Abstract This research is designed to investigate the occurrence of interdiffusion-induced mesopores, Brownian motion, cleaving and healing and defect clusters in three binary composites, i.e. Ni1-xO/Co1-xO, Ni1-xO/ZrO2 and Co1-xO/ZrO2 of the Ni1-xO-Co1-xO-ZrO2 system. Firstly, the (NimCo1-m)1-£_O/Ni-doped Co3-dO4 composites prepared by reactive sintering Ni1-xO and Co1-xO powders (1:2 molar ratio, denoted as N1C2) at 1000oC with or without further annealing at 720oC in air were studied by X-ray diffraction and electron microscopy to clarify the formation mechanism of mesoporous spinel precipitates. Submicron-sized inter- and intragranular pores, due to incomplete sintering and grain boundary detachment, prevails in (Ni0.33Co0.67)1-£_O protoxide with rock salt structure; whereas nanosize pores due to Kirkendall effect were restricted to the spinel precipitates having Ni component progressively expelled upon annealing. A rapid net vacancy flux and a tensile misfit stress perpendicular to the protoxide/spinel interface caused the formation of elongated and aligned {100}-faceted mesopores in the spinel precipitates with a relatively low equilibrium vacancy concentration. Aligned mesopores in diffusion zone of nonstoichiometric metal oxides have potential applications on thermal barrier bond coating and mass-transport limited heterogeneous catalysis. Also, this thesis deals with the reorientation and shape change of low-crystal-symmetry (non-cubic) ZrO2 within the high-crystal-symmetry grains of Co1-xO/Ni1-xO cubic rock salt-type structure. ZrO2/Co1-xO composites 1:99 and ZrO2/Ni1-xO composites 1:9 in molar ratio were sintered and then annealed at 1650oC for 24 and 100 h in air to induce reorientation of the embedded particles. Transmission electron microscopic observations in both systems indicated that the submicron tetragonal/monoclinic (t/m) ZrO2 particles fell into three topotaxial relationships with respect to the host Co1-xO/Ni1-xO grain: (1) parallel topotaxy, (2) ¡§eutectic¡¨ topotaxy i.e. [100]Z//[111]C,N, [010]Z//[0 1]C,N and (3) ¡§occasional¡¨ topotaxy [100]Z//[111]C,N, [01 ]Z//[0 1]C,N. The parallel topotaxy has a beneficial low energy for the family of {100}Z/C,N and {111}Z/C,N interfaces. The change from the occasional topotaxy to an energetically more favorable eutectic topotaxy was likely achieved by a rotation of the ZrO2 particles over a specific (100)Z/(111)C,N interface. Brownian-type rotation is probable for the embedded t-ZrO2 particles in terms of anchorage release at the interphase interface with the Co1-xO/Ni1-xO host. Detachment or bypassing of rock salt type grain boundaries could also cause orientation as well as shape changes of intergranular ZrO2 particles. Zirconia-polymorphism-induced cleaving and spontaneous healing by precipitation was studied in Co1-xO polycrystals containing a dispersion of ZrO2 particles. Conventional, analytical, and high-resolution transmission electron microscopy indicated that the Co1-xO matrix cleaves parallel to {100} and {110} planes and heals itself by co-precipitation of parallel-topotaxial ZrO2/Co3-£_O4 particles upon cooling. Due to size effect and matrix constraint, nanometer-size ZrO2 precipitates at cleavages were able to retain tetragonality upon further cooling to room temperature. Paracrystalline array of defect cluster was shown to form in Zr-doped Ni1-xO and Co1-xO polycrystals while prepared by sintering at relative high temperature, i.e., 1650oC to increase the defect concentration. Paracrystalline array of defect clusters in Co3-£_O4 spinel structure also occurred when doped with Zr4+ at high temperature or cooled below 900oC to activate oxy-precipitation of Co3-dO4 at dislocations. transmission electron microscopic observations indicated the spinel precipitate and its paracrystal predominantly formed at the ZrO2/Co1-xO interface and the cleavages/dislocations of the Co1-xO host. Defect chemistry consideration suggests the paracrystal is due to the assembly of charge- and volume-compensating defects of the 4:1 type with four octahedral vacant sites surrounding one Co3+-filled tetrahedral interstitial site. The spacing of paracrystalline distribution is 3.3, 2.9 and 4.9 times the lattice parameter for Zr-doped Ni1-xO, Zr-doped Co1-xO and Zr-doped Co3-dO4. This spacing between defect clusters is about 0.98 times that of the previously studied undoped Co3-dO4. There is much larger (3.4 times difference) paracrystalline spacing for Zr-doped Co3-£_O4 than its parent phase of Zr-doped Co1-xO.

Electronic Packaging is currently deeply in need of new solutions concerning vertical interconnection strategies. With respect to downscaling the geometrical limits, entering the nanoscale for first-level interconnects is nothing more than a consequence. This thesis proposes a new strategy for highly resolved vertical interconnects that are realized by metallic nanowires (NWs). These are embedded inside a dielectric matrix enabling the further raster size reduction for chip interconnects. The creation of NW arrays in self-ordering templates (anodized Al2O3 (AAO) and track-etched poly carbonate) by electrochemical deposition of Ag and Ni inside the pores of these as well as the characterisation of the NWs' properties with respect to the film's applicability are to the fore. Electrical properties are shown to be sensitive to the mode of deposition. Crystallographic properties do not seem to be responsible for this while the NWs' morphology slightly differs and is therefore expected to remarkably influence electron transport. Additionally, the deposition mechanism in high-aspect-ratio pores of AAO is in another focus of investigation. This process was in the past described as diffusively controlled, but this assertion was not further evaluated. The presence of a gradient in the diffusion coefficient as well as the presence and expansion of an electrochemical double layer located at the template's inner surface are responsible limiting the deposition process. An existing model of porous electrodes is compared to the measured data and found not to be valid for the system of highly recessed ultramicroelectrode arrays by which this system is described. Therefore a new model that differentiates between charge-transfer and diffusive motion is proposed and shown to fit to the system's properties. Apart from mechanistic investigations, the implementation of the obtained NW arrays as an interconnector film proposes these to be applied best by adhesive bonding. Bonding properties were found to be well realizable by the additional coverage of the filled membranes with a polymer thin film. This can easily be attached onto the film by spin-coating the corresponding monomer and reactive curing while already being embedded in the package. Alternative methods for contact formation, such as non-reactive bonding and nanosoldering using segmented NWs, are proposed. The strategy is shown to still lack important technological questions while the findings with respect to fabrication, growth and implementation are very promising. / Die Aufbau- und Verbindungstechnik der Elektronik wird in absehbarer Zeit Größenskalen erreichen, bei denen die verwendeten Materialien in der ersten Kontaktierungsebene als Nanomaterialien zu bezeichnen sind, das heißt ≤ 100 nm sind. Des Weiteren bestehen momentan nur bedingt viele Ansätze zu deren Implementierung in Vertikalverbindungsstrukturen (zum Beispiel für die dreidimensionale Integration). Die vorliegende Dissertation schlägt daher vor, die vertikale Verbindung über einen zwischen die Chips laminierbaren Film mit hochdichten und vertikal ausgerichteten nanoskaligen Drähten (NWs) zu realisieren. Diese sind in einer dielektrischen Matrix fixiert und gewährleisten die elektrische Anisotropie des Kontaktfilms. Innerhalb dieser Matrix werden die metallischen Drähte durch elektrochemische Abscheidung erzeugt. Der Fokus dieser Arbeit liegt somit auf der Charakterisierung des reduktiven Wachstumsprozesses von Ag und Ni innerhalb dünner Poren. Dabei können die Eigenschaften durch verschiedene Abscheidemodi gezielt beeinflusst werden. Hinsichtlich der elektrischen Eigenschaften ergibt sich im Vergleich zu der zugrundeliegenden Kristallographie ein wesentlich stärkerer Einfluss der Draht-Morphologie. Der Prozess der Porenfüllung wird im Allgemeinen als stark diffusionskontrolliert angenommen, wurde jedoch bisher nicht weiter quantifiziert. Die der Abscheidung zugrundeliegenden Prozesse Elektrolytdiffusion, Ladungstransfer an der Elektrode und Migrationsbeeinflussung durch die Porengeometrie werden daher voneinander getrennt und einzeln charakterisiert. Das vorliegende System kann als Matrix von stark versenkten Ultramikroelektroden abstrahiert werden. Existente Modelle zur Beschreibung derartiger Systeme treffen auf den vorliegenden Fall im Allgemeinen nicht zu, sodass basierend auf elektrochemischen Untersuchungen ein variiertes Abscheidemodell vorgeschlagen wird. Dieses berücksichtigt die Nicht-Linearität der elektrochemischen Doppelschicht, die von der Porenoberfläche ausgeht sowie deren Frequenzabhängigkeit. Neben mechanistischen Untersuchungen schließen sich Versuche an, deren Fokus auf der direkten Anwendung der mit Nanodrähten gefüllten Membranen liegt. Dabei wird vornehmlich deren Fixierung per Klebeverbindung angestrebt. Die Realisierung klebbarer Filme gelingt über die Auftragung von polymeren Dünnfilmen durch Spin-Coating des jeweiligen Monomeren. Diese Filme werden hinsichtlich ihrer Klebeeigenschaften charakterisiert. Abschließend werden alternative Kontaktiermethoden wie die Thermokompression oder das nanoskalige Löten basierend auf der Herstellung von segmentierten Nanodrähten demonstriert und hinsichtlich ihrer Applizierbarkeit diskutiert. Die erreichten Ergebnisse zeigen den noch vorhandenen Bedarf an technologischer Optimierung sowie Kompatibilisierung auf. Die Erkenntnisse hinsichtlich der Herstellung, des Wachstums sowie der Implementierungsansätze sind jedoch vielversprechend.

Electronic Packaging is currently deeply in need of new solutions concerning vertical interconnection strategies. With respect to downscaling the geometrical limits, entering the nanoscale for first-level interconnects is nothing more than a consequence. This thesis proposes a new strategy for highly resolved vertical interconnects that are realized by metallic nanowires (NWs). These are embedded inside a dielectric matrix enabling the further raster size reduction for chip interconnects. The creation of NW arrays in self-ordering templates (anodized Al2O3 (AAO) and track-etched poly carbonate) by electrochemical deposition of Ag and Ni inside the pores of these as well as the characterisation of the NWs' properties with respect to the film's applicability are to the fore. Electrical properties are shown to be sensitive to the mode of deposition. Crystallographic properties do not seem to be responsible for this while the NWs' morphology slightly differs and is therefore expected to remarkably influence electron transport. Additionally, the deposition mechanism in high-aspect-ratio pores of AAO is in another focus of investigation. This process was in the past described as diffusively controlled, but this assertion was not further evaluated. The presence of a gradient in the diffusion coefficient as well as the presence and expansion of an electrochemical double layer located at the template's inner surface are responsible limiting the deposition process. An existing model of porous electrodes is compared to the measured data and found not to be valid for the system of highly recessed ultramicroelectrode arrays by which this system is described. Therefore a new model that differentiates between charge-transfer and diffusive motion is proposed and shown to fit to the system's properties. Apart from mechanistic investigations, the implementation of the obtained NW arrays as an interconnector film proposes these to be applied best by adhesive bonding. Bonding properties were found to be well realizable by the additional coverage of the filled membranes with a polymer thin film. This can easily be attached onto the film by spin-coating the corresponding monomer and reactive curing while already being embedded in the package. Alternative methods for contact formation, such as non-reactive bonding and nanosoldering using segmented NWs, are proposed. The strategy is shown to still lack important technological questions while the findings with respect to fabrication, growth and implementation are very promising.:List of Figures List of Tables List of Acronyms List of Symbols 1 Nanoscale interconnects 1 1.1 Introduction 1.2 Electronic device development and its consequences 1.3 The need for and the design of a nanoscale wiring film 1.3.1 Nanomaterials for packaging - Some examples 1.3.2 Preconsiderations for designing nanoscale interconnects 1.3.3 Compatitibility of ACANWF to industrial applications 1.3.4 Demands to the film 1.4 Resumée - Strategy 2 NW fabrication by electodeposition and synthesis-property relationships 2.1 Templates for NW electrodeposition 2.1.1 Anodized Al2O3 (AAO) 2.1.2 Track-etched polymer membranes 2.2 Template-assisted Electrochemical Deposition (ECD) of NWs 2.2.1 Concept 2.2.2 Deposition modes 2.2.3 In_uences of other physical parameters 2.2.4 Errors and error mechanisms 2.2.5 Deposition in chemically functionalized AAO 2.3 Synthesis-property relationships for single NWs 2.3.1 NiNWs 2.3.2 AgNWs 2.4 Resumée . 3 Growth processes in mesoporous templates 3.1 Relevance for mechanistic investigations 3.2 Processes during NW growth 3.2.1 Electrode kinetics 3.2.2 Diffusion 3.2.3 Interactions with pore walls 3.3 Model systems 3.3.1 DeLevie's model for porous electrodes 3.3.2 Model verification 3.3.3 Model adaptation to non-ideal behaviour 3.4 Resumée 4 Implementation of nanowire arrays into microelectronic packaging 4.1 Adhesive Bonding 4.1.1 Adhesion by thin adhesive layers 4.1.2 Thermocompression bonds 4.2 Nanosoldering 4.2.1 Deposition of low melting point materials 4.2.2 Segmented nanowires 4.3 Resumée 5 Conclusion and perspectives 5.1 Conclusion 5.2 Perspectives on further investigations 6 Appendices 6.1 Technical equipment 6.2 Experimental methods 6.3 Selected characterisation techniques 6.4 Supplementary Information 6.5 Glossary 6.6 List of publications & presentations Bibliography / Die Aufbau- und Verbindungstechnik der Elektronik wird in absehbarer Zeit Größenskalen erreichen, bei denen die verwendeten Materialien in der ersten Kontaktierungsebene als Nanomaterialien zu bezeichnen sind, das heißt ≤ 100 nm sind. Des Weiteren bestehen momentan nur bedingt viele Ansätze zu deren Implementierung in Vertikalverbindungsstrukturen (zum Beispiel für die dreidimensionale Integration). Die vorliegende Dissertation schlägt daher vor, die vertikale Verbindung über einen zwischen die Chips laminierbaren Film mit hochdichten und vertikal ausgerichteten nanoskaligen Drähten (NWs) zu realisieren. Diese sind in einer dielektrischen Matrix fixiert und gewährleisten die elektrische Anisotropie des Kontaktfilms. Innerhalb dieser Matrix werden die metallischen Drähte durch elektrochemische Abscheidung erzeugt. Der Fokus dieser Arbeit liegt somit auf der Charakterisierung des reduktiven Wachstumsprozesses von Ag und Ni innerhalb dünner Poren. Dabei können die Eigenschaften durch verschiedene Abscheidemodi gezielt beeinflusst werden. Hinsichtlich der elektrischen Eigenschaften ergibt sich im Vergleich zu der zugrundeliegenden Kristallographie ein wesentlich stärkerer Einfluss der Draht-Morphologie. Der Prozess der Porenfüllung wird im Allgemeinen als stark diffusionskontrolliert angenommen, wurde jedoch bisher nicht weiter quantifiziert. Die der Abscheidung zugrundeliegenden Prozesse Elektrolytdiffusion, Ladungstransfer an der Elektrode und Migrationsbeeinflussung durch die Porengeometrie werden daher voneinander getrennt und einzeln charakterisiert. Das vorliegende System kann als Matrix von stark versenkten Ultramikroelektroden abstrahiert werden. Existente Modelle zur Beschreibung derartiger Systeme treffen auf den vorliegenden Fall im Allgemeinen nicht zu, sodass basierend auf elektrochemischen Untersuchungen ein variiertes Abscheidemodell vorgeschlagen wird. Dieses berücksichtigt die Nicht-Linearität der elektrochemischen Doppelschicht, die von der Porenoberfläche ausgeht sowie deren Frequenzabhängigkeit. Neben mechanistischen Untersuchungen schließen sich Versuche an, deren Fokus auf der direkten Anwendung der mit Nanodrähten gefüllten Membranen liegt. Dabei wird vornehmlich deren Fixierung per Klebeverbindung angestrebt. Die Realisierung klebbarer Filme gelingt über die Auftragung von polymeren Dünnfilmen durch Spin-Coating des jeweiligen Monomeren. Diese Filme werden hinsichtlich ihrer Klebeeigenschaften charakterisiert. Abschließend werden alternative Kontaktiermethoden wie die Thermokompression oder das nanoskalige Löten basierend auf der Herstellung von segmentierten Nanodrähten demonstriert und hinsichtlich ihrer Applizierbarkeit diskutiert. Die erreichten Ergebnisse zeigen den noch vorhandenen Bedarf an technologischer Optimierung sowie Kompatibilisierung auf. Die Erkenntnisse hinsichtlich der Herstellung, des Wachstums sowie der Implementierungsansätze sind jedoch vielversprechend.:List of Figures List of Tables List of Acronyms List of Symbols 1 Nanoscale interconnects 1 1.1 Introduction 1.2 Electronic device development and its consequences 1.3 The need for and the design of a nanoscale wiring film 1.3.1 Nanomaterials for packaging - Some examples 1.3.2 Preconsiderations for designing nanoscale interconnects 1.3.3 Compatitibility of ACANWF to industrial applications 1.3.4 Demands to the film 1.4 Resumée - Strategy 2 NW fabrication by electodeposition and synthesis-property relationships 2.1 Templates for NW electrodeposition 2.1.1 Anodized Al2O3 (AAO) 2.1.2 Track-etched polymer membranes 2.2 Template-assisted Electrochemical Deposition (ECD) of NWs 2.2.1 Concept 2.2.2 Deposition modes 2.2.3 In_uences of other physical parameters 2.2.4 Errors and error mechanisms 2.2.5 Deposition in chemically functionalized AAO 2.3 Synthesis-property relationships for single NWs 2.3.1 NiNWs 2.3.2 AgNWs 2.4 Resumée . 3 Growth processes in mesoporous templates 3.1 Relevance for mechanistic investigations 3.2 Processes during NW growth 3.2.1 Electrode kinetics 3.2.2 Diffusion 3.2.3 Interactions with pore walls 3.3 Model systems 3.3.1 DeLevie's model for porous electrodes 3.3.2 Model verification 3.3.3 Model adaptation to non-ideal behaviour 3.4 Resumée 4 Implementation of nanowire arrays into microelectronic packaging 4.1 Adhesive Bonding 4.1.1 Adhesion by thin adhesive layers 4.1.2 Thermocompression bonds 4.2 Nanosoldering 4.2.1 Deposition of low melting point materials 4.2.2 Segmented nanowires 4.3 Resumée 5 Conclusion and perspectives 5.1 Conclusion 5.2 Perspectives on further investigations 6 Appendices 6.1 Technical equipment 6.2 Experimental methods 6.3 Selected characterisation techniques 6.4 Supplementary Information 6.5 Glossary 6.6 List of publications & presentations Bibliography

(1) We will show that nano sized samples of SAPO-34 synthesized by microwave heating presents much higher lifetime than standard-SAPO-34 synthesized by conventional hydrothermal method for the reaction of methanol to olefins. (2) We will stabilize the Nano SAPO-34 in the ways such as steaming with water or calcinated in H2 condition. (3) The treatment of mix alkali treatment with proper TPAOH/NaOH could make composites with mesopore and microporous structure in the zeolite ZSM-5 to reduce strong acid quantity and the change the selectivity of the main product. (4) Different 8MR zeolite show different selectivity and lifetime in the same condition in the reaction of methanol to olefins. / Li, Z. (2014). New micro and mesoporous materials for the reaction of methanol to olefins [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/44229

4 ABSTRACT The synthesis has been described yielding a new type of rigid conjugated polymer networks which possess a high content of permanent micropores and macropores and exhibit high surface areas up to 1469 m2/g. The networks have been prepared via chain-growth coordination polymerization catalysed with insertion catalysts based on Rh complexes. This polymerization has been newly applied to bifunctional acetylenic monomers of diethynylarene type (1,4-diethynylbenzene, 1,3-diethynylbenzene and 4,4'-diethynylbiphenyl). The covalent structure of the networks consists of the polyacetylene main chains densely connected by arylene struts. The W and Mo metathesis catalysts have been revealed as inefficient for the synthesis of these networks. The increase in the polymerization temperature and time has been shown to affect positively the content and the diameter (up to 22 nm) of the mesopores in the networks. A mechanism has been proposed that explains the mesopores formation as a result of mutual knitting of small particles of the microporous polymer. The application of emulsion polymerization technique allowed to prepare texturally hierarchical polyacetylene networks possessing interconnected open macropores (diameter up to 4,8 μm) the walls of which exhibited micro/mesoporous texture. It was demonstrated...