Spelling suggestions: "subject:"aprinted circuits"" "subject:"aprinted ircuits""
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Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boardsFu, Chia-Yu 08 1900 (has links)
No description available.
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Improved prediction modeling with validation for thermally-induced PWB warpagePolsky, Yarom 05 1900 (has links)
No description available.
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Factors which enhance conductive anodic filament (CAF) formationReady, William Judson, IV 05 1900 (has links)
No description available.
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Design, fabrication, and dynamic modeling of a printed circuit based MEMS accelerometerRogers, John E., Ramadoss, Ramesh. Hung, John Y. January 2007 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.44-45).
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Computational drop testing of printed circuit boards with BGA componentsJordy, Daniel Edward. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Mechanical Engineering), 2007. / Includes bibliographical references.
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Experimental and numerical study of solder ball joints' reliability at package level & board level /Xu, Zhengjian. January 2009 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).
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Spectrophotometric studies of individual components of a cupric chloride etchant used in printed wiring board manufacturing processes /Mee, Christine. January 1986 (has links)
Thesis (B.S.)--Rochester Institute of Technology, 1986. / Typescript. Includes bibliographical references (leaf 34).
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Simulation of a complex mix of circuit boards in a drilling environmentSchneider, Maria J. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.
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Variable swing optimal parallel links minimal power, maximal density for parallel links /Barrera-Gonzalez, Claudia Patricia. January 2009 (has links)
Thesis (Ph.D.)--University of Delaware, 2009. / Principal faculty advisor: Fouad Kiamilev, Dept. of Electrical & Computer Engineering. Includes bibliographical references.
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Monitoring and control system for hot air solder leveling processSchuh, Amy Jeanne 12 January 2010 (has links)
Master of Science
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