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Surface studies on semiconductor processing and related phenomenaMurrell, Adrian J. January 1990 (has links)
No description available.
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Modeling of impression testing to obtain mechanical properties of lead-free solders microelectronic interconnectsHow, Yew Seng. 12 1900 (has links)
The increasing structural functionalities of materials in microelectronics and MEMs packages has led to an explosion of interest in characterizing the mechanical properties of small volumes of materials in the micrometer to nanometer regime. In microelectronics packages, one of the main challenges in reliability assessment is the prediction of solder joint failure during service applications. To a large extent, this is hindered by the difficulty in measuring the properties of micro-scale solder balls, which can be quite different from those of bulk solders. Recently, there has been substantial interest in miniaturized impression testing for measuring creep and other mechanical properties of microelectronic solder joints. Since impression testing produces punch stress versus impression strain data, it is necessary to find the appropriate correlations to convert the properties obtained by impression stress-strain testing to equivalent uniaxial properties. Therefore, in this work, finite element modeling using ANSYSTM is employed to obtain the elastic, plastic and creep properties of these Sn-Ag solder joints from impression testing, which uses a flat-tip cylindrical indenter, so that correlations may be drawn with corresponding properties from uniaxial testing.
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The adoption of Application Specific Integrated Circuit (ASIC) technology by the UK manufacturing baseMcArdle, Christopher January 1997 (has links)
Since the late 1970s, families of microelectronic technologies that could bring the advantages of high levels of electronic integration have been available at reasonable prices and manageable risk to all sectors of UK industry. However, the uptake of these technologies has been painfully slow, particularly by the small and medium enterprises (SMEs) that make up most of the companies currently operating in the UK. It is the aim of the research described here to assess how slow the uptake has been, the reasons for it, and possible solutions to the problem. The problem is investigated with reference to SMEs. In order to reach conclusions it has been necessary to:- • Define Application Specific Integrated Circuit (ASIC) technology and review its history • Review that nature of the UK SME base and identify why they should use ASICs • Review the UK, European and World ASIC markets • Analyse the nature of the UK ASIC design and supply industry • Ascertain the reasons for non-adoption and assess their validity • Relate the findings of this research to appropriate business, organisational and system models • Review past and existing technology-transfer programmes operating in the area of ASIC adoption at a UK, European and world level • Compare the adoption of ASIC technology with the adoption of similar, wide-ranging, new technologies The study concludes that the technology is unique in the wide range of industries to which it can be applied, and that although some advances in adoption have been made, there remains a significant number of hurdles to adoption which can best be addressed by government intervention and supporting activity from supply-companies, trade associations, user-groups and professional and educational institutions. Only once adoption has reached a 'critical mass' can it be assumed that a self-sustaining market will result.
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A thick film hybrid circuit laboratory manualCasey, Michael Raymond January 2010 (has links)
Digitized by Kansas Correctional Industries
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An investigation of integrated injection logicConnor, Peter John January 2011 (has links)
Typescript. / Digitized by Kansas Correctional Industries
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Design, synthesis, and evaluation of materials for microelectronics applicationsHeath, William Hoy, January 1900 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.
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Expitaxial films of chromium dioxide from a new precursor (Cr8O21) and research on their application in spin-electronic devicesIvanov, Pavel G. Lind, David. January 2002 (has links)
Thesis (Ph. D.)--Florida State University, 2002. / Advisor: Dr. David Lind, Florida State University, College of Arts and Sciences, Dept. of Physics. Title and description from dissertation home page (viewed Sept. 29, 2003). Includes bibliographical references.
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Fabrication of protein and DNA-mediated devices : a potential application in microelectronics /Wan, Kris Pui Yu. January 2003 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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Characterization of an in-core irradiator for testing of microelectronics in a mixed radiation environmentAghara, Sukesh K. 28 August 2008 (has links)
Not available / text
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Design and implementation of GaAs CCD/MESFET ICs for artificial neural network applicationChen, Lidong 31 July 2015 (has links)
Graduate
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