Thesis--PlanB (M.S.)--University of Wisconsin--Stout, 2001. / Includes bibliographical references.

Thesis (M.S.)--University of Wisconsin--Madison, 1937. / Typescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaf 48).

by Lam Ka. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references (leaves 54-60). / Abstracts in English and Chinese. / ABSTRACT --- p.i / ACKNOWLEDGEMENT --- p.ii / TABLE OF CONTENT --- p.iii / LIST OF TABLES --- p.v / LIST OF FIGURES --- p.vii / Chapter CHAPTER ONE: --- INTRODUCTION --- p.1 / Chapter 1.1 --- Metal deposition --- p.1 / Chapter 1.2 --- Electroless Nickel Plating --- p.3 / Chapter 1.2.1 --- Historical Review and Applications --- p.3 / Chapter 1.2.2 --- General Chemical Principles --- p.5 / Chapter 1.2.3 --- Previous Studies --- p.7 / Chapter 1.3 --- Scope of Work --- p.12 / Chapter CHAPTER TWO: --- EXPERIMENTAL --- p.13 / Chapter 2.1 --- Bath Composition --- p.13 / Chapter 2.1.1 --- Theoretical Description --- p.13 / Chapter 2.2.2 --- Materials --- p.15 / Chapter 2.2 --- Procedure and Experimental Conditions --- p.17 / Chapter 2.3 --- Characterization of EN Coatings --- p.18 / Chapter 2.3.1 --- Theory --- p.18 / Chapter 2.3.1.1 --- Energy Dispersive X-ray Detection of Scanning Electron Microscopy --- p.18 / Chapter 2.3.1.2 --- Polycrystalline X-ray Diffraction --- p.18 / Chapter 2.3.1.3 --- X-ray Photoelectron Spectroscopy --- p.20 / Chapter 2.3.1.4 --- Microhardness --- p.22 / Chapter 2.3.1.5 --- Corrosion resistance --- p.23 / Chapter 2.3.1.6 --- Thickness Measurement --- p.23 / Chapter 2.4 --- Application --- p.24 / Chapter CHAPTER THREE: --- RESULTS AND DISCUSSION --- p.26 / Chapter 3.1 --- Appearance --- p.28 / Chapter 3.2 --- Microstructure --- p.30 / Chapter 3.2.1 --- Effect of Phosphorus Content --- p.30 / Chapter 3.2.2 --- Effect of heat treatment --- p.32 / Chapter 3.3 --- Corrosion Resistance --- p.37 / Chapter 3.3.1 --- Effect of Phosphorus Content --- p.37 / Chapter 3.3.2 --- Effect of Heat Treatment --- p.45 / Chapter 3.3.2.1 --- Temperature --- p.45 / Chapter 3.3.2.2 --- Cooling Rate --- p.47 / Chapter 3.4 --- Microhardness --- p.49 / Chapter 3.4.1 --- Effect of Phosphorus Content --- p.49 / Chapter 3.4.2 --- Effect of Heat Treatment --- p.49 / Chapter CHAPTER FOUR: --- CONCLUSION --- p.52 / REFERENCES --- p.54

The purpose of this study is to investigate the varying conditions in types of solutions, concentrations of solutions, hydrogen-ion concentration, current densities and potentials in the electro deposition of nickel.

by Chow Yeung Ming = 化學鍍鎳層的表面性質與焊接能力之關係 / 周洋明. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references (leaves 62-65). / Text in English; abstracts in English and Chinese. / by Chow Yeung Ming = Hua xue du nie ceng de biao mian xing zhi yu han jie neng li zhi guan xi / Zhou Yangming. / Abstract --- p.i / 論文摘要 --- p.ii / Acknowledgements --- p.iii / Table of Contents --- p.v / List of Figures --- p.viii / List of Tables --- p.ix / Abbreviations --- p.x / Chapter Chapter 1 --- INTRODUCTION / Chapter 1.1 --- Electroless Plating (Autocatalytic Deposition) --- p.1 / Chapter 1.2 --- Electroless Nickel (EN) Plating --- p.2 / Chapter 1.3 --- Types of Electroless Nickel Deposits --- p.2 / Chapter 1.4 --- Properties of Electroless Nickel --- p.5 / Chapter 1.5 --- Applications of Electroless Nickel in Electronic Packaging Industry --- p.7 / Chapter 1.6 --- Importance of Solderability --- p.8 / Chapter 1.7 --- Literature Review of Solderability Studies of Electroless Nickel --- p.9 / Chapter 1.8 --- Motivations & Aims of Studies --- p.10 / Chapter Chapter 2 --- EXPERIMENTAL & INSTRUMENTATION / Chapter 2.1 --- Electroless Nickel Plating --- p.11 / Chapter 2.2 --- Solderability Measurements / Chapter 2.2.1 --- Soldering --- p.13 / Chapter 2.2.2 --- Various test methods for solderability --- p.13 / Chapter 2.2.3 --- Wetting balance method --- p.15 / Chapter 2.2.4 --- Solderability measurements of electroless nickel deposits --- p.17 / Chapter 2.2.5 --- Assessment of wetting curves --- p.19 / Chapter 2.3 --- Surface Oxidation Studies / Chapter 2.3.1 --- Use of X-ray photoelectron spectroscopy (XPS) in surface characterization --- p.19 / Chapter 2.3.2 --- XPS system --- p.22 / Chapter 2.3.3 --- Surface composition of electroless nickel deposits --- p.22 / Chapter 2.3.4 --- Oxide thickness characterization by angle-resolved XPS --- p.25 / Chapter 2.3.5 --- Oxide thickness characterization by XPS depth profiling with low-energy-ion sputtering --- p.28 / Chapter 2.4 --- Surface Morphology Studies / Chapter 2.4.1 --- Surface morphology studies by scanning Auger electron microscopy (SAM) & atomic force microscopy (AFM) --- p.28 / Chapter 2.4.2 --- SAM studies of electroless nickel surfaces --- p.29 / Chapter 2.4.3 --- AFM studies of electroless nickel surfaces --- p.29 / Chapter 2.5 --- Oxide Quality Studies --- p.31 / Chapter Chapter 3 --- RESULTS & DISCUSSIONS / Chapter 3.1 --- Solderability Measurements by the Wetting Balance Method --- p.33 / Chapter 3.2 --- Surface Oxidation Studies / Chapter 3.2.1 --- Surface composition of electroless nickel deposits --- p.36 / Chapter 3.2.2 --- Oxide thickness characterization by angle-resolved XPS --- p.38 / Chapter 3.2.3 --- Oxide thickness characterization by XPS depth profiling with low-energy-ion sputtering --- p.44 / Chapter 3.2.4 --- Conclusion --- p.47 / Chapter 3.3 --- Surface Morphology Studies / Chapter 3.3.1 --- SAM studies of electroless nickel surfaces --- p.49 / Chapter 3.3.2 --- AFM studies of electroless nickel surface --- p.49 / Chapter 3.3.3 --- Conclusion --- p.53 / Chapter 3.4 --- Interpretation of Wetting Kinetics of Electroless Nickel --- p.54 / Chapter Chapter 4 --- CONCLUSIONS & FURTHER STUDIES / Chapter 4.1 --- Conclusions --- p.59 / Chapter 4.2 --- Further Studies --- p.60 / Appendix --- p.61 / References --- p.62

M. Tech. Metallurgical Engineering / Mild steel is vulnerable to corrosion; this behaviour affects the material strength and electrochemical behaviour during industrial application. Mild steel also has poor tribological resistance; its application for the components of machines, however, requires good tribological property. The cost incurred from equipment failures, properties loss and increased production overheads makes is imperative to enhance mild steel's electrochemical and tribological properties. Electroless nickel plating has found extensive use in various industries attesting to its exceptional properties. The effect of bath parameters on the electroless plating process is of importance as this affects the adhesion, morphological behaviour, electrochemical properties and uniformity of coating. The key aim of this research is: To generally improve the understanding of the effect of electroless binary and ternary alloys on the corrosion and wear resistance of mild steel using weight loss method, potential measurement, linear polarization and tribological sliding wear tests. This work studies the effect of temperature, concentration, deposition time and the inclusion of Tin (Sn) as a third addition to the electroless bath. Corrosion and wear behaviour of the electroless plated mild steel was studied.

In electrical contacts, thin films of nickel and gold or silver are traditionally plated on top of a copper base plate to provide corrosion resistance and wear protection. Most recently, the rising cost of noble metals and intensified competition in manufacturing technology has driven the industry towards thinner plating layers, which gives rise to questions regarding how interfacial contact and wear is affected by plating thickness and material characteristics. This study uses a combination of finite element analysis and ex-situ wear measurement to determine the effect of gold plating thickness on wear performance under linear reciprocating sliding contact. Correlations between predicted and measured results lead to insight into the stress state within the multi-layer system under contact conditions as well as a wear map for gold platings that can be used to inform future connector designs. The middle layer material, Ni, is relatedly inexpensive, but takes a relatively long time to deposit. Because this deposition time has a direct influence on the cost of manufacturing, it is important to reduce the Ni thickness as well. This project thus determines how different combinations of Ni and Au properties influence wear and subsurface layer exposure, which is critical for determining the makeup of future, low-cost, connector designs.

In this thesis, manufacturing of microirradiators, electrodeposition of radioactive elements such as Ni-63, and applications of these radioactive sources are discussed. Ni-63 has a half life of 100 years and a low energy beta electron of 67 keV, ideal for low dose low linear energy transfer (LET) research. The main focus of the research is on the novel Ni-63 microirradiator. It contains a small amount of total activity of radiation but a large flux, allowing the user to safely handle the microirradiator without extensive shielding. This thesis is divided into nine chapters. Properties of microirradiators and various competing radioactive sources are compared in the introduction (chapter 1). Detailed description of manufacturing Ni-63 microirradiator using the microelectrode as the starting point is outlined in chapter 2. The microelectrode is a 25 µm in diameter Pt disk sealed in a pulled 1 mm diameter borosilicate capillary tube, as a protruding wire or recessed disk microelectrode. The electrochemically active surface area of each is verified by cyclic voltammetry. Electrodeposition of nickel with a detailed description of formulation of the electrochemical bath in a cold "non-radioactive setting" was optimized by using parameters as defined by pourbaix diagrams, radioactive electroplating of Ni-63, and incorporation of safety regulations into electrodeposition. Calibration and characterization of the Ni-63 microirradiators as protruding wire and recessed disk microirradiators is presented in chapter 3. In chapters 4 through 6, applications of the Ni-63 microirradiators and wire sources are presented. Chapter 4 provides a radiobiological application of the recessed disk microirradiator and a modified flush microirradiator with osteosarcoma cancer cells. Cells were irradiated with 2000 to 1 Bq, and real time observations of DNA double strand breaks were observed. A novel benchtop detection system for the microirradiators is presented in chapter 5. Ni-63 is most commonly measured by liquid scintillation counters, which are expensive and not easily accessible within a benchtop setting. Results show liquid scintillation measurements overestimates the amount of radiation coming from the recessed disk. A novel 10 µCi Ni-63 electrochemically deposited wire acting as an ambient chemical ionization source for pharmaceutical tablets in mass spectrometry is in chapter 6. Typically, larger radioactive sources (15 mCi) of Ni-63 have been used in an ambient ionization scenario. Additionally, this is the first application of using Ni-63 to ionize in atmosphere pharmaceutical tablets, leading to a possible field portable device. In the last chapters, chapters 7 through 8, previous microirradiator experiments and future work are summarized. Chapter 7 illustrates the prototype of the electrochemically deposited microirradiator, the Te-125 microirradiator. In conjunction with Oak Ridge National Laboratory, Te-125m is a low dose x-ray emitting element determined to be the best first prototype of an electrochemically deposited microirradiator. Manufacturing, characterization, and experiments that were not successful leading to the development of the Ni-63 microirradiator are discussed. In chapter 8, future work is entailed in continuing on with this thesis project. The work presented in the thesis is concluded in chapter 9.

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Thesis (Ph. D.)--University of Texas at Austin, 2004. / Supervisor: Michael D. Bryant. Vita. Includes bibliographical references.