The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.

This diploma thesis aims to verify the properties of lead-free solders, which are subjected to accelerated aging by thermal cycling. The theoretical part describes in detail the most used lead-free solders and their characteristics. The next section describes fluxes and their important functions in the soldering process. Intermetallic compounds are also mentioned, which significantly affect the quality and service life of the soldered joint. In the practical parts, the test motif was on two different substrates - corundum ceramics and the widely used substrate FR-4 (Glass fiber fabric saturated with epoxy resin). SAC solder was chosen as the reference solder for the experiment, followed by solder containing bismuth (Sn42 / Bi58) and lead solder (Sn62 / Pb36 / Ag2). Accelerated aging by thermal cycling was performed in the temperature range from -20 ° C to 125 ° C, followed by performing a test of the mechanical strength of the soldered joint by means of a shear test. SnBi solder shows higher mechanical strength at the beginning of testing than SAC solder and lead solder, during temperature cycles, it significantly loses its mechanical properties, this is caused by increasing oxidation of the alloy. SAC solder seems to be promising, which has an almost constant decrease in mechanical strength during all temperature cycles on both corundum and FR-4 substrates.

This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.

The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.

This master´s thesis deals with problems of wave soldering and application methods Design of Experiments for the new product production. Summarizes the basic knowledge of soldering technology, of solder alloys and Design of Experiments methods. Design of Experiments method has been applied to product to find the optimal for wave soldering setting.

This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.

This thesis examines the inuence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature proles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the inuence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.

Detta examensarbete är en del av ett större projekt (Evochip) som bedrivs på Lunds tekniska högskola, avdelningen för industriell produktion (iProd) och med samarbete med bland annat AB Markaryds metallarmatur och Mistra innovation. I detta arbete har en dynamisk kostnadsmodell tagits fram för att beräkna tillverkningskostnaderna av komponenter tillverkade av återanvända spånor av blyfri mässing från de egna tillverkningsprocesserna hos AB Markaryds metallarmatur (MMA). Idag skickas alla kasserade detaljer och materialspill ner till materialleverantörer i Sydeuropa för återvinning. Transporterna sker med lastbil och återvinningsprocessen utgår från ett energikrävande nedsmältningssteg. Idag pågår utvecklingsprojekt med målet att återanvända spånorna utan nedsmältning hos MMA, men kostnadsbilden per detalj har varit hittills okänd. Med hjälp av detta examensarbete ska detaljpriset tas fram. Tillverkningsprocessen delas in i totalt 11 olika förädlingsstationer. För att kartlägga kostnaderna används Jan-Eric Ståhls dynamiska kostnadsmodell. Nödvändig data och information har samlats in med hjälp av intervjuer på företaget och genom företagets egna dokumentationer. För att minska felmarginalen i resultaten har lämpliga Monte Carlo simuleringar utförts. Arbetet utgår även från ett hållbarhetsperspektiv. Förutom elimineringen av lastbilstransporter och energikrävande nedsmältningsprocesser för grundmaterialet, främjar arbetet även användning och återanvändning av blyfri mässing genom att kompaktera spånor till nya grönkroppar. Detta då forskare länge har varnat för blyade detaljers negativa hälsoeffekter.  Detaljen som undersöks i detta arbete är en ventil som har benämningen EVO 10, vilken återfinns i företagets blyfria standardsortiment. Kostnadsmodellen är dynamisk till den grad att den i framtiden skulle kunna appliceras på övriga blyfria mässingkomponenter hos MMA.      En jämförelse mellan två olika koncept presenteras i resultatdelen. Koncept ett representerar dagens tillverkningssystem, och koncept två framtidens kompakteringsteknik. Då många av förädlingsstegen är desamma för båda systemen, valdes en jämförelse mellan framtagningen av grönkropparna genom de två olika koncepten. Resultaten visar att kutsar, framtagna enligt dagens tillverkningssystem, kostar 12,75 SEK/detalj, och kutsar framtagna enligt koncept två kostar 9,61 SEK/detalj. Då koncept två är beroende av spånor från dagens tillverkningssystem, kan MMA inte helt gå över till att kompaktera spånor till nya kutsar. Mer arbete måste utföras för att hitta en balanserad modell mellan de två olika tillverkningssystemen för bästa möjliga resultat. Monte Carlo-simuleringarna visar att kostnaden per detalj uppgår till 12.96 SEK, detta med de på förhand valda konstanter och variabler i systemet. / This master thesis is part of a larger project (Evochip), conducted at Lund University, faculty of engineering, Industrial Production Department (iProd). The project is in collaboration with AB Markaryds metallarmatur and Mistra innovation. In this work, a dynamic cost model has been developed to calculate the manufacturing costs of components made from recycled chips of lead-free brass from the manufacturing processes of AB Markaryds metallarmatur (MMA). In the current situation, all rejected details and waste materials are sent to the material supplier in southern Europe for recycling. The transport takes place by trucks and the recycling process is based on an energy-intensive melting step. Development projects are currently underway to reuse the chips without melting at sight at MMA´s facilities, but the cost per detail has been unknown for the company. With the help of this thesis, the manufacturing price will be presented. The manufacturing process is divided into a total of 11 different processing stations. To estimate the costs, Jan-Eric Ståhl's dynamic cost model is used. Necessary data and information have been collected using interviews with the employees of the company and through the company's own documentation regarding the production lines. In order to reduce the error margin in the results, suitable Monte Carlo simulations have been performed. The work is also based on a sustainability perspective. In addition to eliminating transportations by trucks and energy-intensive melting processes for the products, the work also promotes the use and reuse of lead-free brass by pressing metal chips to form new bars. All this in order to avoid leaded brass components due to the negative health effects caused by the lead. The component investigated in this work is a radiator valve called EVO 10. The valve is found in the company's lead-free standard range. The cost model in this project is dynamic to the extent that it could be applied in the future to other lead-free brass components at MMA. A comparison of two different concepts is presented in the results section. Concept one represents the current manufacturing system, and concept two, the future compacting technology. Since many of the processing steps are the same for both systems, a comparison was made between the productions of the pellet through the two different concepts. The results show that pellets made according to today's manufacturing system cost 12.75 SEK / detail, and pellets manufactured according to concept two costs 9.61 SEK / detail. As concept two is dependent on chips from today's manufacturing system, MMA cannot completely switch to compacting chips to new pellets. More work must be done to find a balanced model between the two different manufacturing systems for the best possible results.The results from the Monte Carlo-simulations shows that the manufacturing cost with the chosen parameters and variables is 12.96 SEK/detail.

Lead (Pb) is frequently used as an alloying element in brass to enhance machinability and castability. However, this element poses a significant risk to human health and the environment. The 2021 revision of the Drinking Water Directive imposed stricter limits on Pb content in brass, encouraging the development of lead-free brass. Several studies have identified tin (Sn) as a potential substitute for Pb in brass. This master’s thesis examines the thermodynamic description of the Cu-Zn-Sn ternary system, using the Swerim Cu database. The investigation involved casting five alloys in the Cu-rich corner, followed by heat treatment at 550 oC until homogenized, and quenching, after which the samples were analyzed to determine the bcc and fcc phase composition. The results were used to confirm the thermodynamic description, and the ternary parameters of the fcc and bcc phases were optimized to match the experimental results. After the optimization, a significant enhancement is achieved in the description of the Cu-Zn-Sn ternary system, which better fits the experimental data. / Bly  (Pb)  används  ofta  som  ett  legeringselement  i  mässing  för  att  förbättra bearbetbarheten och  gjutbarheten.    Detta  element  utgör  dock  en  betydande  risk för människors  hälsa  och miljön.   2021 års översyn  av  dricksvattendirektivet införde strängare  gränser  för  Pb-halten  i mässing,  vilket  uppmuntrade utvecklingen av blyfri mässing.    Flera  studier  har  identifierat tenn  (Sn)  som  ett potentiellt substitut  för  Pb i mässing.   Denna  masteruppsats  undersöker den termodynamiska beskrivningen  av det ternära  Cu-Zn-Sn-systemet  med  hjälp  av Swerim Cu-databasen.   Undersökningen innefattade  gjutning  av  fem  legeringar  i det  Cu-rika hörnet, följt av värmebehandling vid 550 oC tills de homogeniserades, och härdning, varefter proverna analyserades  för  att bestämma  bcc-  och  fcc-fassammansättningen.   Resultaten  användes  för att  bekräfta den  termodynamiska  beskrivningen,  och  de  ternära  parametrarna  för  faserna  fcc och bcc  optimerades  för  att  matcha  experiment resultaten.  Efter  optimeringen  uppnås  en betydande  förbättring  av  beskrivningen  av  det  ternära  Cu-Zn-Sn-systemet,  vilket bättre  passar experimentdata.

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