Yes / This paper examines the case for an ultrawideband planar inverted-F-L-antenna design intended for use in the lower sub-band. The antenna construction is based on the conventional inverted F, and inverted L as its feed element, and parasitic element, respectively. The optimized antenna size is 30×15×4mm3. The prototype antenna has a good return loss of -10 dB, and a 66.6% impedance bandwidth (2.8 GHz ¿ 5.6 GHz), the gain varies between 3.1 dBi and 4.5 dBi.

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Surface plasmon resonances at the nanoscale hold great potential for applications in many areas, and the characterization of plasmonic nanostructures plays a critical role in the realization of these applications. Electron energy loss spectroscopy (EELS) has emerged as a powerful characterization tool to study the response of plasmonic nanostructures due to its high spatial-resolution and the capability to probe bright as well as dark plasmonic modes. The main limiting factor of EELS is the energy resolution. However, in this thesis, we overcome this limitation using a combination of electron monochromation and the use of the Richardson-Lucy algorithm. We show that the algorithm could be used to obtain effective energy resolutions up to 10 meV. Using EELS we analyze the resonances of planar nanostructures, and we found that the supported resonances can be described as edge and cavity or film modes, behaving as 1D and 2D modes respectively. We also demonstrate that edge modes are unaffected by the presence of bends up to the critical angle of 90◦ where the modes start self-interacting producing large energy shifts. The interaction of plasmon resonances is also studied, and we show that the coupling can be reduced to three behaviors: coupling through the edge, coupling through a corner, and non-coupling. We propose a method to control the coupling through the edge in offset nanowires, by tuning the nodal alignment and spectral overlap of the edge modes. Finally, we analyze the plasmon modes supported by Koch snowflake fractal antennas, and we demonstrate that modes present in the fractals are formed by the edge modes supported by their characteristic edges. This thesis provides a complete picture of the surface plasmon resonances supported by planar nanostructures and demonstrates the ability of EELS to probe and image a wide variety of plasmonic resonances. / Thesis / Doctor of Philosophy (PhD)

Yes / An offset quad-element, two-port, high-gain, and multiband multiple-input multiple-output (MIMO) planar antenna based on a log-periodic dipole array (LPDA) for Ku/K-band wireless communications is proposed, in this paper. A single element antenna has been designed starting from Carrel's theory and then optimized with a 50-Ω microstrip feed-line with two orthogonal branches that results mainly in a broadside radiation pattern and improves diversity parameters. For experimental confirmation, the designed structure is printed on an RT-5880 substrate with a thickness of 1.57 mm. The total substrate dimensions of the MIMO antenna are 55 × 45 mm2. According to the measured results, the designed structure is capable of working at 1.3% (12.82-12.98 GHz), 3.1% (13.54-13.96 GHz), 2.3% (14.81-15.15 GHz), 4.5% (17.7-18.52 GHz), and 4.6% (21.1-22.1 GHz) frequency bands. Additionally, the proposed MIMO antenna attains a peak gain of 4.2-10.7 dBi with maximum element isolation of 23.5 dB, without the use of any decoupling structure. Furthermore, the analysis of MIMO performance metrics such as the envelope correlation coefficient (ECC) and mean effective gain (MEG) validates good characteristics, and field correlation performance over the operating band. The proposed design is an appropriate option for multiband MIMO applications for various wireless systems in Ku/K-bands.

The high-voltage SiC power semiconductor devices have been developed in recent years. They cause an urgent in the need for the power semiconductor packaging to have not only low interconnect resistance, less noise, less parasitic oscillations, improved reliability, and better thermal management, but also High-Voltage (HV) blocking capability. The existing power semiconductor packaging technologies includes wire-bonding interconnect, press pack, flip-chip technology, metal posts interconnected parallel plates structure (MIPPS), dimple array interconnection (DAI), power overlay (POL) technology, and embedded power (EP) technology. None of them meets the requirements of low profile and high voltage rating. The objective of the work in this dissertation is to propose and design a high-voltage power semiconductor device packaging method with low electric field stress and low profile to meet the requirments of high-voltage blocking capability. The main contributions of the work presented in this dissertation are: 1. Understanding the electric field distribution in the package. The power semiconductor packaging is simulated by using Finite Element Analysis (FEA) software. The electric field distribution is known and the locations of high electric field concentration are identified. 2. Development of planar high-voltage power semiconductor device packaging method With the proposed structure in the dissertation, the electric field distribution of a planar device package is improved and the high electric field intensity is relieved. 3. Development of design guidelines for the propsed planar high-voltage device packaging method. The influence of the structure dimensions and the material properties is studied. An optimal design is identified. The design guideline is given. 4. Fabrication and experimental verification of the proposed high-voltage device packaging method A detailed fabrication procedure which follows the design guideline is presented. The fabricated modules are tested by using a high power curve tracer. Test results verify the proposed method. 5. Simplification of the structure model of the proposed device package The package structure model is simplified through the elimination of power semiconductor device internal structure model. The simplified model can be simulated by a non-power device simulator. The simulation results of the simplified model match the simulation results of the complete model very well. / Ph. D.