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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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Showing 1 to 10 of 11 (0.07 seconds)Spelling suggestions: "subject:"stmicroelectronics.adopting"" "subject:"microelectronics.in""
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Characterization of an in-core irradiator for testing of microelectronics in a mixed radiation environmentAghara, Sukesh K. 28 August 2008 (has links)
Not available / text
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| 2 |
A fault detection and diagnosis technique for multi-chip module interconnectsKim, Bruce Chang-Shik 05 1900 (has links)
No description available.
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| 3 |
Design for testability techniques and optimization algorithms for performance and functional testing of mult-chip module interconnectionsPendurkar, Rajesh 05 1900 (has links)
No description available.
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| 4 |
Design of an advanced system for inspection of microelectronic devices and their solder connections using laser-induced virbration techniquesHoward, Turner A. 08 1900 (has links)
No description available.
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| 5 |
High yield flip chip processing and failure mode analysis for surface mount applicationsTsai, Wen-Kai Mike 08 1900 (has links)
No description available.
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| 6 |
A parallel digital interconnect test methodology for multi-chip module substrate networksNewman, Kimberly Eileen 05 1900 (has links)
No description available.
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| 7 |
Parallel test techniques for multi-chip modulesSasidhar, Koppolu 08 1900 (has links)
No description available.
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| 8 |
Analysis of interconnect yield for a high throughput flip chip assembly processMcGovern, Lawrence P. 12 1900 (has links)
No description available.
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| 9 |
Design and integration of a large area warpage measurement systemPetriccione, Gregory James 05 1900 (has links)
No description available.
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| 10 |
Reliability investigation of printed wiring boards processed with water soluble flux constituentsReady, William Judson, IV 14 July 2000 (has links)
The purpose of this research was to investigate the factors that enhance conductive anodic filament (CAF) formation in printed wiring boards. The variables studied were (1) flux formulation, (2) conductor spacing, (3) operating voltage, and (4) temperature.
A Weibull distribution of failure times due to CAF was observed. A novel test circuit was designed and implemented that allowed the mean time to failure to be determined for boards processed with three different fluxes, at 0.5 mm and 0.75 mm conductor spacings and at 150V and 200V. The boards were aged at 85%RH and a
temperature of 75°C, 85°C or 95°C.
It was found that the flux formulation affected the rate of CAF formation. A modified linear aliphatic polyether flux with a chloride activator had a significantly different activation energy than control printed wiring boards or those boards processed with a poly(ethylene/propylene) glycol flux or a poly(ethylene/propylene) glycol flux with a bromide activator.
The addition of bromine to a poly(ethylene/propylene) glycol flux decreased the rate of CAF formation as compared to poly(ethylene/propylene) glycol without a halide
activator. The inter-relation between voltage and conductor spacing was quantified as a L4/V2 relationship for the plated through hole test pattern used in this study. 325V/mm was found to be a critical voltage gradient for the formation of CAF. The maximum temperature of the reflow profile also greatly enhances CAF formation and decreases the mean time to failure.
Microscopic analysis showed distinct differences in CAF morphology between the various processed boards. Control boards had small halo-like CAF formations around a separated fiber / epoxy interface. CAF that formed on boards processed with poly(ethylene/propylene) glycol or poly(ethylene/propylene) glycol with a bromine activator had a stratified appearance that penetrated well into the epoxy. Boards that were processed with the modified linear aliphatic polyether with chlorine activator had a striated morphology that also penetrated into the epoxy. All CAFs were consistently copper and chlorine containing despite the use of a bromine containing flux. Electron diffraction revealed that a CAF observed in this study was synthetic atacamite. Stainless steel (i.e., iron, nickel, and chromium) residues were also observed as a result of drill bit breakage during PTH formation.
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