Project report (M. Eng.)--Virginia Polytechnic Institute and State University, 1991. / Abstract. Includes bibliographical references (leaves 106-107). Also available via the Internet.

Thesis (Ph. D.)--University of Wisconsin--Madison, 1920. / Typescript. eContent provider-neutral record in process. Description based on print version record.

abstract / Electrical and Electronic Engineering / Doctoral / Doctor of Philosophy

Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references. Also available in electronic version.

<p>The goal of this project was to design an airborne radio frequency circuit card that was very light weight, occupied a small volume, and operated from 20 Mhz to 1500 Mhz. The circuit card being reported on is called an RF multicoupler, and is one of two cards used in a radio frequency distribution unit (RFD). This unit interfaces a large number of receivers to various antennas.</p> <p> In the past this type of circuitry was done by cascading discrete connectorized RF components together with coaxial cable. As technology progressed the discrete surface mount or pin through RF components were mounted on single layer fiberglass or Duroid circuit cards. The next generation improved circuit density by incorporating a multilayer RF circuit card in which RF and digital control signals were run on the internal layers.</p> <p> The RF multilayer circuit card in this project represents the state-of-the-art for high density RF circuitry. The board material is a teflon/fiberglass composite. The discrete RF components are surface mount and the passive higher frequency components are physically incorporated into the RF circuit card itself as stripline RF circuits.</p> <p> Thus, by using advanced board materials, a multilayer construction, integral stripline components, and a light weight aluminum housing, it was possible to achieve dramatic weight reductions.</p> <p>Finally, much effort was expended in "up front engineering" to ensure that this RFD was capable of being transitioned from a laboratory prototype to a production unit capable of being manufactured in large quantities.</p> / Master of Engineering

Ho Kin-Pui. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2002. / Includes bibliographical references (leaves 92-95). / Abstracts in English and Chinese. / Abstract --- p.2 / 摘要 --- p.4 / Acknowledgements --- p.5 / Table of Contents --- p.6 / List of Figures --- p.10 / List of Tables --- p.14 / Chapter Chapter 1 --- Introduction --- p.15 / Overview --- p.15 / Objective --- p.17 / Thesis Organization --- p.17 / Chapter Chapter 2 --- Fundamentals of Operational Amplifier --- p.19 / Chapter 2.1 --- Definitions of Commonly Used Figures --- p.19 / Chapter 2.1.1 --- Input Differential Voltage Range --- p.19 / Chapter 2.1.2 --- Maximum Output Voltage Swing --- p.20 / Chapter 2.1.3 --- Input Common Mode Voltage Range --- p.20 / Chapter 2.1.4 --- Input Offset Voltage --- p.20 / Chapter 2.1.5 --- Gain Bandwidth Product --- p.21 / Chapter 2.1.6 --- Phase Margin --- p.22 / Chapter 2.1.7 --- Slew Rate --- p.22 / Chapter 2.1.8 --- Settling Time --- p.23 / Chapter 2.1.9 --- Common Mode Rejection Ratio --- p.23 / Chapter 2.2 --- Frequency Compensation of Operational Amplifier --- p.24 / Chapter 2.2.1 --- Overview --- p.24 / Chapter 2.2.2 --- Miller Compensation --- p.25 / Chapter Chapter 3 --- CMOS Current Feedback Operational Amplifier --- p.27 / Chapter 3.1 --- Introduction --- p.27 / Chapter 3.2 --- Current Feedback Operational Amplifier with Active Current Mode Compensation --- p.28 / Chapter 3.2.1 --- Circuit Description --- p.29 / Chapter 3.2.2 --- Small Signal analysis --- p.32 / Chapter 3.2.3 --- Simulation Results --- p.34 / Chapter Chapter 4 --- Reversed Nested Miller Compensation --- p.38 / Chapter 4.1 --- Introduction --- p.38 / Chapter 4.2 --- Frequency Response --- p.39 / Chapter 4.2.1 --- Gain-bandwidth product --- p.40 / Chapter 4.2.2 --- Right half complex plane zero --- p.40 / Chapter 4.2.3 --- The Pair of Complex Conjugate Poles --- p.42 / Chapter 4.3 --- Components Sizing --- p.47 / Chapter 4.4 --- Circuit Simulation --- p.48 / Chapter Chapter 5 --- Enhancement Technique for Reversed Nested Miller Compensation --- p.54 / Chapter 5.1 --- Introduction --- p.54 / Chapter 5.2 --- Working principle of the proposed circuit --- p.54 / Chapter 5.2.1 --- The introduction of nulling resistor --- p.55 / Chapter 5.2.2 --- The introduction of a voltage buffer --- p.55 / Chapter 5.2.3 --- Small Signal Analysis --- p.57 / Chapter 5.2.4 --- Sign Inversion of the RHP Zero with Nulling Resistor --- p.59 / Chapter 5.2.5 --- Frequency Multiplication of the Complex Conjugate Poles --- p.60 / Chapter 5.2.6 --- Stability Conditions --- p.63 / Chapter 5.3 --- Performance Comparison --- p.67 / Chapter 5.4 --- Conclusion: --- p.70 / Chapter 5.4.1 --- Circuit Modifications: --- p.70 / Chapter 5.4.2 --- Advantages: --- p.71 / Chapter Chapter 6 --- Physical Design of Operational Amplifier --- p.72 / Chapter 6.1 --- Introduction --- p.72 / Chapter 6.2 --- Transistor Layout Techniques --- p.72 / Chapter 6.2.1 --- Multi-finger Layout Technique --- p.72 / Chapter 6.2.2 --- Common-Centroid Structure --- p.73 / Chapter 6.3 --- Layout Techniques of Passive Components --- p.74 / Chapter 6.3.1 --- Capacitor Layout --- p.74 / Chapter 6.3.2 --- Resistor Layout --- p.75 / Chapter Chapter 7 --- Measurement Results --- p.77 / Chapter 7.1 --- Overview --- p.77 / Chapter 7.2 --- Measurement Results for the Current Feedback Operational Amplifier --- p.77 / Chapter 7.2.1 --- Frequency Response of the inverting amplifier --- p.77 / Chapter 7.3 --- Measurement Results for the Three-Stage Operational Amplifier --- p.80 / Chapter 7.3.1 --- Input Offset Voltage Measurement --- p.80 / Chapter 7.3.2 --- Input Common Mode Range Measurement --- p.80 / Chapter 7.3.3 --- Gain Band width Measurement --- p.81 / Chapter 7.3.4 --- DC Gain measurement --- p.85 / Chapter 7.3.5 --- Slew Rate Measurement --- p.87 / Chapter 7.3.6 --- Phase Margin --- p.88 / Chapter 7.3.7 --- Performance Summary --- p.89 / Chapter Chapter 8 --- Conclusions --- p.90 / Chapter Chapter 9 --- Appendix --- p.96

Hu Mengna. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2004. / Includes bibliographical references (leaves 102-105). / Abstracts in English and Chinese. / Abstract --- p.ii / Acknowledgements --- p.iv / Table of Contents --- p.v / Chapter Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- PEEC Modeling Method --- p.1 / Chapter 1.2 --- Overview of the work --- p.2 / Chapter 1.3 --- Original Contributions --- p.3 / Chapter 1.4 --- Organization of the thesis --- p.3 / Chapter Chapter 2 --- CLASSICAL PARTIAL ELEMENT EQUIVALENT CIRCUIT MODELING --- p.4 / Chapter 2.1 --- Introduction --- p.4 / Chapter 2.2 --- Mathematical Formulation in PEEC --- p.5 / Chapter 2.2.1 --- Basic Integral Equation --- p.5 / Chapter 2.2.2 --- Current and Charge discretization --- p.6 / Chapter 2.2.3 --- Galerkin Matching Method --- p.8 / Chapter 2.3 --- Partial Inductance --- p.10 / Chapter 2.3.1 --- General Formula for partial mutual inductance --- p.10 / Chapter 2.3.2 --- Mutual Inductance between two Thin Rectangular Tapes --- p.11 / Chapter 2.4 --- Partial Capacitance --- p.13 / Chapter 2.4.1 --- General Formula for partial mutual capacitance --- p.13 / Chapter 2.4.2 --- Mutual Capacitance Between Two Thin Rectangular Tapes --- p.16 / Chapter 2.5 --- Meshing Scheme --- p.17 / Chapter 2.6 --- Green's function --- p.20 / Chapter 2.6.1 --- Modification on free space Green's function through Ray-tracing technique --- p.20 / Chapter 2.6.2 --- Impact on partial inductance and partial capacitance --- p.22 / Chapter 2.7 --- PEEC Modeling of A LTCC 2.4GHz Band Pass Filter --- p.23 / Chapter 2.7.1 --- General Procedures to apply PEEC Modeling Method --- p.23 / Chapter 2.7.2 --- Numerical Results of a LTCC Band Pass Filter Modeling --- p.24 / Chapter 2.8 --- Summary --- p.27 / Chapter Chapter 3 --- GENERALIZED PEEC MODELING FOR PASSIVE COMPONENT OF IRREGULAR SHAPES --- p.29 / Chapter 3.1 --- Introduction --- p.29 / Chapter 3.2 --- Triangular meshing scheme in MoM --- p.30 / Chapter 3.2.1 --- Triangular meshing scheme adopted in MoM --- p.30 / Chapter 3.2.2 --- Spiral Inductor --- p.32 / Chapter 3.3 --- Generalized Meshing Scheme --- p.34 / Chapter 3.4 --- Mathematical Formulation in Enhanced PEEC --- p.39 / Chapter 3.4.1 --- Current and Charge discretization --- p.39 / Chapter 3.4.2 --- Enhanced Formulation for partial mutual inductance and capacitance --- p.41 / Chapter 3.4.3 --- Four-Dimensional Integration --- p.43 / Chapter 3.4.4 --- Gauss Numerical Integration --- p.44 / Chapter 3.4.5 --- Mixed Numerical and Analytical Technique --- p.47 / Chapter 3.5 --- Numerical Results from Enhanced PEEC Modeling Method --- p.50 / Chapter 3.5.1 --- Spiral Inductor --- p.50 / Chapter 3.5.2 --- High Pass Filter --- p.56 / Chapter 3.5.3 --- Design and Optimization of LTCC Diplexer --- p.60 / Chapter 3.6 --- Summary --- p.67 / Chapter Chapter 4 --- HIGH FREQUENCY PEEC --- p.69 / Chapter 4.1 --- Introduction --- p.69 / Chapter 4.2 --- Spatial Domain Green's Functions --- p.70 / Chapter 4.2.1 --- Full-wave Spectral Domain Green´ةs Functions --- p.70 / Chapter 4.2.2 --- Full-wave Spatial Domain Green，s functions --- p.72 / Chapter 4.3 --- Frequency-dependent Complex Partial Elements --- p.74 / Chapter 4.4 --- Numerical Results Of High-Frequency PEEC Modeling Method --- p.79 / Chapter 4.4.1 --- Numerical Discussion of Complex Image Method --- p.75 / Chapter 4.4.2 --- Microstrip Filter --- p.84 / Chapter 4.4.3 --- Patch Antenna --- p.84 / Chapter 4.5 --- Summary --- p.87 / Chapter Chapter 5 --- CONCLUDING REMARKS --- p.88 / Chapter 5.1 --- Two Enhancements in PEEC Modeling --- p.88 / Chapter 5.2 --- Limitations of Enhanced PEEC Modeling --- p.90 / Chapter 5.3 --- Future Work --- p.90 / APPENDIX --- p.92 / REFERENCE --- p.102

by R.M. Redheffer. / "November 24, 1947". / Army Signal Corps Contract No. W-36-039 sc32037.

Originally presented as the author's thesis (Swiss Federal Institute of Technology), Diss. ETH No. 13547. / Summary in German and English. Includes bibliographical references.

No description available.