The microstructural, mechanical and thermal properties of various composite solder formulations were investigated. Special interest was given in observing the processing properties, microstructural characteristics, fatigue behavior, tensile strength, and the effect of environmental ageing on the composite solder formulations. The solderability parameters wetting and speed of soldering, reflow temperature, and the thermal stability of the resulting composite solder were also examined.

Thesis (Ph. D.)--State University of New York at Binghamton, Systems Science Dept., 2006. / Includes bibliographical references.

Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1993. / Vita. Abstract. Includes bibliographical references (leaves 66-67). Also available via the Internet.

Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Dept., 2007. / Includes bibliographical references.

none

In this thesis, the response of solder balls under high-speed impact was investigated. Five solder compositions, such as Sn/4.0Ag/0.5Cu,Sn/3.5Ag/0.75Cu,Sn/1.0Ag/1.0Cu, Sn/3.0Ag/0.5Cu and Sn/2.6Ag/0.6Cu with two pad surface finishes and ball impact test system were used to implement four kinds of experiments including different impact speeds, different hammers, different reflow times and different aging time in room temperature after reflow. From experiments, the variations of solder strength and mechanical properties were received and discussed. At the same time, failure modes and variations of solder structure after reflow were observed by using SEM and X-ray EDS. The experimental results show that maximum impact force on solder joints increases with the increasing of impact speed when it reaches a critical value. The impact force of Sn/2.6Ag/0.6Cu with Ni/Au pad finish is the maximum among all the solder compositions at varied impact speeds. Maximum impact force on solder joints will decrease with the increasing of mass of hammer. The strength of solder ball were reduced significantly after reflow, however, it makes no difference for solder strength to reflow twice. It was found that maximum impact force and impact energy of solder joints didn¡¦t change a lot, but the ductility and stiffness of them varied unstably under the condition of room temperature for seven days after reflow.

none

With the development of smaller and higher density surface mount packages like Quad Flat No-lead (QFN) and Ball Grid Array (BGA), solder joints¡¦ strength of the electronic components has a greater impact on the reliability of an end product. Also, the decrease in size of consumer products such as cellular phones, PDAs and MP3 players, has increased the frequency of accidental drops resulting in solder joint cracks and eventually malfunction of the products. With legislation put in place by government and industrial bodies, electronics companies are driven to eliminate the uses of lead in their products. It thus leads to the concern of reliability of lead-free solders as interconnects. The present work aims at studying the effects of drop impact on the strength of solder joint of lead free solder (Sn4Ag0.5Cu) and BGA substrate metal finish electrolytic Ni and Au. In this study, the effects of internal stresses in BGA Ni layer and Pre-treatment Micro-Etching processing on the strength of Sn/Ag/Cu solder joint are investigated. The drop test and peel off test are adopted in testing the strength according to the standard of JEDEC. The drop test results have shown that the compressive internal stresses in the Ni layer have worse effects on the joint strength than tensile internal stresses can affect. The failure modes are analyzed and can be concluded that all failures occur at the interface of IMC and the surface of Ni layer on BGA substrate. The drop test results have shown also that the strength of the solder joint with the lower concentration of SPS in pre-treatment micro-etching is stronger and all the failures occur at the interface of IMC and the surface of PCB Cu Pad. Comparing with the effect of internal stress in Ni layer, SPS concentration in pre-treatment micro-etching to affect the solder joint strength is more significant.

none

For the future development of optical fiber communication needs to develop high optical coupling of the optical transceiver module. We focus on enhancing the optical efficiency of array optical transceiver module, and improve the way is used rotation axis instead of ordinary xyz translation. In the paper the use of solder packaging technology packaging optical transceiver module. And take the characteristics of solder packaging to control the angle, so that module can produce offsets in the radial direction,and original structure packed module can be further increased the rate of coupling efficiency.