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Infrared measurement and analytical prediction of the transient temperature distribution on computer boardsSheffield, Randolph Joseph 08 1900 (has links)
No description available.
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Minimizing the make-span in a high-product mix shop-floor using integer programmingSekar, Vikram. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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Fabrication and assembly of ultra thin flexible active printed circuitsZhang, Tan, January 2006 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Vita. Includes bibliographical references (ℓ. 79-83).
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Genroute : a genetic algorithm (printed wire board (PWB) router) /Coward, Bob. January 1991 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1991. / Typescript. Includes bibliographical references.
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Feeder allocation policy for a turret head placement machine using dynamic programmingRamaswamy, Harish Krishna, Valenzuela, Jorge F. January 2005 (has links)
Thesis--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references
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Process development of 01005 assemblyNambiar, Sudeep. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
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Modeling of vias and via arrays in high speed printed circuit boardsChada, Arun Reddy, January 2009 (has links) (PDF)
Thesis (M.S.)--Missouri University of Science and Technology, 2009. / Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 16, 2009) Includes bibliographical references (p. 90-91).
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Pad cratering characterizing crack propagation and the effects of humidity and reflow on reliability /Godbole, Gaurav Vinod. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
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Ultrasonic welding of Copper to Laminate Circuit BoardTucker, Joseph C 29 April 2002 (has links)
The ultrasonic welding of Cu110, electrolytic tough pitch copper sheet to electroless plated laminate circuit board was experimentally investigated within the range of 20 kHz. The effects of machine parameters; energy, amplitude and pressure as well as material characteristics such as surface roughness, gauge, temper, and silver and gold plating schemes were compared through pull tests and analysis of microstructure. Evidence was discovered which attributes plastic deformation, mechanical interlocking, and acoustic softening to the mechanism of weld formation. It was further determined that ultrasonic welding of Cu110 sheet to silver immersion laminate circuit boards as means of electrical termination is a robust process. Therefore it was the goal of this thesis to understand the mechanism of ultrasonic welding and determine if ultrasonic welding to laminate circuit boards is an alternative to soldering electrical terminations.
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Mechanical characterization and modeling of solder joints for the secondary side reflow of large IC packagesYutzie, James D. 23 July 1999 (has links)
As the drive continues to reduce the size of Printed Wiring Assemblies (PWAs),
improve performance of electronic assemblies, and reduce costs of these products,
reliable secondary (bottom) side reflow operations must be developed. Attaching Surface
Mount Technology (SMT) components to the secondary side of a Printed Circuit Board
(PCB) is accomplished by placing components on the PCB's secondary side and
processing it through the reflow oven at this point. This board is then flipped over so that
more components can be placed on the side that is facing up (primary side). The PCB
must again be processed through the reflow oven. Large Integrated Circuit (IC) packages
that are soldered to the secondary side fall off of the PCB during reflow of the primary
side. Intuition may lead one to believe this is caused solely by weight, size, etc., but
experienced personnel are not able to consistently predict which components will fail.
The purpose of this work is to convey the necessary knowledge to explain and
predict the behavior of components during Secondary Side Reflow (SSR). This thesis will
ultimately present a method by which guidelines for SSR can be created.
Currently, SSR is limited to small passive devices and small Integrated Circuit
(IC) packages. It is anticipated that future PWA designs will require large ICs such as
Quad Flat Packs (QFP) and Ball Grid Arrays (BGA) on the secondary side. A large
variety of SMT components are available, but the focus of this research was directed
towards large IC packages. Current manufacturing guidelines for such products do not
exist and development of these are imperative if a costly trial and error approach is to be
avoided.
In an environment where product technology advancement and cost reduction are
key to survival, industry must develop and understand this manufacturing process. Cost
savings from SSR will be most directly realized with compressed product development
cycles, reduced use of PCBs, components, and raw materials, and more efficient use of
manufacturing capital and employees. These cost savings would be realized nearly
immediately after a set of manufacturing guidelines is developed. / Graduation date: 2000
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