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This dissertation describes the fabrication and integration of a thin film edge emitting laser (EEL) whose optical output is coupled into a polymer waveguide integrated onto the same electrical interconnection substrate. This embedded laser/waveguide structure is a fundamental building block toward the realization of planar lightwave circuits using embedded optical interconnections. The demonstration of a thin film laser integrated with a planar waveguide eliminates the need for either an external optical source coupled to the waveguide or a bump bonded optical source with a beam turning element to turn an optical beam into the waveguide. In this work, the wedge-induced facet cleaving (WFC) method is adapted to fabricate the thin film EELs. Bisbenzocyclobutene (BCB) polymers are used to fabricate channel waveguides, and thin film lasers are integrated with the polymer waveguides. The coupling efficiency from the laser to the polymer waveguide is estimated through measurement and theoretically calculated. In the theoretical calculation, the thin film transfer matrix method is used to analyze the optical modes in the semiconductor cavity. The coupling efficiency from the laser to the polymer waveguide is analyzed using a finite element method (FEM), and are then compared to the experimental results. The experimentally estimated coupling efficiency is in good agreement with that of the theoretical calculation. In addition, the relationship between threshold current, output power, and facet reflectivity of the thin film laser is analyzed using FEM.

Large scale data centers (DC) and high performance computing (HPC) systems require more and more computing power at higher energy efficiency. They are already consuming megawatts of power, and a linear extrapolation of trends reveals that they may eventually lead to unrealistic power consumption scenarios in order to satisfy future requirements (e.g., Exascale computing). Conventional complementary metal oxide semiconductor (CMOS)-based electronic interconnects are not expected to keep up with the envisioned future board-to-board and chip-to-chip (within multi-chip-modules) interconnect requirements because of bandwidth-density and power-consumption limitations. However, low-power and high-speed optics-based interconnects are emerging as alternatives for DC and HPC communications; they offer unique opportunities for continued energy-efficiency and bandwidth-density improvements, although cost is a challenge at the shortest length scales. Plasmonics-based interconnects on the other hand, due to their extremely small size, offer another interesting solution for further scaling operational speed and energy efficiency. At the device-level, CMOS compatibility is also an important issue, since ultimately photonics or plasmonics will have to be co-integrated with electronics. In this paper, we survey the available literature and compare the aforementioned interconnect technologies, with respect to their suitability for high-speed and energy-efficient on-chip and offchip communications. This paper refers to relatively short links with potential applications in the following interconnect distance hierarchy: local group of racks, board to board, module to module, chip to chip, and on chip connections. We compare different interconnect device modules, including low-energy output devices (such as lasers, modulators, and LEDs), photodetectors, passive devices (i.e., waveguides and couplers) and electrical circuitry (such as laserdiode drivers, modulator drivers, transimpedance, and limiting amplifiers). We show that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term. We also present that plasmonic interconnect modules could offer ultra-compact active areas, leading to high integration bandwidth densities, and low device capacitances allowing for ultra-high bandwidth operation that would satisfy the application requirements further into the future.

Cette thèse s'inscrit dans le cadre du projet français FUI8-ORIGIN qui vise à développer les performances des réseaux domestiques en apportant des solutions sans multi-Gigabits faiblement radiatives, économes et pérennes. La solution ORIGIN est caractérisée par l'action complémentaire de deux technologies: les communications sans fil 60 GHz, avec notamment la création récente en Janvier 2013 de la nouvelle norme WiFi 60GHz, et la mise en place d'une infrastructure Radio-sur-Fibre (RoF) afin d'étendre la propagation de ses signaux radio fortement atténués par l'atmosphère et les murs, au sein de l'ensemble de la maison. Cette thèse porte sur le développement des composants et modules optoélectroniques bas couts, permettant d'assurer ces contraintes. Le travail implique de couvrir de la puce semi-conducteur au modules et jusqu'au système intégré dans le démonstrateur. Les puces sélectionnées sont caractérisées de manière précise en développant des bancs de mesures adaptées aux applications analogiques RoF. Les performances RoF ont été évaluées et comparées en termes de réponse en fréquence, de bruit et de non-linéarités. Un dimensionnement complet de l'infrastructure Radio-sur-Fibre pour le démonstrateur est ensuite mené, intégrant et dimensionnant le bilan de liaison global à partir modules et cartes réalisés et développés par les partenaires du projet. Le module transmetteur Radio-sur-Fibre (TRoF) est ainsi conçu, assemblé et testé. Les performances du module ont été mesurées et simulées à chaque étape de la procédure d'intégration. Le démonstrateur final basé sur l'architecture multipoint-à-multipoint a été réalisée à l'aide d'un nœud central optoélectronique pour la répartition du signal et d'une Green Box permettant le contrôle de l'allumage des différentes pièces, et ainsi la rationalisation du rayonnement et de la consommation du système. Une transmission bidirectionnelle en temps réel entre deux dispositifs de Wireless HD commerciaux à ~3 Gbit/s a été démontrée. Dans une dernière section de cette thèse, des directions pour améliorer les lasers à cavité émettant par la surface (VCSEL) et les phototransistors SiGe sont explorées. Des VCSEL analogiques avec une bande passante de plus de 25 GHz sont développés avec la société Philips ULM Photonics et mesurés. Notre action s'est concentrée sur les dimensions latérales de la structure, en bénéficiant des améliorations des couches verticale de la part de ULM Photonics. Outre les dimensions du VCSEL propre, ce travail a aussi visé l'amélioration des lignes d'accès pour permettre à la fois une meilleure dissipation thermique et une meilleure adaptation réactive du VCSEL à son électronique amont. Une nouvelle technologie de couplage optique collective et passive est enfin proposée. Originale et brevetée à l'occasion de ce travail, elle permet le couplage optique vertical à la fibre optique multimode et monomode de dispositifs optoélectroniques de petites tailles, inférieurs à 10µm, ainsi permettant simultanément de réduire les pertes de couplage, d'augmenter la fréquence de fonctionnement des composants couplés en réduisant leur dimensions, et de réduire le coût et le temps de réalisation du couplage / Wireless communication technologies have become one of the most popular and indispensable part of people's lives in the recent years, offering mobility and services never before available from mobile communication until local network communication. This work is based on the frame of the French ORIGIN project and intended to explore the Home Area Network using the most recent Wi-Fi standard at 60 GHz with the goal to present a solution for the upcoming days where MultiGbit/s wireless communication will be required. The ORIGIN solution is characterized by the complementary action of two technologies: 60 GHz Wireless communication and Radio-over-Fiber (RoF) infrastructure. The project pretends to propose a real prototype based on RoF transducers and a Multipoint-to-Multipoint architecture to cover the entire house. This thesis covers from the single optoelectronic chip devices until the system implementation and the final demonstrator. The light source and the photodetector choice were very important since it dictated the RoF transducer architecture. Our choice was on 850 nm multimode devices (GaAs VCSEL and SiGe HPT) which allow relaxed constraints on the optical packaging and, therefore, low cost solutions. In terms of performances those devices are limited in a few tens of Gigahertz of bandwidth which was the reason for the intermediate frequency (IF) architecture. This thesis work addressed the electrical and optical interconnection of the optoelectronic chip devices. It explored the integration of hybrid amplification stages and passive networks within optoelectronic receivers and emitters. The optical packaging issues were addressed through a conventional coupling technique using a ball lens first. The die device performances were evaluated and compared with a packaged module in terms of frequency response, noise and nonlinearities. Since performances are usually measured as link performances we proposed a definition of the Opto-microwave figures of merit, such as Opto-microwave gain, noise, nonlinearities and EVM. They are presented and integrated into behavioral models, allowing both the individual performances extraction and system design. The integration of the RoF module in the system is the final part of this thesis. The performances were measured and simulated at each integration step. The final demonstrator based on the multipoint-to-multipoint architecture was implemented using an optoelectronic central node for the signal repartition and the Green Box for signal controlling. Real-time bidirectional transmission between two commercial WirelessHD devices at ~3 Gbit/s was validated. In a final section directions to improve VCSEL and SiGe HPT are explored. 25 GHz analogue VCSELs are explored with a focus on their dimensions, improved access and the potential of a suited matching approach. A novel collective and passive optical coupling technology is also proposed for both VCSEL and top illuminated detectors that couple smaller and faster devices