Spelling suggestions: "subject:"package.research"" "subject:"linkage:research""
1 |
Visual communication using structural package design : curvilinear box pattern study exploring consumer appealNicholas, Roland Allan George 05 1900 (has links)
No description available.
|
2 |
The use of a char pile reactor to study char bed processesAiken, Gregg W. 11 June 1988 (has links)
No description available.
|
3 |
The effect of modified atmosphere packaging (MAP) on the shelf- life of refrigerated, cubed turkey thigh meatAhn, Insook 18 August 2009 (has links)
This research was designed to investigate the effect of Modified Atmosphere Packaging (MAP) on the shelf life of refrigerated, cubed, turkey thigh meat. Modified atmospheres of 25% carbon dioxide and 75% nitrogen and 20% carbon dioxide, 60% oxygen, and 20% nitrogen were used for MAP1 and MAP2 respectively. All sample packages, MAPl, MAP 2 , and Air Control, were stored at O.5°C. Headspace gas analysis, color measurement, sensory evaluation, aerobic plate count, and oxidative deterioration of fat were examined over 21 day of storage.
Microbiological spoilage was significantly delayed by modified atmosphere treatments. MAP1 delayed fat rancidity while MAP2 increased rancidity because of the high amount of oxygen. The redness of turkey thigh meat was increased in both MAPs. MAP2 showed the highest a values up to storage day 12 and then MAP1 had the highest a values on storage days 16 and 21. Sensory evaluations showed preferences for MAPs in all variables: color, appearance, and odor. ThUS, modified atmosphere treatment 1 (MAP1) demonstrated the best effect on the extension of the shelf life of turkey meat in this study. / Master of Science
|
4 |
A pre-launch study for a new soft drink package.January 1982 (has links)
by Ma Suk-ying. / Thesis (M.B.A.)--Chinese University of Hong Kong, 1982. / Bibliography: leaves 111-112.
|
5 |
Effects of downset and die coat on stress sensitivity in a 16-pin molded plastic DIPPaugh, Michael Ernest, 1954- January 1989 (has links)
Stress sensitivity of a 16 - bit D/A converter in a molded plastic DIP has been studied. Device performance was shown to change as a function of package stress. The effects of die position in the package and the presence or absence of die coat on package stress and device performance were determined. Finite element methods were employed for system analysis. Device stress sensitivity was attributed to diffused bit transistors and the mechanism assigned to nonuniformity of stress on the device bit transistors. Die coat (silicone gel) was shown to reduce normal and shear stresses and have little or no effect on X-axial stresses. Lowering the die in the package was shown to increase the X-axial stress uniformity from the die center to edge for die-coated parts and alter the value of shear stresses near the die edge for parts without die coat.
|
Page generated in 0.0577 seconds