective patterning of laser induced graphene (LIG), a porous 3D graphene fabricated via laser irradiation, onto the AM-PI. While the resultant LIG is conductive, its resistivity is further reduced by the electrodeposition of copper (Cu-LIG). In this thesis, the synthesis of LIG on AM-PI, thermally post processed to 240℃, 300℃, and 450℃, is demonstrated and characterized through sheet resistance measurements and Raman spectroscopy. AM-PI post-processed to 300℃ demonstrated the lowest sheet resistance LIG formation (13.8 Ω/square). The resistivity of Cu-LIG is compared to an industry standard silver ink (Micromax CB028) used in direct write hybrid manufacturing applications. Cu-LIG was found to have a measured resistivity (1.39e-7 Ω·m), two orders of magnitude lower than the measured resistivity of the CB028 silver ink (1.62e-5 Ω·m). Additionally, the thermal performance and current capacity of the Cu-LIG was demonstrated by observing resistive heating of the material under current load via IR thermography. Cu-LIG demonstrated no failure of conductive trace or substrate under 5A of current for 2 minutes, heating to a maximum recorded temperature of 76.3℃. Several multifunctional components were fabricated as case studies to further validate the process. A heater and an interdigitated capacitor are fabricated to demonstrate selective deposition of complex copper traces. The fabrication of an Archimedes spiral on a dome via Cu-LIG is completed to demonstrate the ability to use the process to fabricate conformal conductive traces. An LED circuit is fabricated on an AM-PI lattice which demonstrates multi-planar fabrication on geometrically complex 3D printed substrates.