There are many ways in which the surrounding media, such as air between an oscillating MEMS structure and a fixed substrate, can affect the dynamic response of a MEMS transducer. Some of these effects involve dissipation while others involve energy transfer. Transverse oscillations of a planar structure can cause a lateral air flow in small gaps that results in pressure gradients. The forces due to the built–up pressure are always against the vibration of the structure and have characteristics of damper and stiffener. In this work, we study the squeeze film phenomenon due to the interaction between the air–film and the structure in the presence of restrictive flow boundary conditions. It is known that the squeeze film damping due to the air trapped between the oscillating MEMS structure and the fixed substrate often contributes to maximum energy dissipation. We carry out an analysis to estimate damping and stiffness in cases with restrictive flow boundaries in dynamic MEMS devices. While the studies reported in the present work address fluid flow damping with restrictive flow boundaries, the analysis of air-flow shows another important phenomenon of enhanced air-spring stiffness. This study is discussed separately in the context of spring stiffening behavior in MEMS devices exhibiting squeeze film phenomenon. First a theoretical framework for modeling squeeze film flow is established and this is followed with analytical and numerical solutions of problems involving squeeze film phenomenon. Modeling of squeeze film effects under different flow conditions is carried out using Reynold’s equation. The problem of squeeze film damping in MEMS transducers is more involved due to the complexities arising from different boundary conditions of the fluid flow. In particular, we focus our attention on estimation of damping in restricted flow boundaries such as only one side vented and no side vented passive boundary conditions. Damping coefficient for these cases are extracted when the fluid is subjected to an input velocity profile according to a specific mode shape at a given frequency of oscillation. We also explain the squeeze film flow in restricted boundaries by introducing the concept of passive and active boundary conditions and analyzing the pressure gradients which are related to the compressibility of the air in the cavity. Passive boundary conditions is imposed by specifying the free flow or no flow along one of the edges of the cavity, whereas, active boundary condition is imposed by the velocity profile being specified at the interface of the cavity with the oscillating structure. Some micromechanical structures, such as pressure sensors and ultrasound transducers use fully restricted or closed boundaries where the damping for such cases, even if small, is very important for the determination of the Q–factor of these devices. Our goal here is to understand damping due to flow in such constrained spaces. Using computational fluid dynamics (ANSYS–FLOTRAN), the case of fully restricted boundaries is studied in detail to study the effect of important parameters which determines the fluid damping, such as flow length of the cavity, air–gap height, frequency of oscillations and the operating pressure in the cavity. A simulation strategy is developed using macros programming which overcomes some of the limitations of the existing techniques and proves useful in imposing a non–uniform velocity and the extraction of damping coefficient corresponding to the flexibility of the structure in specific oscillation modes. Rarefaction effects are also accounted for in the FEM model by introducing the flow rate coefficient, or, alternatively using the concept of effective viscosity. The analysis carried out for the fully restricted case is motivated by the analytical modeling of squeeze film phenomenon for a wide range of different restricted boundaries, and analyzing the resulting pressure gradient patterns. We show that significant damping exists even in fully restricted boundaries due to lateral viscous flow. This is contrary to known reported results, which neglect damping in such cases. The result indicates that in fully restrictive fluid flow boundaries or in a closed cavity, air damping cannot be neglected at lower oscillation frequencies and large flow length to air-gap ratio if the active boundary has a non-uniform velocity profile. Analysis of air-flow in the case of restricted flow boundaries shows another important phenomenon of enhanced air-spring stiffness. It is found that fluid film stiffness has a nonlinear dependence on various parameters such as air-gap to length ratio, fluid flow boundary conditions and the frequency of oscillation. We carry out analysis to obtain the dynamic response of MEMS devices where it is significantly affected by the frequency dependent stiffness component of the squeeze film. We show these effects by introducing frequency dependent stiffness in the equation of motion, and taking examples of fluid boundary conditions with varying restriction on flow conditions. The stiffness interaction between the fluid and the structure is shown to depend critically on stiffness ratios, and the cut-off frequency. It is also inferred that for a given air–gap to flow length ratio, the spring behaviour of the air is independent of the flow boundary conditions at very high oscillation frequencies. Hence, we limit our focus on studying the effect of fluid stiffness in the regime where it is not fully compressible. For non-resonant devices, this study finds its utility in tuning the operating frequency range while for resonant devices it can be useful to predict the exact response. We show that it is possible to design or tune the operating frequency range or shift the resonance of the system by appropriate selection of the fluid flow boundary conditions. The emphasis of the present work has been toward studying the effect of squeeze film flow on dynamic response of MEMS structures with restrictive flow boundary conditions. Estimation of energy dissipation due to viscous flow cannot be ignored in the design of MEMS which comprise of restricted flow boundaries. We also remark that modeling of a system with squeeze film flow of the trapped air in terms of frequency independent parameters, viz. damping and stiffness coefficient, is unlikely to be very accurate and may be of limited utility in specific cases. Although the central interest in studying squeeze film phenomenon is on the damping characteristics because of their direct bearing on energy dissipation or Q–factor of a MEMS device, the elastic behaviour of the film also deserves attention while considering restrictive flow boundary conditions.

Adaptive microwave systems can benefit from the use of low loss tunable microwave filters. Realizing these tunable filters that show low loss characteristics can be very challenging. The proper materials, tuning elements, and filter designs need to be considered when creating a low loss tunable filter. The integration of low loss microelectromechanical systems (MEMS) and superconducting circuits is one method of achieving these types of tunable filters. The thesis introduces new multi-layer low temperature superconducting (LTS) filters and diplexers and novel topologies for tunable filters and switched multiplexers. An efficient method of designing such filters is proposed. A fabrication process to monolithically integrate MEMS devices with high temperature superconducting (HTS) circuits is also investigated in this thesis. The reflected group delay method, usually used for filter tuning, is further developed for use in designing microwave filters. It is advantageous in the design of filters to have electromagnetic simulation results that will correlate well to the fabricated microwave filters. A correction factor is presented for use with the reflected group delay method so the group delay needs to be matched to the appropriate value at the center frequency of the filter and be symmetric about the center frequency of the filter. As demonstrated with an ideal lumped element filter, the group delay method can be implemented when a closed form expression for the circuit is not known. An 8-pole HTS filter design and an 8-pole multi-layer LTS filter design demonstrate the use of the reflected group delay method. Low temperature superconducting filters, couplers and diplexers are designed and fabricated using a multilayer niobium fabrication process traditionally used for superconducting digital microelectronics. The feasibility of realizing highly miniaturized microwave niobium devices allows for the integration of superconducting digital microelectronics circuits and analog microwave devices on a single chip. Microwave devices such as bandpass filters, lowpass filters, bandstop filters, quadrature hybrids, and resistive loads are all demonstrated experimentally. New tunable filter designs are presented that can make use of MEMS switches. A manifold-coupled switched multiplexer that allows for 2^N possible states is presented. The tunable multiplexer has N filters connected to two manifolds and has embedded switches, which detune certain resonators within the filters to switch between ON and OFF states for each channel. The new concept is demonstrated with a diplexer design and two 3-pole coplanar filters. The concept is further developed through test results of a fabricated HTS triplexer and electromagnetic simulations to demonstrate a superconducting manifold-coupled switched triplexer. Another filter design is presented that makes use of switches placed only on the resonators of the filters. This filter design has N possible states and the absolute bandwidth can be kept constant for all N states. Finally, the integration of HTS circuits and MEMS devices is investigated to realize low loss tunable microwave filters. The hybrid integration is first performed through the integration of an HTS microstrip filter and commercially available RF MEMS switches. A fabrication process to monolithically integrate MEMS devices and high temperature superconducting circuits is then investigated. The fabrication process includes a titanium tungsten layer, which acts as both a resistive layer and an adhesion for the dielectric layer, an amorphous silicon dielectric layer, a photoresist sacrificial layer, and the top gold layer. The fabrication process is built up on a wafer with a thin film of a high temperature superconducting material covered with a thin film of gold. Several processes are tested to ensure that the superconducting properties of the thin film are not affected during the MEMS fabrication process.

Adaptive microwave systems can benefit from the use of low loss tunable microwave filters. Realizing these tunable filters that show low loss characteristics can be very challenging. The proper materials, tuning elements, and filter designs need to be considered when creating a low loss tunable filter. The integration of low loss microelectromechanical systems (MEMS) and superconducting circuits is one method of achieving these types of tunable filters. The thesis introduces new multi-layer low temperature superconducting (LTS) filters and diplexers and novel topologies for tunable filters and switched multiplexers. An efficient method of designing such filters is proposed. A fabrication process to monolithically integrate MEMS devices with high temperature superconducting (HTS) circuits is also investigated in this thesis. The reflected group delay method, usually used for filter tuning, is further developed for use in designing microwave filters. It is advantageous in the design of filters to have electromagnetic simulation results that will correlate well to the fabricated microwave filters. A correction factor is presented for use with the reflected group delay method so the group delay needs to be matched to the appropriate value at the center frequency of the filter and be symmetric about the center frequency of the filter. As demonstrated with an ideal lumped element filter, the group delay method can be implemented when a closed form expression for the circuit is not known. An 8-pole HTS filter design and an 8-pole multi-layer LTS filter design demonstrate the use of the reflected group delay method. Low temperature superconducting filters, couplers and diplexers are designed and fabricated using a multilayer niobium fabrication process traditionally used for superconducting digital microelectronics. The feasibility of realizing highly miniaturized microwave niobium devices allows for the integration of superconducting digital microelectronics circuits and analog microwave devices on a single chip. Microwave devices such as bandpass filters, lowpass filters, bandstop filters, quadrature hybrids, and resistive loads are all demonstrated experimentally. New tunable filter designs are presented that can make use of MEMS switches. A manifold-coupled switched multiplexer that allows for 2^N possible states is presented. The tunable multiplexer has N filters connected to two manifolds and has embedded switches, which detune certain resonators within the filters to switch between ON and OFF states for each channel. The new concept is demonstrated with a diplexer design and two 3-pole coplanar filters. The concept is further developed through test results of a fabricated HTS triplexer and electromagnetic simulations to demonstrate a superconducting manifold-coupled switched triplexer. Another filter design is presented that makes use of switches placed only on the resonators of the filters. This filter design has N possible states and the absolute bandwidth can be kept constant for all N states. Finally, the integration of HTS circuits and MEMS devices is investigated to realize low loss tunable microwave filters. The hybrid integration is first performed through the integration of an HTS microstrip filter and commercially available RF MEMS switches. A fabrication process to monolithically integrate MEMS devices and high temperature superconducting circuits is then investigated. The fabrication process includes a titanium tungsten layer, which acts as both a resistive layer and an adhesion for the dielectric layer, an amorphous silicon dielectric layer, a photoresist sacrificial layer, and the top gold layer. The fabrication process is built up on a wafer with a thin film of a high temperature superconducting material covered with a thin film of gold. Several processes are tested to ensure that the superconducting properties of the thin film are not affected during the MEMS fabrication process.

The goal of the current study was to develop a computational framework for modelling the coupled fluid-structure interaction problem of squeeze films often encountered in MEMS devices. Vibratory MEMS devices such as gyroscopes, RF switches, and 2D resonators often have a thin plate like structure vibrating transversely to a Fixed substrate, and are generally not perfectly vacuum packed. This results in a thin air film being trapped between the vibrating plate and the fixed substrate which behaves like a squeeze film offering both stiffness and damping to the vibrating plate. For accurate modelling of the squeeze film effect, one must account for the coupled fluid-structure interaction. The majority of prior works attempting to address the coupled problem either approximate the mode shape of the vibrating plate or resort to cumbersome iterative solution strategies to address the problem in an indirect way. In the current work, we discuss the development of a fully coupled finite element based numerical scheme to solve the 2D Reynolds equation coupled with the 3D plate elasticity equation in a single step. The squeeze film solver so developed has been implemented into a commercial FEA package NISA as part of its Micro-Systems module. Further, extending on a prior analytical work, the effect of variable ow boundaries for an all sides clamped plate on squeeze film parameters has been thoroughly investigated. The developed FEM based numerical scheme has been used to validate the results of the prior analytical study. The developed numerical scheme models the 2D Reynolds equation thus limiting the model to account for the effects of the fluid volume strictly confined between the structure and the substrate. To study the effect of surrounding fluid volume ANSYS FLOTRAN simulations have been performed by numerically solving the full 3D Navier Stokes equation in the extended fluid domain for the different flow boundary scenarios. Cut-off frequencies are established beyond which one can consider a 2D fluid domain without considerable loss of accuracy. First, a displacement based finite element formulation is presented for the 2D Reynolds equation coupled with the 3D elasticity equation. Both lower order 8 node and higher order 27 node 3D elements are developed. Only a single type of 3D element is used for modelling along with a 2D fluid layer represented by the \wet" face of the 3D structural domain. The results from our numerical model are compared with experimental data from literature for a MEMS cantilever. The results from the 27 node displacement based elements show good agreement with published experimental data. The results from the lower order 8 node displacement based elements however show huge errors even for relatively fine meshes due to locking issues in modelling high aspect ratio structures. This limits the implementation of the displacement based solver in commercial FE packages where the available mesh generators are generally restricted to lower order 3D elements. In order to overcome the limitations faced by lower order elements (primarily locking issues) in modelling high aspect ratio MEMS geometries, a coupled hybrid formulation is developed next. A thorough performance study is presented considering both the hybrid and displacement based elements for lower order 8 node and higher order 27 node ele- ments. The optimal element choice for modelling squeeze film geometries is determined based on the comparative studies. The effect of element aspect ratio for hybrid and displacement based elements are studied and the superiority of hybrid formulation over displacement based formulations is established for lower order 8 node elements. The coupled hybrid nite element formulation developed for lower order elements is implemented in the commercial FEA package NISA. The implementation scheme to integrate the developed coupled hybrid 8 node squeeze film solver into the commercial FEA package is discussed. The pre-integration analysis and subsequent requirement gaps are first investigated. Based on the gap analysis, certain GUI modifications are undertaken and parser programs are developed to re-format data according to NISA input requirements. Certain special features are included in the package to aid in post processing data analysis by MEMS designers such as \frequency sweep" and \node of interest" selection. As a case study for validation, we also present the modelling of a MEMS cantilever and show that the simulation results from our software are in good agreement with experimental data reported in the literature. Finally as a case study, an extension of a prior analytical work, which studies the effect of varying flow boundaries on squeeze film parameters, is discussed. Explanations are provided for the findings reported in the prior analytical work. The concept of using variation in flow boundaries as a frequency tuning tool is introduced. The analytical results are validated with the coupled numerical scheme discussed before, by considering imposed mode shape for an all sides clamped plate as prescribed displacement to the fluid domain. The simulated results are used to study the intricacies in squeeze film damping and stiffness variations with respect to spatial changes in the fluid flow boundary conditions. In particular, it has been shown that the boundary venting conditions can be used effectively to tune the dynamic response of a micromechanical structure over a fairly large range of frequencies and somewhat smaller range of squeeze film damping. Next, the effect of the surrounding fluid volume for various venting conditions is studied. ANSYS FLOTRAN is used to solve for the full 3D Navier Stokes equation over the extended fluid domain. Results from the extended domain study are used to determine cut-off frequencies beyond which one need not resort to an extended mesh study, and yet be within 5% accuracy of the full extended mesh model.

Ultrasonic sensors are well known for various applications such as NDT, ultrasound imaging, and proximity sensing. Conventional ultrasound transducers are bulky, work at notoriously high voltages, and consume significant power. Microfabrication techniques are leading to a paradigm shift in the field of ultrasonics by enabling development of low power - small footprint ultrasound transducers. This work focuses on the development of piezoelectric type flexural mode micromachined ultrasound transducer also known as PMUTs. We start by establishing a system level analytical model of a PMUT and use it to offer insights into scaling of the performance of the transducer with respect to various design parameters. In this analysis we give special attention to residual stresses thus establishing a contrast between membrane type and plate type PMUTs. After going through various steps of material development and microfabrication, we obtain arrays of PMUTs with different designs. PZT thin films deposited by sol-gel method are used as the piezoelectric layer in the multilayer stack. Further, we present a thorough characterization of fabricated PMUTs which includes measurement of the piezoelectric properties of the embedded PZT thin film, electrical impedance of the electromechanical transducer, its vibrational charac-teristics and acoustic radiation from a single PMUT cell. We also develop a pre-amplifier circuit for a PMUT receiver and present its working as a simple proximity sensor. After establishing the repeatability and predictability of our PMUT sensors we delve into application development beyond ultrasound imaging. Experiments and analysis of PMUTs submerged in water show strong structural-acoustic coupling between the PMUT membrane and the surrounding fluid. We hypothesize the applicability of this feature to sense changes in the acoustic environment of a PMUT. To this end, we integrate an array of PMUTs with a micro-fluidic chip and study the changes in the vibrational behaviour of the PMUT in response to change in the air-water ratio in a closed cell around a PMUT membrane. We also present our preliminary results on presence of micro-bubbles in the closed cell around the PMUT.

Fluid damping arising from squeeze film flow of air or some inert gas trapped between an oscillating micro mechanical structure, such as a beam or a plate, and a fixed substrate often dominates the other energy dissipation mechanisms in silicon based MEM devices. As a consequence, it has maximum effect on the resonant response or dynamic response of the device. Unfortunately, modelling of the squeeze film flow in most MEMS devices is quite complex because of several factors unique to MEMS structures. In this thesis, we set out to study the effect of these factors on squeeze film flow. First we list these factors and study each of them in the context of a particular application, using experimental measurements, extensive numerical simulations, and analytical modelling for all chosen factors. We consider five important factors. The most important factor perhaps is the effect of rarefaction that is dominant when a device is vacuum packed with low to moderate vacuum, typical for MEMS packaging. The second problem is to investigate and model the effect of perforations which are usually provided for efficient etching of the sacrificial layer during fabrication of the suspended structures. The third problem is to consider the effect of non-uniform deflection of the structure such as those in MEMS cantilever beams and model its effect on the squeeze film. The fourth effect studied is the influence of different boundary conditions such as simple, fully open and partially closed boundaries around the vibrating structure on the characteristics of the squeeze film flow. The fifth problem undertaken is to analyze the effect of high operating frequencies on the squeeze film damping. In the first problem, the rarefaction effect is studied by performing experiments under varying pressures. Depending on the ambient pressure or the size of the gap between the vibrating and the fixed structure, the fluid flow may fall in any of the flow regimes, ranging from continuum flow to molecular flow, and giving a wide range of dissipation. The relevant fluid flow characteristics are determined by the Knudsen number, which is the ratio of the mean free path of the gas molecule to the characteristic flow length of the device. This number is very small for continuum flow and reasonably big for molecular flow. Here, we study the effect of fluid pressure on the squeeze film damping by carrying out experiments on a MEMS device that consists of a double gimbaled torsional resonator. Such devices are commonly used in optical cross-connects and switches. We vary fluid pressure to make the Knudsen number go through the entire range of continuum flow, slip flow, transition flow, and molecular flow. We experimentally determine the quality factor of the torsional resonator at different air pressures ranging from 760 torr to 0.001 torr. The variation of this pressure over six orders of magnitude ensures the required rarefaction to range over all flow conditions. Finally, we get the variation of the quality factor with pressure. The result indicates that the quality factor, Q, follows a power law, Q P-r, with different values of the exponent r in different flow regimes. To numerically model the effect of rarefaction, we propose the use of effective viscosity in Navier-Stokes equation. This concept is validated with analytical results for a simple case. It is then compared with the experimental results presented in this thesis. The study shows that the effective viscosity concept can be used effectively even for the molecular regime if the air-gap to length ratio is sufficiently small (h0/L < 0.01). However, as this ratio increases, the range of validity decreases. Next, a semianalytical approach is presented to model the rarefaction effect in double-gimballed MEMS torsion mirror. In this device, the air gap thickness is 80 µm which is comparable to the lateral dimension 400 µm of the oscillating plate and thus giving the air-gap to length ratio of 0.2. As the ratio 0.2 is much greater than 0.01, the conventional Reynolds equation cannot be used to compute the squeeze film damping. Consequently, we find the effective length of an equivalent simple mirror corresponding to the motion about the two axes of the mirror such that the Reynolds equation still holds. After finding the effective length, we model the rarefaction effect by incorporating effective viscosity which is based on different models including the one proposed in this paper. Then we compare the analytical solution with the experimental result and find that the proposed model not only captures the rarefaction effect in the slip, transition and molecular regimes but also couples well with the non-fluid damping in the intrinsic regime. For the second problem, several analytical models exist for evaluating squeeze film damping in rigid rectangular perforated MEMS structures. These models vary in their treatment of losses through perforations and squeezed film, in their assumptions of compressibility, rarefaction and inertia, and their treatment of various second order corrections. We present a model that improves upon previously reported models by incorporating more accurate losses through holes proposed by Veijola and treating boundary cells and interior cells differently as proposed by Mohite et al. The proposed model is governed by a modified Reynolds equation that includes compressibility and rarefaction effect. This equation is linearized and transformed to the standard two-dimensional diffusion equation using a simple mapping function. The analytical solution is then obtained using Green’s function. The solution thus obtained adds an additional term Γ to the damping and spring force expressions derived by Blech for compressible squeeze flow through non-perforated plates. This additional term contains several parameters related to perforations and rarefaction. Setting Γ = 0, one recovers Blech’s formulas. We benchmark all the models against experimental results obtained for a typical perforated MEMS structure with geometric parameters (e.g., perforation geometry, air gap, plate thickness) that fall well within the acceptable range of parameters for these models (with the sole exception of Blech’s model that does not include perforations but is included for historical reasons). We compare the results and discuss the sources of errors. We show that the proposed model gives the best result by predicting the damping constant within 10% of the experimental value. The approximate limit of maximum frequencies under which the formulas give reasonable results is also discussed. In the third problem, we study the effect of elastic modeshape during vibration on the squeeze film flow. We present an analytical model that gives the values of squeeze film damping and spring coefficients for MEMS cantilever resonators taking into account the effect of flexural modes of the resonator. We use the exact modeshapes of a 2D cantilever plate to solve for pressure in the squeeze film and then derive the equivalent damping and spring coefficient relations from the back force calculations. The relations thus obtained can be used for any flexural mode of vibration of the resonators. We validate the analytical formulas by comparing the results with numerical simulations carried out using coupled finite element analysis in ANSYS, as well as experimentally measured values from MEMS cantilever resonators of various sizes and vibrating in different modes. The analytically predicted values of damping are, in the worst case, within less than 10% of the values obtained experimentally or numerically. We also compare the results with previously reported analytical formulas based on approximate flexural modeshapes and show that the proposed model gives much better estimates of the squeeze film damping. From the analytical model presented here, we find that the squeeze film damping drops by 84% from the first mode to the second mode in a cantilever resonator, thus improving the quality factor by a factor of six to seven. This result has significant implications in using cantilever resonators for mass detection where a significant increase in quality factor is obtained only by using vacuum. In the fourth and fifth problem, the effects of partially blocked boundary condition and high operating frequencies on squeeze films are studied in a MEMS torsion mirror with different boundary conditions. For the structures with narrow air-gap, Reynolds equation is used for calculating squeeze film damping, generally with zero pressure boundary conditions on the side walls. This procedure, however, fails to give satisfactory results for structures under two important conditions: (a) for an air-gap thickness comparable to the lateral dimensions of the micro structure, and (b) for non-trivial pressure boundary conditions such as fully open boundaries on an extended substrate or partially blocked boundaries that provide side clearance to the fluid flow. Several formulas exist to account for simple boundary conditions. In practice, however, there are many micromechanical structures, such as torsional MEMS structures, that have non-trivial boundary conditions arising from partially blocked boundaries. The most common example is the double-gimballed MEMS torsion mirror of rectangular, circular, or hexagonal shape. Such boundaries usually have clearance parameters that can vary due to fabrication. These parameters, however, can also be used as design parameters if we understand their role on the dynamics of the structure. We take a MEMS torsion mirror as an example device that has large air-gap and partially blocked boundaries due to static frames. Next we model the same structure in ANSYS and carry out CFD (computational fluid dynamics) analysis to evaluate the stiffness constant K, the damping constant C, as well as the quality factor Q due to the squeeze film. We compare the computational results with experimental results and show that without taking care of the partially blocked boundaries properly in the computational model, we get unacceptably large errors. Subsequently, we use the CFD calculations to study the effect of two important boundary parameters, the side clearance c, and the flow length s, that specify the partial blocking. We show the sensitivity of K and C on these boundary design parameters. The results clearly show that the effect of these parameters on K and C is substantial, especially when the frequency of excitation becomes close to resonant frequency of the oscillating fluid and high enough for inertial and compressibility effects to be significant. Later, we present a compact model to capture the effect of side boundaries on the squeeze film damping in a simple rectangular torsional structure with two sides open and two sides closed. The analytical model matches well with the numerical results. However, the proposed analytical model is limited to low operating frequencies such that the inertial effect is negligible. The emphasis of this work has been towards developing a comprehensive understanding of different significant factors on the squeeze film damping in MEMS devices. We have proposed various ways of modelling these effects, both numerically as well as analytically, and shown the efficacy of these models by comparing their predictive results with experimental results. In particular, we think that the proposed analytical models can help MEMS device designers by providing quick estimates of damping while incorporating complex effects in the squeeze film flow. The contents of the thesis may also be of interest to researchers working in the area of microfluidics and nanofluidics.

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