Recent advances in materials engineering have given rise to a new class of materials known as active materials. These materials when used appropriately can aid in development of smart structural systems. Smart structural systems are adaptive in nature and can be utilized in applications that are subject to time varying loads such as aircraft wings, structures exposed to earthquakes, electrical interconnections, biomedical applications, and many more. Materials such as piezoelectric crystals, electrorheological fluids, and shape memory alloys (SMAs) constitute some of the active materials that have the innate ability to response to a load by either changing phase (e.g., liquid to solid), and recovering deformation. Active materials when combined with conventional materials (passive materials) such as polymers, stainless steel, and aluminum, can result in the development of smart structural systems (SSS). This Dissertation focuses on characterization of SMAs and structures that incorporate SMAs. This characterization is based on a hybrid analytical, computational, and experimental solutions (ACES) methodology. SMAs have a unique ability to recover extensive amounts of deformation (up to 8% strain). NiTiNOL (NOL: Naval Ordinance Lab) is the most commonly used commercially available SMA and is used in this Dissertation. NiTiNOL undergoes a solid-solid phase transformation from a low temperature phase (Martensite) to a high temperature phase (Austenite). This phase transformation is complete at a critical temperature known as the transformation temperature (TT). The low temperature phase is softer than the high temperature phase (Martensite is four times softer than Austenite). In this Dissertation, use of NiTiNOL in representative engineering applications is investigated. Today, the NiTiNOL is either in ribbon form (rectangular in cross-section) or thin sheets. In this Dissertation, NiTiNOL is embedded in parent materials, and the effect of incorporating the SMA on the dynamic behavior of the composite are studied. In addition, dynamics of thin sheet SMA is also investigated. The characterization is conducted using state-of-the- art (SOTA) ACES methodology. The ACES methodology facilitates obtaining an optimal solution that may otherwise be difficult, or even impossible, to obtain using only either an analytical, or a computational, or an experimental solution alone. For analytical solutions energy based methods are used. For computational solutions finite element method (FEM) are used. For experimental solutions time-average optoelectronic holography (OEH) and stroboscopic interferometry (SI) are used. The major contributions of this Dissertation are: 1. Temperature dependent material properties (e.g., modulus of elasticity) of NiTiNOL based on OEH measurements. 2. Thermomechanical response of representative composite materials that incorporate NiTiNOL“fibers". The Dissertation focuses on thermomechanical characterization of NiTiNOL and representative structures based on NiTiNOL; this type of an evaluation is essential in gainfully employing these materials in engineering designs.

Technological advancement has thrust MEMS design and fabrication into the forefront of modern technologies. It has become sufficiently self-sustained to allow mass production. The limiting factor which is stalling commercialization of MEMS is the packaging and device reliability. The challenging issues with MEMS packaging are application specific. The function of the package is to give the MEMS device mechanical support, protection from the environment, and electrical connection to other devices in the system. The current state of the art in MEMS packaging transcends the various packaging techniques available in the integrated circuit (IC) industry. At present the packaging of MEMS includes hermetic ceramic packaging and metal packaging with hermetic seals. For example the ADXL202 accelerometer from the Analog Devices. Study of the packaging methods and costs show that both of these methods of packaging are expensive and not needed for majority of MEMS applications. Due to this the cost of current MEMS packaging is relatively high, as much as 90% of the finished product. Reducing the cost is therefore of the prime concern. This Thesis explores the possibility of an inexpensive plastic package for MEMS sensors like accelerometers, optical MEMS, blood pressure sensors etc. Due to their cost effective techniques, plastic packaging already dominates the IC industry. They cost less, weigh less, and their size is small. However, porous nature of molding materials allows penetration of moisture into the package. The Thesis includes an extensive study of the plastic packaging and characterization of three different plastic package samples. Polymeric materials warp upon absorbing moisture, generating hygroscopic stresses. Hygroscopic stresses in the package add to the thermal stress due to high reflow temperature. Despite this, hygroscopic characteristics of the plastic package have been largely ignored. To facilitate understanding of the moisture absorption, an analytical model is presented in this Thesis. Also, an empirical model presents, in this Thesis, the parameters affecting moisture ingress. This information is important to determine the moisture content at a specific time, which would help in assessing reliability of the package. Moisture absorption is modeled using the single phase absorption theory, which assumes that moisture diffusion occurs freely without any bonding with the resin. This theory is based on the Fick's Law of diffusion, which considers that the driving force of diffusion is the water concentration gradient. A finite difference simulation of one-dimensional moisture diffusion using the Crank-Nicolson implicit formula is presented. Moisture retention causes swelling of compounds which, in turn, leads to warpage. The warpage induces hygroscopic stresses. These stresses can further limit the performance of the MEMS sensors. This Thesis also presents a non invasive methodology to characterize a plastic package. The warpage deformations of the package are measured using Optoelectronic holography (OEH) methodology. The OEH methodology is noninvasive, remote, and provides results in full-field-of-view. Using the quantitative results of OEH measurements of deformations of a plastic package, pressure build up can be calculated and employed to assess the reliability of the package.