The workshop is composed of two main parts: the first part devoted to atomistic Monte Carlo simulations and the second part devoted to the Phase Field modelling. In each part a lecture will be accompanied by exercise activities.

Phase field modeling and simulation is employed to study the underlying mechanism of enhancing electromechanical properties in single crystals and polycrystals of perovskite-type ferroelectrics around the morphotropic phase boundary (MPB). The findings include: (I) Coherent phase decomposition near MPB in PZT is investigated. It reveals characteristic multidomain microstructures, where nanoscale lamellar domains of tetragonal and rhombohedral phases coexist with well-defined crystallographic orientation relationships and produce coherent diffraction effects. (II) A bridging domain mechanism for explaining the phase coexistence observed around MPBs is presented. It shows that minor domains of metastable phase spontaneously coexist with and bridge major domains of stable phase to reduce total system free energy, which explains the enhanced piezoelectric response around MPBs. (III) We demonstrate a grain size- and composition-dependent behavior of phase coexistence around the MPBs in polycrystals of ferroelectric solid solutions. It shows that grain boundaries impose internal mechanical and electric boundary conditions, which give rise to the grain size effect of phase coexistence, that is, the width of phase coexistence composition range increases with decreasing grain sizes. (IV) The domain size effect is explained by the domain wall broadening mechanism. It shows that, under electric field applied along the nonpolar axis, without domain wall motion, the domain wall broadens and serves as embryo of field-induced new phase, producing large reversible strain free from hysteresis. (V) The control mechanisms of domain configurations and sizes in crystallographically engineered ferroelectric single crystals are investigated. It reveals that highest domain wall densities are obtained with intermediate magnitude of electric field applied along non-polar axis of ferroelectric crystals. (VI) The domain-dependent internal electric field associated with the short-range ordering of charged point defects is demonstrated to stabilize engineered domain microstructure. The internal electric field strength is estimated, which is in agreement with the magnitude evaluated from available experimental data. (VII) The poling-induced piezoelectric anisotropy in untextured ferroelectric ceramics is investigated. It is found that the maximum piezoelectric response in the poled ceramics is obtained along a macroscopic nonpolar direction; and extrinsic contributions from preferred domain wall motions play a dominant role in piezoelectric anisotropy and enhancement in macroscopic nonpolar direction. (VIII) Stress effects on domain microstructure are investigated for the MPB-based ferroelectric polycrystals. It shows that stress alone cannot pole the sample, but can be utilized to reduce the strength of poling electric field. (IX) The effects of compressions on hysteresis loops and domain microstructures of MPB-based ferroelectric polycrystals are investigated. It shows that longitudinal piezoelectric coefficient can be enhanced by compressions, with the best value found when compression is about to initiate the depolarization process. / Ph. D.

Nous étudions numériquement la solidification directionnelle d'un alliage binaire à base de succinonitrile. Pour cela, nous développons un code s'appuyant sur le formalisme du champ de phase adapté au cas de la croissance dans des lames minces. Les résultats numériques obtenus sont comparés qualitativement et quantitativement avec les observations expérimentales. Une bonne confirmation des lois expérimentales et de nouvelles informations sur la dynamique des microstructures sont obtenues.La direction de croissance est généralement limitée par deux axes : l'axe cristallin principal et la direction du gradient thermique. Une première partie de la thèse porte sur l'étude des effets de la désorientation de l'axe cristallin sur la direction de croissance des structures et sur leurs morphologies. Nos résultats sont directement comparés à la loi expérimentale qui donne la réponse en orientation des microstructures sur l'ensemble de leur domaine d'existence en fonction du nombre de Péclet. Nous obtenons un accord très satisfaisant entre simulation et expérience. Dans la seconde partie de la thèse, une instabilité oscillante (mode 2λ − O) est étudiée en se basant sur le diagramme de stabilité expérimental. Dans ce mode deux cellules voisines oscillent en opposition de phase en largeur et en hauteur. Nos simulations reproduisent ce mode oscillant dans des lames minces et permettent une comparaison quantitative avec les expériences. Le régime des oscillations forcées est notamment exploré pour obtenir des informations sur la réponse en fréquence du système. / We report on a numerical study of directional solidification in thin samples of succinonitrile-based dilute alloy. This thesis is based on 3D phase-field simulations. Numerical results are compared qualitatively and quantitatively with experimental observations. The comparison gives a good confirmation of the experimental laws, while providing new information on the dynamics of microstructures. Growth direction of the microstructure is constrained by two axes : the main crystal axis and the direction of the thermal gradient. Simulations allow us to test the variations of the growth direction and the microstructure stability at various misorientation angles. Our results are directly compared with the experimental law that gives the microstructure orientation response in a large domain of Péclet numbers. We obtain a good agreement, both on qualitative and quantitative grounds, between experiments and 3D simulations.In the second part of this manuscript, an oscillatory instability (2λ − O mode) is numerically studied. This mode involves oscillations of both cell width and cell tip position. This instability is reproduced in numerical simulations with the aim of allowing a fine and relevant comparison with experiments of the domain of existence and the periods of oscillation. In particular, the forced oscillation regime is explored to obtain information on the frequency response of the system.

Establishing process-structure-property relationships is an important objective in the paradigm of materials design in order to reduce the time and cost needed to develop new materials. A method to link phase field (process-structure relations) and microstructure-sensitive finite element (structure-property relations) modeling is demonstrated for subsolvus polycrystalline IN100. A three-dimensional (3D) experimental dataset obtained by orientation imaging microscopy performed on serial sections is utilized to calibrate a phase field model and to calculate inputs for a finite element analysis. Simulated annealing of the dataset realized through phase field modeling results in a range of coarsened microstructures with varying grain size distributions that are each input into the finite element model. A rate dependent crystal plasticity constitutive model that captures the first order effects of grain size, precipitate size, and precipitate volume fraction on the mechanical response of IN100 at 650°C is used to simulate stress-strain behavior of the coarsened polycrystals. Model limitations and ideas for future work are discussed.

<p>A wide variety of phase evolution phenomena observed in solids such as intermetallic growth at the junction between two metals subjected to high temperature, growth of oxide on metal surfaces due to atmospheric exposure and void evolution induced by electromigration in microelectronic devices for example, can be classified as being driven by reaction-diffusion processes. These phase evolution phenomena have a significant impact on material reliability for critical applications, and therefore, there is a requirement for modeling such reaction-diffusion driven phase evolution phenomena. It is difficult to analyze these due to the complexity of modeling the evolving interface between solid phases. Additional complexity is  due to the multi-physics nature of the diffusive and reactive processes. Diffusion in solids is driven by a variety of stimuli such as current, temperature and stress, in addition to the chemical potential. Therefore, there is a need for a model that accounts for the influence of such factors on phase evolution. In this thesis,  a generalized continuum based reaction-diffusion theory for phase and void evolution in solid state is developed. The derivation starts off with generalized interface balance laws for mass, momentum and energy. The thermodynamic entropy inequality for irreversible phase growth is derived for arbitrary anisotropic and inhomogeneous surface stress. These interface relations are combined with governing relations in the material bulk for the temperature, stress, electrical and concentration fields, to develop a general model capable of analyzing and describing phase evolution in solids. This theory is then applied to a variety of intermetallic phase and void evolution phenomena observed in microelectronics.</p> <p><br></p> <p>Electromigration induced voiding in thin metal films is an example of phase evolution that is an important reliability concern in microelectronics. Studies have reported that the electromigration induced void growth rate is inversely related to the adhesion of metal thin films with the base and capping layers. Electromigration experiments are performed on fabricated test devices with Cu thin films with SiNx and TiN capping layers. The observations from electromigration experiments on thin Cu metal films at a range of temperatures indicate that the contribution of interface adhesion strength to electromigration resistance decreases with an increase in temperature. The generalized reaction-diffusion theory developed here is modified to develop an expression to account for the effect of base and passivation layer adhesion and temperature on electromigration resistance of metal thin films. The void growth rates measured in the experiments are analyzed with the expression for void growth rate to estimate the interface adhesion strength for the Cu-TiN and Cu-SiNx interfaces. </p> <p><br></p> <p>Demand for increased bandwidth, power efficiency and performance requirements have resulted in a trend of reduction in size and pitch of Cu pillar-Solder micro-bump interconnects used in heterogeneously integrated packages. As the size of micro-bumps reduce, reliability challenges due to voiding in the solder joint and the growth of Cu-Sn intermetallics are observed. The underlying reaction-diffusion mechanisms responsible for Cu-Sn intermetallic growth and voiding in solder joints are unclear at this stage and require further investigation. The current practice of material characterization in micro-bumps involve destructive cross-sectioning and polishing of the micro-bumps after testing. These processes result in loss of continuity in the samples used for the experiments, and material removal due to abrasive polishing might result in a loss of critical information. Therefore, a novel test device capable of non-destructive characterization of Cu-Sn intermetallic growth and voiding in sub-30 micron size micro-bumps is designed and fabricated in this work. The fabricated test devices are subjected to thermal aging for over 1000 h and the underlying reaction-diffusion mechanisms behind the intermetallic phase and void evolution are investigated. </p> <p><br></p> <p>A reaction-diffusion mechanism is proposed explaining the evolution of  various Cu-Sn intermetallic phases and solder joint void observed from experiments. Using the reaction-diffusion mechanism inferred from the thermal aging experiments and the generalized reaction-diffusion theory for phase evolution developed in this thesis, a sharp interface model is developed for the evolution of Cu-Sn intermetallic phases and solder joint void. The diffuse interface phase field equivalent equations for the sharp interface model governing equations are developed using matched formal asymptotic analysis. The evolution of Cu-Sn intermetallic phase and voids in the solder joint are simulated for different temperatures and current density to demonstrate the validity of the phase field and sharp interface models.  </p> <p><br></p>

<p>    </p> <p>In this thesis, a thermodynamically consistent phase field formulation was developed to identify the physical origin of interfacial transitions that drive macroscopic phenomena, start- ing at the single-particle length scale and building up to the polycrystalline length scale. At the single-particle length scale, the framework identified two interfacial phases that are stable at the surface of Sn nanoparticles: 1) a disordered interfacial phase, i.e., the experimentally observed premelted surface layer; and 2) an ordered surficial phase displaying a remnant de- gree of order in fully melted particles. Regimes of melting behavior as a function of particle size and temperature are discussed. To bridge the gap between single-particle and densified polycrystals, an analytical model was developed to capture the physical driving forces for densification during electric field-assisted sintering. Here, the model acknowledges the struc- tural contributions of particle-particle interfaces to the strength of mechanical, electrical, and surficial driving forces for densification, and shows good agreement with experimental flash sintering data. Finally, the theory was applied to polycrystalline LiCoO₂ (LCO) and shows that the experimentally observed metal-insulator transition is driven by grain bound- ary lithium segregation, the interfacial misorientation, and the size of the abutting grains. A critical misorientation as a function of the macroscopic lithium content exists above which the grain boundaries undergo a metal-insulating transition, suggesting that the fabrication of textured LCO microstructures will delay the metal-insulator transition. </p>

<div> Porous lithium ion battery (LIB) electrodes are comprised of electrochemically active material particles that store lithium and a surrounding conductive binder, liquid electrolyte, carbon black mixture that facilitates ionic and electronic transport. Typically, lithium diffusivity is several orders of magnitude smaller in the active material as compared to the surrounding electrolyte, making the electrode microstructure a governing factor in determining the balance between its lithium storage capacity and transport rate. Here, the effects of microstructure on the performance of LIBs are systematically analyzed at three length scales - the single particle length scale, the spatially resolved multiple particle length scale, and the porous electrode layer (homogenized) length scale. At the single particle length scale, a thermodynamically consistent variational framework is presented to examine the effects of crystallographic anisotropy, crystallographic texture, grain size, and grain morphology on the LiNi_1/3Mn_1/3Co_1/3O₂ (NMC111) chemistry. The theory was extended to the spatially resolved multiple particle length scale and the porous electrode layer length scale to explain the microstructural origin of experimentally observed instances of apparent phase separation in NMC111. At the electrode length scale, a data driven framework is presented to evaluate the electrochemical performance of a wide range of particle morphologies and battery architectures. Specifically, microstructural characteristics of 53 356 microstructures are assessed, and strategies to optimize electrode design parameters such as active particle morphology, spatial orientation, electrode porosity, and cell thickness are presented.</div><p></p>