Thesis (M.S.)--Rochester Institute of Technology, 2004. / Typescript. Includes bibliographical references (leaves 74-76).

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Thesis (MMed (Orth))--Stellenbosch University, 2014. / No abstract available

Lapping pad will be worn during lapping process. Therefore, the quality of the work piece and the material removal ability will be lower. First, in this paper, it propose a intermittently nickel-electroplating lap-ping pad in lapping process : At first, plate a layer of nickel on copper plate and used it to be lapping pad. Replate the lapping pad to restore the working ability when the working ability of lapping pad decreased be-cause of wear. Secondary, it propose another restore method : composite electroplating on grinder in process. When grinding by using Ni-SiC composite coating pad, it is used to restore the pad by Ni-SiC composite electroplating at the same time. At first, the influence of load and rotation speed on mate-rial removal are investigated in this study. It is found that the material removal increased as the rotation speed of lapping pad and load increased. It is also found that the roughness of sin-tering SiC decreased as the load increased at a constant rotational speed. And at constant load , the influence of rotation speed on roughness of sintering SiC is unapparent. The ability decay of material removal of lap-ping pad is as time as go by. It can complete restore the wore lap-ping pad to unwear state by replating 15 minutes with 2.5 cur-rent density. The restored pad¡¦s behavior of material removal and roughness is the same as a new one¡¦s. The material removal of sintering SiC of composite electro-plating on grinder in process by using Ni-SiC composite coating is bigger than the material removal of sintering SiC of lapping by nickel-electroplating lapping pad. The material removal increase to 1.7 ~ 3.8 times in 90 minutes at the same load and rotation speed. And the material removal and time are linearly depend. It is investigated that the working ability of grinding disk can be maintain constant. It is also found that the material removal increased as the rotation speed of lapping pad and load in-creased.

In the BGA family package, plating bars must be added in the manufactured processing , However they will cause discontinuities[1]¡Bradiation effect[2] and bad transmission efficiency[3]~[6].This paper considers the signal transmission problem caused by the couple plating lines. This thesis starts from analyzing the different terminations of the couple lines, then proposes a novel L-stub element structure which can decrease the crosstalk noise efficiently on the plating lines. Discussion of the L-stub length ratio, L-stub position and the numbers of the L-stub then provides the useful range. The basic idea is to use the reflection of source to cancel the original couple and doesn¡¦t have to add additional element. In addition, it compares well with other methods which are also designed for reducing crosstalk and circuits are implemented to prove our design. Last of all, using the eye diagram to manifest the signal quality improvement.

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