In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, printed circuit board and electronic components are presented. A detailed vibration analysis of a real electronic assembly is performed by finite element methods and vibration tests. Effects of component addition and component modeling are investigated by finite element analysis in detail. Results are compared in order to identify the most efficient, reliable and suitable method depending on the type of problem. Experimental results for the vibration of an electronic box, PCB and components are presented and discussed. Furthermore, an analytical model that represents a printed circuit board and electronic component is suggested for fixed and simply supported boundary conditions of the PCB. Different types of electronic components are modeled analytically to observe different dynamic characteristics. The validity of the analytical model is computationally checked by comparing results with those of finite element solution.

Hydropower has been around for more than a century and is considered a mature technology, but with recent advancements in power electronics and simulation capability new exciting ways to increase efficiency and reliability is possible. At Uppsala University a brushless exciter has been constructed for the experimental test rig, SVANTE. Power electronics are mounted on the shaft for control of the generator's excitation current. In addition a wireless control and measurement system is needed to provide the desired switching patterns to the power electronics and to evaluate performance of the system. In this thesis a shaft mounted embedded system for control and measurement is constructed as well as magnetic field sensors with measurement range up to 700mT. The computational power comes from a National Instruments sbRIO-9606. The system has 14 individual totem pole power electronics driving channels, 48 analog input channels for current signals and it communicates wirelessly through a bluetooth connection. The system is tested and works satisfactory but has not been mounted on the rotating side of the generator due to delays in the manufacturing.

A substantial raise in recuperator effectiveness has been established in the past by improving the fabricating and joining configurations regarding the manufacturing of compact recuperators. Further advancement of state-of-the-art recuperators requires providing for increased temperatures and pressures. 1bis can only be achieved by incorporating high temperature materials into the recuperator design. Although many high temperature materials have been identified in past research, less of these can be utilized in new concepts due to difficulties regarding fabricating and joining. However recently, in an independent study, a tungsten-copper alloy was identified through detailed material selection methods as a suitable material for high temperature applications. The validity of tungsten-copper regarding fabricating and joining, to establish a leak tight structure still needs to be demonstrated. The aim of the study is to carry out a comprehensive review of existing recuperator technologies and design methodologies as well as to investigate the manufacturability of tungsten-copper for use in a recuperator design of limited size. More specifically, the objectives entail the following: (1) The comprehensive review of existing recuperator technologies and recuperator design methodologies, (2) The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material and (3) The determination of the feasibility of fabrication of the design and the applicability of the selected W -eu alloy in the design. The fabrication technique that is presented in the design entailed the use of 2.Irm tungsten carbide drill bits to machine the correct recuperator profile, while the recuperator unit was joined by utilizing a mechanical fastening system. Although diffusion bonding was initially identified as the ideal joining technique for the recuperator of this research, restrictions and limitations relating to the use of diffusion bonding has lead to the identification of a fastening system as the technique used. Evaluation of the fabricated recuperator revealed that several factors were outside the initially specified values, inter alia the flatness tolerance of recuperator plate geometries and machined slots precision. These factors contributed to a leaJdng recuperator structure when tested. The most likely contributing factors for the latter relate to non-conforming tolerances achieved in the fabricated design, residual stresses induced by the machining process as well as design issues relating to the recuperator plate geometries. The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material, requires re-evaluation. Similar work will ensure a design of a high quality when provision is made for advanced surface fmishing of machined parts (notably the recuperator plate geometries), slight modifications to the design as well as stress relieving of machined components for the purpose of eliminating any residual stresses thatJnight be present. / Thesis (M.Ing. (Mechanical Engineering))--North-West University, Potchefstroom Campus, 2009.

A substantial raise in recuperator effectiveness has been established in the past by improving the fabricating and joining configurations regarding the manufacturing of compact recuperators. Further advancement of state-of-the-art recuperators requires providing for increased temperatures and pressures. 1bis can only be achieved by incorporating high temperature materials into the recuperator design. Although many high temperature materials have been identified in past research, less of these can be utilized in new concepts due to difficulties regarding fabricating and joining. However recently, in an independent study, a tungsten-copper alloy was identified through detailed material selection methods as a suitable material for high temperature applications. The validity of tungsten-copper regarding fabricating and joining, to establish a leak tight structure still needs to be demonstrated. The aim of the study is to carry out a comprehensive review of existing recuperator technologies and design methodologies as well as to investigate the manufacturability of tungsten-copper for use in a recuperator design of limited size. More specifically, the objectives entail the following: (1) The comprehensive review of existing recuperator technologies and recuperator design methodologies, (2) The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material and (3) The determination of the feasibility of fabrication of the design and the applicability of the selected W -eu alloy in the design. The fabrication technique that is presented in the design entailed the use of 2.Irm tungsten carbide drill bits to machine the correct recuperator profile, while the recuperator unit was joined by utilizing a mechanical fastening system. Although diffusion bonding was initially identified as the ideal joining technique for the recuperator of this research, restrictions and limitations relating to the use of diffusion bonding has lead to the identification of a fastening system as the technique used. Evaluation of the fabricated recuperator revealed that several factors were outside the initially specified values, inter alia the flatness tolerance of recuperator plate geometries and machined slots precision. These factors contributed to a leaJdng recuperator structure when tested. The most likely contributing factors for the latter relate to non-conforming tolerances achieved in the fabricated design, residual stresses induced by the machining process as well as design issues relating to the recuperator plate geometries. The design and fabrication of a recuperator of limited size using tungsten-copper as a heat transfer material, requires re-evaluation. Similar work will ensure a design of a high quality when provision is made for advanced surface fmishing of machined parts (notably the recuperator plate geometries), slight modifications to the design as well as stress relieving of machined components for the purpose of eliminating any residual stresses thatJnight be present. / Thesis (M.Ing. (Mechanical Engineering))--North-West University, Potchefstroom Campus, 2009.

As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented.

There has been an ever-increasing demand for power generation, which is predicted to grow as society becomes more advanced. However, tradition fossil fuels are beginning to deplete, and there is a great necessity for alternative fuel sources that will bridge the gap between energy production and consumption. To decrease the high demand alternative fuel sources are gaining in popularity. The supercritical carbon dioxide Brayton power cycle has been proposed as a possible cycle for nuclear and concentrated solar power generation. Two main advantages of having supercritical carbon dioxide are the large property variations and component size associated with power cycle. Forced convection heat transfer of supercritical carbon dioxide in printed circuit heat exchanger geometries were investigated in the following study using a finite volume framework and the FLUENT 12.1 code. The geometries of interest were: non- chamfered zig-zag, chamfered zig-zag, and air foil. Flow through the three geometries was in the horizontal orientation and subject to a heating mode operation. A range of testing conditions were explored, including operating pressures between 7.5 to 10.2 MPa with the mass flux ranging from 326 to 762 kg/m2-s. Due to the turbulent nature of this problem, the k−E with enhanced wall treatment and shear stress transport k−ω turbulence models were considered. With this addition a total of 54 simulations were performed. Results indicated that there was an increase in the heat transfer coefficient as the supercritical carbon dioxide reached the pseudocritical temperature, conversely as there was an increase in operating pressure, the heat transfer coefficient decreased. Nevertheless, this increase near the pseudocritical temperature was due to a sharp increase in the specific heat. Mass flux effects indicated that there was an increase in heat transfer as the mass flux was increased. This was due to the increase in Reynolds number near the pseudocritical temperature. Next, pressure losses were investigated for the three geometries. The non-chamfered zig-zag channel had the greatest pressure loss associated with it, while the air foil channel had the least. Based on the results, the ratio of the friction factor to heat transfer for the non-chamfered and chamfered zig-zag geometries were approximately 2.65 and 1.57 times higher than for the air foil, thus leading to the idea that the air foil channel may be best suited for practical applications. Finally, the simulation results were compared to experimental data and existing correlations. Many existing correlations failed to accurately predict the magnitude of heat transfer, although they exhibited a similar trend. A new correlation was developed for the zig-zag geometries based on the numerical data obtained during this investigation and published experimental data. The new correlation is able to predict the maximum heat transfer coefficient within 12.4%.

As placas de circuito impresso (PCI) estão presentes em quase todos os equipamentos eletroeletrônicos (EEE) e são componentes fundamentais dos computadores. Estes dispositivos são compostos de polímeros, cerâmicos e metais, sendo que nestes últimos encontra-se uma fração significativa de metais valiosos tais como ouro, prata e cobre. A mistura heterogênea dos referidos materiais torna sua reciclagem complexa, de forma que, tecnologias têm sido desenvolvidas e aprimoradas para a reciclagem das PCI. Esta pesquisa apresenta uma rota alternativa para recuperação do cobre contido nas PCI estudadas. Inicialmente, realizou-se um processamento mecânico constituído de fragmentação e moagem, classificação granulométrica e separação magnética, visando à liberação dos metais contidos nas placas e, principalmente, à concentração metálica do cobre. Esta rota não inclui a clássica separação eletrostática para a recuperação metálica. Foram realizadas duas lixiviações ácidas com ácido sulfúrico; a primeira para a remoção de elementos indesejados (Fe, Ni ,Zn, Al) e, a seguir, uma segunda lixiviação ácida, em meio oxidante, para obtenção de um eletrólito concentrado de íons cobre. A solução eletrolítica produzida na segunda lixiviação foi submetida à eletrodeposição, obtendo-se cobre na forma de pó para a sua utilização em processos da metalurgia do pó, como matéria prima para a indústria de componentes mecânicos e científicos sinterizados. Os resultados indicaram que é possível a recuperação do cobre presente nas PCI provenientes de REEE. O pó de cobre obtido atende adequadamente a requisitos técnicos necessários para sua aplicabilidade nos processos de metalurgia do pó, como por exemplo: estrutura dendrítica, composição química apropriada e distribuição granulométrica das partículas, atingindo o objetivo geral desta pesquisa. / The printed circuit boards are found in almost all electrical electronic equipments (EEE) and are essential components of computers. The PCBs consist of polymers, ceramics and metals, and among the metals, there is a significant fraction of valuable metals such as gold, silver and copper. The heterogeneous mixture of these materials makes their recycling difficult. Therefore, many kinds of technologies have been developed and improved for the recycling of these electronic components. This scientific research proposes an alternative route for recovery of copper contained in the analyzed PCB. Initially, a mechanical process consisting of fragmentation and grinding, size classification and magnetic separation was performed, aiming the liberation of metals from the boards, especially the concentration of copper. This route does not include the classical electrostatic separation for metal recovery. Two acid leaching procedures were performed with sulfuric acid: the first one for removing the unwanted elements (Fe, Ni, Zn, AL), followed by a second acid leaching, in an oxidizing medium, to obtain a concentrated copper ion electrolyte. The electrolytic solution produced in the second leaching was submitted to electrodeposition obtaining copper powder, which is used in powder metallurgy processes as raw material for the industry of sintered mechanical and scientific components. The results indicate that the recovery of metals contained in PCB originated from WEEE is possible. The obtained copper powder adequately meets the technical requirements for its applicability in powder metallurgy processes, such as: dendritic structure, appropriate chemical composition and particle size distribution, reaching the general objective of this research.

En raison de la demande de miniaturisation croissante dans l’industrie microélectronique, il est nécessaire de développer des circuits imprimés multicouches (PCB, Printed Circuit Board) présentant une densité d’interconnections de plus en plus élevée. Avec leurs bonnes propriétés physico-chimiques et mécaniques et un relatif faible coût, les matériaux composites à base de résine époxy sont des matériaux de premier choix pour ce type d’application. Cependant, la réduction de la taille des connexions électriques de cuivre (largeur < 1 µm), implique que l’adhésion cuivre/époxy soit améliorée. Dans la littérature, des études ont montré que le taux de réticulation des résines epoxy est un paramètre clé, contrôlant la résistance chimique de la résine epoxy (vis-à-vis des procédés industriels d’impression de cuivre par voie chimique) et les propriétés d’adhésion du cuivre sur le substrat composite.L’objectif de cette thèse est d’étudier de façon approfondie la cinétique de réticulation d’un composite époxy/silice (ABF) utilisé en production de masse dans l’industrie microélectronique afin de proposer un protocole de fabrication des circuits imprimés en fonction du taux de réticulation.Le comportement rhéologique du matériau composite en fonction du taux de réticulation a été étudié par analyse mécanique dynamique (DMA). L’influence du taux de réticulation sur les processus de gélification et de vitrification est présentée et une analyse du comportement viscoélastique de la résine epoxy près de la transition vitreuse est discutée. Le modèle WLF est utilisé pour décrire la dynamique de réseau du polymère. La cinétique de réticulation du composite a été étudiée in situ en spectroscopie proche-infrarouge (NIR) et en calorimétrie différentielle à balayage (DSC) en modes isotherme et non-isotherme. L’analyse iso-conversionnelle a permis de déterminer l’énergie d’activation de la réaction de réticulation. Cependant, une modélisation plus approfondie de la cinétique de réticulation a été nécessaire en raison d’une contribution de diffusion s’ajoutant à la contribution chimique de la réaction. Cette étude a montré que les cinétiques de réticulation peuvent être décrites par le modèle auto-catalytique d’ordre n combiné aux modèles de Rabinowitch et WLF-modifié, modèles tenant compte de la contribution de diffusion. Ce modèle a permis de prédire le comportement du matériau dans une large gamme temps/température et d’établir le diagramme Température-Temps-Transformation du matériau .Compte tenu de l’importance du taux de réticulation sur les propriétés d’adhésion des connexions électriques de cuivre, une méthode de mesure du taux de réticulation sur des PCB industriels a été développée. La spectroscopie infrarouge en réflexion diffuse (DRIFTS) s’est avérée être une technique d’analyse parfaitement adaptée. L’influence du taux de réticulation sur l’étape de “desmear” du procédé de fabrication a également été étudiée. Cette étape, constituée d’une phase de gonflement de la résine epoxy (swelling) suivie d’une attaque oxydante au permanganate et d’une étape de réduction, est déterminante quant à la rugosité de surface obtenue et donc l’adhésion du cuivre sur le substrat composite. Une méthode originale a été développée pour déterminer le profil de diffusion de l’agent de gonflement (sweller) au sein du matériau, méthode alliant microtomie et analyse chromatographique. L’effet des conditions de “swelling” sur la rugosité finale du matériau a été déterminé par microscopie à force atomique (AFM). Des tests d’adhésion du cuivre ont également été réalisés afin d’étudier l’influence du taux de réticulation de la résine epoxy et de la rugosité de surface du composite sur la force d’adhésion. Finalement, une bonne adhésion du cuivre (environ 4 N/cm) pour des surfaces de faible rugosité (< 10 nm). / Due to the increasing miniaturization in microelectronics the manufacturing of densely interconnected multilayer printed-circuit boards (PCB) is needed. With their well-balanced physico-chemical and mechanical properties and low cost, epoxy-based composites are insulating materials of prime choice. However, to achieve interconnections at a lower scale (copper line width down to ca. 1 µm), the adhesion between the composite substrate and the copper interconnections must be enhanced. Previous studies showed that the degree of curing of the epoxy matrix (i.e. conversion of crosslinking reaction) is one key-parameter, driving the matrix chemical and mechanical resistance (during the PCP manufacturing process) and the composite/copper line adhesion properties.In this work we present and discuss an in-depth study of the curing kinetics of an epoxy/silica composite (ABF) relevant to the microelectronics industry. The final objective is to propose a process protocol of the PCB manufacturing as function of the degree of curing.The rheological behaviour of the composite material is investigated by dynamic mechanical analysis (DMA). The gelation and vitrification mechanisms are presented as a function of the degree of curing. The viscoelastic behavior of the epoxy matrix near the glass-transition is studied and is shown to be well-described by the WLF model.The curing kinetics of the epoxy composite are studied by in situ near-infrared (NIR) spectroscopy and both isothermal and non-isothermal differential scanning calorimetry (DSC). Iso-conversional analyses are performed to determine the apparent activation energy of the curing reaction. Due to a non-negligible contribution of the diffusion part in the curing reaction, further modelling was needed to achieve a complete description of the curing kinetics. This study showed that the curing kinetic is well-described by the nth-order autocatalytic fitting model in combination with the Rabinowitch/modified-WLF models, taking into account the diffusion contribution. This model is used to predict the material behaviour in a wide time/temperature range and to propose a Temperature-Time-Transformation diagram of the material.Due to the influence of the degree of curing on the adhesion of copper electrical lines, an experimental method for the measurement of the degree of curing of industrial PCB was developed. Diffuse-reflectance infrared spectroscopy (DRIFTS) is found to be a versatile and accurate technique. The influence of the degree of curing on the “desmear” step of the PCB manufacturing process is studied as well. The “desmear” step proceeds in the swelling of the epoxy matrix and the subsequent permanganate etching and reduction reactions. The “desmear” step is quite important regarding the composite surface roughness and, as a consequence, the adhesion of the copper lines. An original method for the determination of the diffusion profile of the sweller through the depth of the material was developed using microtomy and chromatography. The effect of swelling experimental parameters on the final roughness of the composite is determined by atomic force microscopy (AFM). Adhesion tests of copper lines on the composite substrate are performed to study the influence of the initial degree of curing and the roughness on the peel strength. Good adhesion of copper (about 4 N/cm) is achieved for a low substrate roughness (< 10 nm).

As placas de circuito impresso (PCI) estão presentes em quase todos os equipamentos eletroeletrônicos (EEE) e são componentes fundamentais dos computadores. Estes dispositivos são compostos de polímeros, cerâmicos e metais, sendo que nestes últimos encontra-se uma fração significativa de metais valiosos tais como ouro, prata e cobre. A mistura heterogênea dos referidos materiais torna sua reciclagem complexa, de forma que, tecnologias têm sido desenvolvidas e aprimoradas para a reciclagem das PCI. Esta pesquisa apresenta uma rota alternativa para recuperação do cobre contido nas PCI estudadas. Inicialmente, realizou-se um processamento mecânico constituído de fragmentação e moagem, classificação granulométrica e separação magnética, visando à liberação dos metais contidos nas placas e, principalmente, à concentração metálica do cobre. Esta rota não inclui a clássica separação eletrostática para a recuperação metálica. Foram realizadas duas lixiviações ácidas com ácido sulfúrico; a primeira para a remoção de elementos indesejados (Fe, Ni ,Zn, Al) e, a seguir, uma segunda lixiviação ácida, em meio oxidante, para obtenção de um eletrólito concentrado de íons cobre. A solução eletrolítica produzida na segunda lixiviação foi submetida à eletrodeposição, obtendo-se cobre na forma de pó para a sua utilização em processos da metalurgia do pó, como matéria prima para a indústria de componentes mecânicos e científicos sinterizados. Os resultados indicaram que é possível a recuperação do cobre presente nas PCI provenientes de REEE. O pó de cobre obtido atende adequadamente a requisitos técnicos necessários para sua aplicabilidade nos processos de metalurgia do pó, como por exemplo: estrutura dendrítica, composição química apropriada e distribuição granulométrica das partículas, atingindo o objetivo geral desta pesquisa. / The printed circuit boards are found in almost all electrical electronic equipments (EEE) and are essential components of computers. The PCBs consist of polymers, ceramics and metals, and among the metals, there is a significant fraction of valuable metals such as gold, silver and copper. The heterogeneous mixture of these materials makes their recycling difficult. Therefore, many kinds of technologies have been developed and improved for the recycling of these electronic components. This scientific research proposes an alternative route for recovery of copper contained in the analyzed PCB. Initially, a mechanical process consisting of fragmentation and grinding, size classification and magnetic separation was performed, aiming the liberation of metals from the boards, especially the concentration of copper. This route does not include the classical electrostatic separation for metal recovery. Two acid leaching procedures were performed with sulfuric acid: the first one for removing the unwanted elements (Fe, Ni, Zn, AL), followed by a second acid leaching, in an oxidizing medium, to obtain a concentrated copper ion electrolyte. The electrolytic solution produced in the second leaching was submitted to electrodeposition obtaining copper powder, which is used in powder metallurgy processes as raw material for the industry of sintered mechanical and scientific components. The results indicate that the recovery of metals contained in PCB originated from WEEE is possible. The obtained copper powder adequately meets the technical requirements for its applicability in powder metallurgy processes, such as: dendritic structure, appropriate chemical composition and particle size distribution, reaching the general objective of this research.

Com o transcorrer dos anos a problemática da geração de resíduos sólidos vem ganhando destaque no âmbito ambiental. Atualmente, várias tecnologias na área de tratamento de resíduos sólidos estão sendo estudadas com o objetivo de reduzir o volume de resíduos gerados e obter ganhos econômicos adicionais. As placas de circuito impresso (PCIs) descartadas são classificadas como resíduos sólidos e na sua composição, por vezes, possuem quantidades de metais maiores que as encontradas em minérios. O presente trabalho estudou a separação de metais não ferrosos encontrados em dois tipos de placas de circuito impresso de computadores descartados (placas mãe e placas de vídeo), visando a sua recuperação. O procedimento utilizado incluiu etapas de processamento físico e processamento hidrometalúrgico. O processamento físico foi iniciado com a cominuição das PCIs utilizando moinho de facas e moinho de martelos. Em seguida, foi retirada uma parte do resíduo moído para ser quarteado e encaminhado para os ensaios hidrometalúrgicos. As amostras obtidas após o quarteamento foram denominadas amostras da rota I. Com o restante do material moído foi realizada separação magnética, na qual foram obtidas amostras de material não magnético, denominadas: amostras da rota II, tais amostras seguiram também para tratamento hidrometalúrgico. A seguir foi realizada a caracterização dos materiais presentes nas PCIs e nas suas respectivas amostras (amostras da rota I e amostras da rota II). O processamento hidrometalúrgico foi então iniciado com a etapa de lixiviação. Nesta etapa, parâmetros como tempo, temperatura e concentração do ácido foram avaliados. O licor coletado na lixiviação das amostras da rota II seguiu para fase de extração por solventes (SSX), na qual os metais foram purificados e separados. Nos ensaios de SSX foram empregados os extratantes ácidos Cyanex 272, D2EHPA, TBP e suas misturas. Experimentos variando a relação aquosa/orgânica (A/O), a temperatura e a concentração de extratante foram desenvolvidos. Finalmente foram determinados o número de estágios teóricos de extração para purificar o licor obtido na lixiviação das amostras da rota II. Os resultados mostraram que as placas mãe possuem na sua composição 35,8% de metais; 38,4% de polímeros e 25,9 % de cerâmicos, já as placas de vídeo estudadas possuem 35,8 % de metais, 33 % de polímeros e 31,2 % de cerâmicos. Na etapa de lixiviação foi possível recuperar 100% do cobre contido nas amostras da rota II (fração não magnética da placa de vídeo e da placa mãe). A etapa de extração por solventes permitiu separar o alumínio e o zinco do licor obtido na lixiviação das amostras da rota II (fração não magnética da placa de vídeo e da placa mãe). A extração do alumínio e o zinco empregou 10% v/v D2EHPA, temperatura ambiente, tempo de reação de 10 min e pH igual a 3,5. Além disso, o cobre foi separado usando-se 20% v/v de D2EHPA, temperatura ambiente, tempo de reação de 10 min e pH igual a 3,5. Finalmente foi encontrado que este procedimento permite recuperar 82 % do cobre contido na placa mãe e 60 % do cobre da placa de vídeo. / Over the years, the solid waste generation problem has been gaining strength in an environmental context. Currently, several technologies on the field of waste treatment are been studied aiming to reduce the volume of produced waste and gain additional economic value. Discarded printed circuit boards (PCBs) are classified as solid waste and in it composition, sometimes, they hold greater quantities of metal than ores. The present research studied the separation of non-ferrous metals from two types of printed circuit boards from discarded computers (motherboards and video boards) aiming its recovery. The overall process used physical treatment and hydrometallurgical treatment. The physical processing started with griding the PCBs using a knife mill and a hammer mill. Quartered samples from the grinded material were utilized on the hydrometallurgical process. Samples obtained after quartering were called samples from route l. The remained milled material was magnetically separated generating non-magnetic samples, called: samples from route ll, also followed by hydrometallurgical treatment. After, present materials on the PCBs and its respective samples were characterized (samples from route l and samples from route ll). Leaching those materials was the first step of the hydrometallurgical step. Leaching parameters time, temperature and acid concentration were evaluated. The resulting liquor from leaching samples from route ll followed to the solvent extraction (SSX) phase, in which metals were screened and purified. On the extraction phase there were utilized the acid extractants: Cyanex 272, D2EHPA, TBP and its mixtures. Experiments varying extraction parameters as organic/aqueous (O/A), temperature and extractant concentration were carried out during this phase. Finally, the number of theoretical stages of extraction were determined to purify the liquor obtained by leaching samples from route ll. The results showed that the mother PCBs are constituted by 35.8% of metals; 38.4% of polymers and 25.9% of ceramic, while the video PCBs are composed by 35.8% of metals, 33% polymer and 31.2% of ceramic. In the leaching step was possible to recover 100% of the copper contained in the route II samples (non-magnetic fraction of the video boards and motherboards). The solvent extraction step can separate aluminum and zinc from the liquor produced in leaching process of the Route II samples (non-magnetic fraction of the video board and motherboard). Aluminum and zinc extraction used 10% v/v of D2EHPA, room temperature, reaction time 10 min and pH 3.5. Moreover, copper was removed using 20% v/v of D2EHPA, room temperature, reaction time of 10 min and pH 3.5. Finally it was found that this procedure allows recovering 82% of the copper contained in the motherboard and 60% of the copper video board.