Report (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaf 75). Also available via the Internet.

Thesis (M.F.A.)--Rochester Institute of Technology, 1988. / Typescript. Includes bibliographical references (leaf 43).

Thesis (M. Sc.)--University of Hong Kong, 1993.

No description available.

Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Electrical Engineering), 2005. / Includes bibliographical references.

Riche en mutations socio-économiques et technologiques, la période actuelle laisse entrevoir une véritable explosion des matériaux destinés au monde de l'emballage. L'objectif de ce travail est de préparer des matériaux hybrides avec différents rapports molaires de précurseurs et d'en étudier les conséquences sur leurs propriétés aussi bien physico-chimiques que mécaniques. Nous avons la méthode sol-gel associée au spin coating avec laquelle on a élaboré nos matériaux hybrides. On a étudié les différents paramètres pouvant jouer un rôle dans la nature du matériau final obtenu et nous avons montré les différentes propriétés des films minces hybrides ainsi que les applications pour lesquelles ils sont destinés. Nous avons utilisé différentes techniques de caractérisation structurale, thermique et mécanique des matériaux hybrides qui nous ont permis d'étudier leurs propriétés et de déterminer leurs performances. On a donc élaboré des sols permettant la fabrication des films hybrides et on a pu montrer l'effet de la variation des rapports molaires sur la caractérisation structurale à la fois des et des dépôts. La deuxième partie de la thèse présente les résultats de la caractérisation mécanique des hybrides, par nanoindentation qui sont analysés en tenant compte de plusieurs effects notamment celui de la nature du groupement R' et de la teneur et de la taille des composants organiques. On a étudié aussi l'influence de la couche hybride sur les propriétés de perméabilité du PET aux gaz ainsi que l'effet des proportions de la partie inorganique sur cette propriété. / Rich in socioeconomic and technological changes, the current period suggests an explosion of materials for packaging world. The goal of this work is to prepare hybrid materials with different molar ratios of precursors and to study the consequences of their properties both physico-chemical and mechanical. We have the sol-gel method combined with spin coating with which we have developed our hybrid materials. We studied the different parameters that may play a role in the nature of the final material obtained and we showed the different properties of thin films and hybrid applications for which they are intended. We used different techniques of characterization (structural, thermal and mechanical) of hybrid materials that we used to study their properties and determine their performances. It has developed land for the production of hybrid films and it was shown the effect of varying molar ratios on the structural characterization of both and deposits. The second part of the thesis presents the results of the mechanical characterization of the hybrids, which are analyzed by nanoindentation taking into account several effects including the nature of the R' group and grade and size of organic components. We also studied the influence of the hybrid layer on the permeability properties of PET to gases and the effect of proportions of the inorganic part of this property.

No description available.

<p>packaging as a strategic tool</p>

packaging as a strategic tool

The demands for higher clock speeds and larger current magnitude in high-performance flip-chip electronic packaging configurations of small footprint have inevitably raised the concern over rapid thermal transients and large thermal spatial gradients that could severely compromise package performance. Coupled electrical-thermal-mechanical multi-physics were explored to evaluate the concern and to establish the knowledge base necessary for improving flip-chip reliability. It was found that within the first few hundred nanoseconds upon power-on, there were fast attenuating, dispersive shock waves of extremely high frequency propagating in the package. The notions of high cycle fatigue, power density and joint time-frequency analysis were employed to characterize the waves and the various failure modes associated with the moving of these short-lived dynamical disturbances in bulk materials and along interfaces. A qualitative measure for failure was also developed which enables the extent of damages inflicted by short-time wave propagation to be calculated in the probability sense. Failure modes identified in this study are all in agreement with what have been observed in industry. This suggests that micron cracks or interfacial flaws initiated at the short-time scale would be further propagated by the CTE-induced thermal stresses at the long-time scale and result in eventual electrical disruptions. Although epoxy-based underfills with fillers were shown to be effective in alleviating thermal stresses and improving solder joint fatigue performance in thermal cycling tests of long-time scale, underfill material viscoelasticity was found to be insignificant in attenuating short-time scale wave propagation. On the other hand, the inclusion of Cu interconnecting layers in flip-chips was shown to perform significantly better than Al layers in suppressing short-time scale effects. These results imply that, if improved flip-chip reliability is to be achieved, all packaging constituent materials need to be formulated to have well-defined short-time scale and long-time scale properties. In addition, the results also suggest that the composition and layout of all packaging components be optimized to achieve discouraging or suppressing short-time scale dynamic effects. In summary, results reported herein and numerical procedures developed for the research would not just render higher packaging manufacturing yield, but also bring out significant impact on packaging development, packaging material formulation and micro-circuit layout design.