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Self-validating sensorsYang, Janice Ching-Yi January 1993 (has links)
No description available.
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Computing 3-D Motion in Custom Analog and Digital VLSIDron, Lisa 28 November 1994 (has links)
This thesis examines a complete design framework for a real-time, autonomous system with specialized VLSI hardware for computing 3-D camera motion. In the proposed architecture, the first step is to determine point correspondences between two images. Two processors, a CCD array edge detector and a mixed analog/digital binary block correlator, are proposed for this task. The report is divided into three parts. Part I covers the algorithmic analysis; part II describes the design and test of a 32$\time $32 CCD edge detector fabricated through MOSIS; and part III compares the design of the mixed analog/digital correlator to a fully digital implementation.
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IMPACT OF NETWORKED DATA ACQUISITION SYSTEMS ON TRANSDUCERSEccles, Lee H. 10 1900 (has links)
International Telemetering Conference Proceedings / October 21, 2002 / Town & Country Hotel and Conference Center, San Diego, California / Transducers have traditionally been incorporated into data systems by connecting the transducer to a signal conditioner that is then connected to a multiplexer with an Analog-to-Digital Converter (ADC). The signal conditioning, multiplexer and the ADC are usually included within the same assembly that is called a Data Acquisition Unit (DAU) or an encoder. A network centric data system allows the same architecture to be used if the interface to the encoder is changed to be a network interface. However, a network centric architecture allows other options as well. The signal conditioning and ADC can be included within the same package as the transducer and the assembly can be interfaced to the network. When this is combined with the processing capability now available, a whole new range of possibilities present themselves. The transducer can now be digitally processed to provide a linear output, it can be converted to Engineering Units, digitally filtered or have a host of other functions performed within the housing that contains the transducer. However, the network centric approach does not produce these advantages without some disadvantages. The major problem that needs to be solved is how we time stamp the data. With the encoder we could time stamp the PCM frame and be able to determine the time that a sample was taken from that information. Even in systems that convert the encoder to have a network interface, the time stamp needs to be affixed to the data in the encoder. With a network centric approach, the sample can be taken in the transducer and how to time stamp it becomes a real problem. This is a problem that must be considered at the system level. Some method of making time available at a low enough level in the system to allow transducer outputs to be time stamped is either a network issue or it requires a separate interface.
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A FIBER SENSOR INTEGRATED MONITOR FOR EMBEDDED INSTRUMENTATION SYSTEMSNewman, Jason 10 1900 (has links)
ITC/USA 2006 Conference Proceedings / The Forty-Second Annual International Telemetering Conference and Technical Exhibition / October 23-26, 2006 / Town and Country Resort & Convention Center, San Diego, California / In this paper we will present a new fiber sensor integrated monitor (FSIM) to be used in an embedded instrumentation system (EIS). The proposed system consists of a super luminescent diode (SLD) as a broadband source, a novel high speed tunable MEMS filter with built in photodetector, and an integrated microprocessor for data aggregation, processing, and transmission. As an example, the system has been calibrated with an array of surface relief fiber Bragg gratings (SR-FBG) for high speed, high temperature monitoring. The entire system was built on a single breadboard less than 50 cm² in area.
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APPLYING RULES FOR ISOCHRONOUS SAMPLING WITHIN ACQUISITION CYCLES TO ALL LEVELS OF FTI SYSTEM DEFINITIONFielding, Richard, McNelis, Aaron 10 1900 (has links)
International Telemetering Conference Proceedings / October 21, 2002 / Town & Country Hotel and Conference Center, San Diego, California / This paper examines two rules for data acquisition that have advantages for today's Flight
Test Instrumentation (FTI) systems where:
• Data is acquired from physically separate test equipment
• Deterministic (IRIG-106 (Ch. 4)) and non-deterministic networks co-exist
• Data Acquisition Units (DAUs) from multiple vendors are required
• Signal lists and sampling rates change rapidly
• A time-coherent sampling strategy (even for smart sensors) is required
These rules may aid not only in the selection of the data acquisition equipment but also
the definition of the sampling, transmission, storage and analysis strategies.
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PRESSURE BELT FOR WING LOADS MEASUREMENTEccles, Lee H. 10 1900 (has links)
International Telemetering Conference Proceedings / October 22-25, 2001 / Riviera Hotel and Convention Center, Las Vegas, Nevada / Boeing Commercial Airplanes has used many methods in the past to measure the structural loads on the
wings of its airplanes. The most recent approach is to use arrays of MEMS pressure sensors on the top and
bottom surfaces of the wings. By knowing the difference in pressure between the top and bottom of the
wings the structural loads on the wings can be calculated. It was decided that in order to build an array of
1100 sensors it would be necessary to condition the sensors and convert the analog output to a digital form
at the site of the pressure measurement. This process was taken one step further by converting the output of
the A/D converter into engineering units within the sensor module as well. The array is built using a flex
circuit card in one foot sections that can be interconnected to form an array of up to 125 sensors. There is a
sensor location every two inches on the flex circuit but not all locations are populated. This paper will
describe not only the pressure belt but the lessons learned during the development and the implications that
these lessons have for smart transducers in general.
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A Synergistic Test Flight: Smart Sensors, EQDR and PCM BackfillJones, Charles H., Wigent, Mark, Morgan, Jon, Beech, Russ 10 1900 (has links)
ITC/USA 2014 Conference Proceedings / The Fiftieth Annual International Telemetering Conference and Technical Exhibition / October 20-23, 2014 / Town and Country Resort & Convention Center, San Diego, CA / This is the story of three projects, which use three different research funding sources, coming together to demonstrate a small, but complete, instrumentation system that advances several technologies. The Onboard Smart Sensor (OSS) project is a Small Business Innovation Research (SBIR) project that incorporates IEEE 1451.4 sensors into an existing Common Airborne Instrumentation System (CAIS) based instrumentation system. These sensors are "smart" in that they can self-identify basic information via a Transducer Electronic Data Sheet (TEDS). The Enhanced Query Data Recorder (EQDR) is being developed under the T&E Science & Technology Spectrum Efficient Technology (S&T SET) portfolio. This recorder is based on the integrated Network Enhanced Telemetry (iNET) specifications. One of the objectives of iNET is to be able to query a recorder in real-time and transfer the request across a network telemetry link. The third project provides Pulse Code Modulation (PCM) backfill to compensate for dropouts. One of the envisioned applications enabled by the iNET architecture is the ability to provide PCM displays in the control room that do not have dropouts. This is called PCM Backfill. The basic scenario is that PCM is both transmitted (as it traditionally has been via serial streaming telemetry (SST)) and recorded onboard. When dropouts occur, a request over the telemetry network is made to the recorder (the EQDR in this case) and the dropped portions of the PCM stream are sent over the telemetry network to backfill the ground display. By adding a PCM-to- Ethernet/iNET bridge, the OSS and legacy instrumentation system can provide data to both the standard PCM and to the EQDR. Combined, this mini-system demonstrates a vision of having intelligence and networking ability across the entire instrumentation system – from sensor to display.
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Arquitetura de hardware para monitor de UTI segundo padrão IEEE 1451: uma prova de conceitoPereira, Mário Wilson Paiva 28 July 2017 (has links)
PEREIRA, Mário Wilson Paiva. Arquitetura de hardware para monitor de UTI segundo padrão IEEE 1451: uma prova de conceito. 2017. 125 f. Dissertação (Mestrado em Engenharia de Teleinformática)–Centro de Tecnologia, Universidade Federal do Ceará, Fortaleza, 2017. / Submitted by Renato Vasconcelos (ppgeti@ufc.br) on 2017-11-17T18:30:25Z
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2017_dis_mwppereira.pdf: 12636405 bytes, checksum: 9101596c0294db74704566e056987670 (MD5) / Rejected by Marlene Sousa (mmarlene@ufc.br), reason: Prezado Mário Wilson: Existe uma orientação para que normalizemos as dissertações e teses da UFC, em suas paginas pré-textuais e lista de referencias, pelas regras da ABNT. Por esse motivo, sugerimos consultar o modelo de template, para ajudar nesta tarefa, disponível em: http://www.biblioteca.ufc.br/educacao-de-usuarios/templates/
Vamos agora as correções sempre de acordo com o template:
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9. No sumário os APÊNDICES e ANEXOS não são numerados, do mesmo modo que as REFERÊNCIAS.
10 Na lista de referencias, retire a informação, que está no final de cada obra citada, do numero de vezes que o autor foi citado em seu trabalho.
Quando citar documentos consultados online, colocar autor. título. disponível em: <endereço eletrônico> Acesso em: data (dia, mes e ano). Corrigir em toda a lista.
on 2017-11-20T13:21:38Z (GMT) / Submitted by Renato Vasconcelos (ppgeti@ufc.br) on 2017-11-29T12:30:37Z
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10. Na lista de referencias, o título não fica em caixa alta, apenas a primeira letra e siglas se houver. Ex.
ANAHP. Observatório 2015.
GARCIA, W. L. C. Teds-easy - descricão automática de transducer electronic data sheet
MARCONDES, A. Desenvolvimento de protótipo de gravador de TEDS e de etiqueta eletrônica TEDS
PRIYA, M. et al. Embedded based wireless ICU monitoring system
ROSSI, S. R.; RODRIGUES DA SILVA, A. C.; SANTOS FILHO, T. A. D. IEEE 1451.2- based sensor system with JAVA-TEDS software Tool
TESTER, S. N. C. et al. An IEEE 1451 TEDS compiler and serial network compliance tester.
Att.
Marlene
3366-9620
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Previous issue date: 2017-07-28 / This work presents the development of a hardware architecture for ICU monitors, combining
design stages of embedded systems, biomedical instrumentation, intelligent sensors and
the IEEE 1451 protocol. The method used defines operational requirements, system
decomposition into modules, architecture definition and implementation using commercial
development platforms. The entire process is based on national and international standards
and protocols, seeking to design the system within the constraints of a product and validate
the concept through printed circuit board prototypes. The proposed architecture establishes
a network of intelligent biomedical sensors, called STIM, controlled by a central node, called
NCAP. The use of this architecture provides modular, self-configuring, easy-to-maintain,
plug and play sensors with standardized communication and data interface. The work also
describes the process of creating electronic data sheets of the STIMs, called TEDS, which
contain the operation characteristics of each smart sensor. / Este trabalho apresenta o desenvolvimento de uma arquitetura de hardware para moni-
tores de UTI combinando etapas do projeto de sistemas embarcados, instrumentação
biomédica, sensores inteligentes e o protocolo IEEE 1451. A metodologia empregada
define requisitos operacionais, decomposição do sistema em módulos, definição da
arquitetura e implementação utilizando plataformas de desenvolvimento comerciais.
Todo o processo é baseado em normas e protocolos de órgãos nacionais e internacionais
procurando projetar o sistema dentro das restrições de um produto e validar o conceito
por meio de protótipos em placas de circuito impresso. A arquitetura proposta estabelece
uma rede de sensores biomédicos inteligentes, denominados STIM, controlados por
um elemento cental, denominado NCAP. A utilização desta arquitetura proporciona
sensores modulares, autoconfiguráveis, de fácil manutenção, plug and play, com interface
de comunicação e dados padronizados. O trabalho também descreve o processo de
criação de folhas de dados eletrônicas dos STIMs, denominadas TEDS, que contêm as
características de operação de cada sensor inteligente.
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Sensor Failure Mode Detection and Self-ValidationAbhinav, Abhinav January 2008 (has links)
No description available.
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Accurate thermal sensing with modern CMOS integrated circuits : a thesis presented in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Engineering at Massey University, Auckland, New ZealandFisk, Robert Patrick January 2010 (has links)
Content removed due to copyright Conference Proceedings I R. P. Fisk and S. M. Hasan, “Analysis of Internally-Generated Noise in Bandgap References,” in Proc. Electronics New Zealand Conf., Christchurch, New Zealand, Nov. 2006, pp. 18-23. Conference Proceedings II R. P. Fisk and S. M. Hasan, “Incremental Delta-Sigma Modulators for Temperature Sensing Applications,” in Proc. Int. Conf. Mechatronics and Machine Vision in Practice, Auckland, New Zealand, Dec. 2008, pp. 63-67. Conference Proceedings III R. P. Fisk and S. M. Hasan, “Low-Cost Temperature Sensor on a Modern Submicron CMOS Process,” in Proc. Electronics New Zealand Conf., Otago, New Zealand, 2009, pp. 43-48. / Digital control systems can be found performing a wide range of duties throughout modern society. These systems demand accurate, low cost interfaces to physical parameters of interest, one of the most common being temperature. A ‘smart’ sensor takes advantage of modern integrated circuit technology to create a sensor and analog-to-digital converter on the same silicon chip. Smart temperature sensors are widely available offering simple digital interfaces, high reliability, low power consumption and low cost. The primary weakness of these devices is the low inherent accuracy of on-chip thermal sensors. This thesis presents a smart thermal sensor design that improves upon current technology by employing a modern 0.13μm CMOS process and circuit-level techniques to reduce sensor size and power consumption while increasing digital converter resolution. Data is presented that shows uncalibrated sensor accuracy can be increased by using correlated device characteristics to compensate for random inter-device variation. The research findings guide the construction of future smart thermal sensors with uncalibrated accuracy levels exceeding that of any currently available design.
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