Majority of traditional assembly packaging are applied in consumer electronics and communication products. Electrical signals are transmitted through gold wire connecting IC and inner leadframe. The assembled product is then mounted to PCB board via outer lead. However, products with complicated functions require new development on advanced IC packaging solution that makes low market demand for traditional process. Therefore, assembly package cost reduction is the first target to keep the advantages of the products and make it profitable. In this thesis, the feasibility on leadframe design from small matrix (2 row) to large matrix was analyzed making high volume throughput by increasing the totally unit quantity in one strip leadframe. With the introduction of the new strip outline dimensions, the staging time increases at wire bonder machine resulting to copper layer delamination. Appropriate control on the preheat temperature resolved the copper layer delamination issue. Assembly package for large leadframe design was then proposed and the capacity of machine was surveyed. The benefit of product cost saving and the increase on assembly yield for the enlarged leadframe are evaluated accordingly.

The reasearch is to discussice the relationship between water supply and drainage for plan, implement, improvement and management in leadfram plant. The purpose is to discuss and improve the relationship for below coefficients: equipment capability, manufacture target, efficiency and management of water used and role of manufacture department. The major conclusions in this study: 1. It will affect the whole implement result: the ability, target, technology of enviriment manager in the company. 2.It should be controlled any time on the requirement of manufacturing target ,requirement of hardware ability and drafted the expand plan and preparation in advance. 3.For the target of environment management ,we should use the stable improvement method in quality concerned and rule of law followed. 4. For the mass production is the main purpose for a company, we have to communicat with each departments to build the correct thinking for working impelement. The meaning on management of the conclusion in this study: 1.Yield control is the source of competed vantage on same kind products. 2.The equipment plan effects the management and controller of follow-up operation. 3.The accurate execution of maintain plan and the stuff of operators are the key point that effects the yield. 4.The efficiency of equipment is the key point that effects the cost

發光二極體也就是俗稱的LED(Light-Emitting Diode以下簡稱LED)，而LED具有省電、使用壽命長、反應速度快等優勢，因此在全球環保意識高漲下，逐漸成為發展主流的綠色能源。台灣在發展LED產業已長達30餘年，從最早期的封裝產業開始，慢慢逐漸向上游藍寶石基板、LED導線架等產品以及下游端的消費性產品的應用，發展至今已經形成相當完整的LED供應鏈且累積一定的技術水平及研發能力，不論是上游或中游供應廠商皆能夠向世界一流大廠相互競爭；但從2010年開始大陸政府投入相當大量的資金與節能政策，使得大陸地區成立許多的LED廠商，此舉讓台灣的LED廠商受到相當大的威脅。也因為供給的增加再加上全球景氣持續低迷情況下，造成供需失衡的問題持續惡化，直到2011年開始韓系廠商推出低價應用的直下式電視搭配大陸家電下鄉政策，一舉提升了LED的需求量，但預期從2014年開始由於背光市場的LED滲透率已經趨近於99%，因此成長動能會逐漸趨於緩和。使得LED應用的終極產品照明市場開始浮出檯面，在LED產業快速的變動下以及大陸地區廠商的競爭下，台灣LED供應商必須提早佈局因應未來的市場變動。因此本研究目的透過分析LED市場的需求發展趨勢以及LED導線架與產業的特性，找出最適當的經營發展策略。 本研究將以LED導線架廠商為主軸首先透過四競技場分析了解LED導線架市場所面臨的環境狀況，然後再以SWOT分析個案公司本身的優劣勢並作為發展策略的依據，最後找出LED導線架廠商在全球不同區域的經營發展策略方向。本研究主要鎖定台灣導線架龍頭廠I公司為探討對象，透過對於I公司分析結果如下： 一、大陸地區LED導線架場的崛起以及低階照明應用的成長，因此必須透過嚴格的成本控管以及低階市場的研發，與大陸地區龍頭廠進行策略同盟，藉由彼此資源與現有客戶的整合，開拓彼此間的出海口，聯手穩固市佔率，確保低階應用市占率。 二、高階市場產品透過內部組織建立相關研發實驗室，並與國際大廠的聯手開發藉由彼此間資源整合強化高階市場LED導線架佔有版圖。 / Light-Emitting Diode, commonly known as LED, contains the strengths of power saving, longer life time, fast reaction ability as well as other advantages. Following the global trend of eco conscious, LED has become the main stream of green energy development. In Taiwan, LED industry has been developed for over 30 years. From the early packaging industry gradually extend to the upstream industries includes sapphire substrate and LED lead frame; followed with downstream industry such as the applications of consuming products. Up to date, mature LED supply chain system has been formed and the technical skills as well as develop ability are all compatible to those pioneers of the world in this field. However since 2010, China government started to have huge investment on power saving policy. Many LED factories were established with the support of China government and it has become huge threats to Taiwan’s LED industry. At the same time, with the increase of supply plus the downturn of global economy, the imbalance of supply and demand kept exaggerates until 2011 Korean factory promoted the low price LED TV and China government carried out the “Home appliance going country side” policy, led to the dramatic increase of LED demand. However as of 2014, the LED backlight will already have the penetration close to 99%, low growth of this market can be expected. Thus, the ultimate application of LED in lightning market starts to show on the stage. With the fast moving of LED industry and the competition from China factories, LED suppliers in Taiwan must be prepared in advance in order to react to the market change. The main goal of this research is to analyze the demand and trends of LED market with the characteristic of the LED lead frame industry to finally find the best appropriate tactic for management. This study will mainly base on LED lead frame factory, first through the “Four competition” analyze to understand the current environment of LED lead frame market followed with SWOT analyze of the lead frame factory for a basis of future developing strategy. This research targets on the leading lead frame factory in Taiwan- I company, and the results are as follow: 1.To react to the growth of lead frame factory in China and the increasing demand of lower level lighting application, setting strict cost control and improve research and develop abilities to contain the market share is a must. In addition to firm the market share, in alliance with leading factories in China, through sharing resource and integration of customers should be taking into serious consideration. 2.To form research and develop lab for high level products, through cooperation with leading factories from globe to integrate resources and extend business to the high level LED lead frame market.

The goal of this thesis is to work out an introduction to the chip packaging and decapsulation. Further can be found a description of a method leading to dacapsulate concrete chips. Final part is devoted to getting chip pictures using microscope and analysis of the pictures afterwards.